Patents by Inventor Yong Liu

Yong Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7829988
    Abstract: Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrically coupled at the exposed portions of their leads.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: November 9, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Yong Liu, Howard Allen, Qiuxiao Qian
  • Publication number: 20100278534
    Abstract: An optical network terminal receives, from a user device associated with the optical network terminal, a call to a called party, and checks a table, which may be locally cached in the optical network terminal, for a network location of another optical network terminal associated with the called party. The device also establishes a connection with another user device associated with the other optical network terminal, based on the network location, and exchanges voice data with the other user device associated with the other optical network terminal via the connection.
    Type: Application
    Filed: December 16, 2009
    Publication date: November 4, 2010
    Applicant: VERIZON PATENT AND LICENSING, INC.
    Inventors: Stevan H. Leiden, Ayaskant Rath, Yong Liu, Shivendra Panwar, Keith Ross
  • Patent number: 7825502
    Abstract: Disclosed are semiconductor die packages having overlapping dice, systems that use such packages, and methods of making such packages. An exemplary die package comprises a leadframe, a first semiconductor die, and a second semiconductor die that has a recessed portion in one of its surfaces. The first die is disposed over a first portion of the leadframe, and the second die is disposed over a second portion of the leadframe with its recess portion overlying at least a portion of the first die. Another exemplary die package comprises a leadframe with a recessed area, a first semiconductor die disposed in the recessed area, and a second semiconductor die overlying at least a portion of the first die. Preferably, electrically conductive regions of both dice are electrically coupled to a conductive region of the leadframe to provide an interconnection between dice that has very low parasitic capacitance and inductance.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: November 2, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Scott Irving, Yong Liu, Qiuxiao Qian
  • Patent number: 7821114
    Abstract: Disclosed in this specification is a multiphase buck converter package and process for forming such package. The package includes at least four dice and several parallel leads. The dice are electrically connected through a plurality of die attach pads, thus eliminating the need for wirebonding.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: October 26, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Yong Liu, Tiburcio A. Maldo, Hua Yang
  • Publication number: 20100265925
    Abstract: A method for beamforming in a communication network includes generating a plurality of beamforming training (BFT) units associated with a beamforming session between a pair of devices, where each of the plurality of BFT units corresponds to a different beamsteering vector, causing a first non-zero subset of the plurality of BFT units to be transmitted during a first timeslot, and causing a second non-zero subset of the plurality of BFT units to be transmitted during a second timeslot, where the first time timeslot and the second timeslot are not contiguous.
    Type: Application
    Filed: April 16, 2010
    Publication date: October 21, 2010
    Inventors: Yong Liu, Hongyuan Zhang, Raja Banerjea
  • Publication number: 20100260093
    Abstract: A method and system for communication between mobile stations in a wireless relay enhanced cellular communication system. One implementation involves providing a communication resource allocation for peer-to-peer (P2P) communication between a pair of mobile stations during a P2P enhanced time frame wherein one mobile station serves a role as a transparent relay station (MRS) and another mobile station serves a role as a peer mobile station in the pair; and delivering resource allocation information comprising communication periods and frequency subcarriers to the pair of mobile stations, for the mobile station pair to conduct P2P communication therebetween in the P2P enhanced time frame.
    Type: Application
    Filed: April 10, 2009
    Publication date: October 14, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong Liu, Chiu Ngo
  • Publication number: 20100260102
    Abstract: A method and system for communication in a wireless enhanced control area network including wireless station nodes is provided. One implementation involves each wireless station node employing a wireless communication protocol for wireless communication of control area network (CAN) messages among the wireless station nodes on a wireless communication medium, wherein each CAN message comprises a content-identified data message or an error message. The wireless communication protocol including a medium access control protocol for controlling access to the wireless communication by the wireless station nodes.
    Type: Application
    Filed: April 10, 2009
    Publication date: October 14, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong Liu, Chiu Ngo
  • Publication number: 20100260113
    Abstract: A method and system for allocating subcarrier frequency resources in a relay enhanced cellular communication system including a base station, multiple relay stations and mobile stations. One implementation involves, for a new relay station joining the relay enhanced cellular communication system, identifying mobile stations that the new relay station can service, and assigning sufficient resources to the new relay station to accommodate minimum data rate requirements of the access links of the identified mobile station. The resources are assigned by adjusting existing resource assignments essentially in an optimal manner while reducing impact on existing stations in the relay enhanced cellular communication system.
    Type: Application
    Filed: April 10, 2009
    Publication date: October 14, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong Liu, Chiu Ngo
  • Publication number: 20100260138
    Abstract: The present disclosure includes systems and techniques relating to wireless local area network devices. Systems and techniques include determining wireless resource allocations in a time domain, a spatial wireless channel domain, and a frequency domain to coordinate communications with wireless communication devices, generating a control frame that directs wireless communications based on at least a portion of the wireless resource allocations, and transmitting the control frame to the wireless communication devices. Determining wireless resource allocations can include determining frequency allocations in the time domain.
    Type: Application
    Filed: April 12, 2010
    Publication date: October 14, 2010
    Inventors: Yong Liu, Raja Banerjea, Hongyuan Zhang, Harish Ramamurthy
  • Patent number: 7812437
    Abstract: A semiconductor package assembly including a molded leadless package (MLP) having an exposed top emitter pad and an exposed bottom source pad. A folded heat sink is attached to the exposed top emitter pad of the MLP by a soft solder attach process. The folded heat sink has a planar member generally coextensive in size with the MLP and in electrical and thermal contact with the top emitter pad of the MLP, and also has one or more leads extending generally perpendicularly to the planar member in a direction towards the lower surface of the MLP. These heat sink leads may provide the emitter connection to a printed circuit (PC) board.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: October 12, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Jonathan A. Noquil, Yong Liu, Jocel Gomezl
  • Patent number: 7806336
    Abstract: A laser beam generation system having an integrated coherence reduction mechanism. The system includes: a flexible circuit having a first end portion and a second end portion; a laser diode mounted on the first end portion of the flexible circuit, for producing a laser beam having a central characteristic wavelength; diode current drive circuitry for producing a diode drive current to drive the laser diode and produce said laser beam; and high frequency modulation (HFM) circuitry also mounted on the first end portion of the flexible circuit, for modulating the diode drive current at a sufficiently high frequency to cause the laser diode to produce a laser beam having a spectral side-band components about the central characteristic wavelength, and thereby reducing the coherence as well as coherence length of the laser beam.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: October 5, 2010
    Assignee: Metrologic Instruments, Inc.
    Inventors: C. Harry Knowles, Xiaoxun Zhu, Timothy Good, Tao Xian, Anatoly Kotlarsky, Michael Veksland, Mark Hernandez, John Gardner, Steven Essinger, Patrick Giordano, Sean Kearney, Mark Schmidt, John A. Furlong, Nicholas Ciarlante, Yong Liu, Jie Ren, Xi Tao, JiBin Liu, Ming Zhuo, Duane Ellis
  • Patent number: 7806335
    Abstract: A digital image capturing and processing system for automatically recognizing objects in a POS environment. The system includes a system housing having an imaging window; illumination and imaging stations for generating and projecting illumination and imaging planes or zones through the imaging window, and into a 3D imaging volume definable relative to the imaging window, for digital imaging an object passing through the 3D imaging volume, and generating digital linear images of the object as the object intersects the illumination and imaging planes or zones during system operation. A digital image processor processes the digital images and automatically recognizes the object, such as produce and fruit, graphically represented by the digital images.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: October 5, 2010
    Assignee: Metrologic Instruments, Inc.
    Inventors: C. Harry Knowles, Xiaoxun Zhu, Timothy Good, Tao Xian, Anatoly Kotlarsky, Michael Veksland, Mark Hernandez, John Gardner, Steven Essinger, Patrick Giordano, Sean Kearney, Mark Schmidt, John A. Furlong, Nicholas Ciarlante, Yong Liu, Jie Ren, Xi Tao, JiBin Liu, Ming Zhuo, Duane Ellis
  • Patent number: 7808101
    Abstract: A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: October 5, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Yong Liu, Yumin Liu, Hua Yang, Tiburcio A. Maldo, Margie T. Rios
  • Publication number: 20100248635
    Abstract: The present disclosure includes systems, apparatuses, and techniques relating to wireless local area network devices. Systems, apparatuses, and techniques include communicating with multiple wireless communication devices to determine characteristics of spatial wireless channels, determining steering matrices based on one or more outputs of the communicating, and transmitting signals that concurrently provide data to the wireless communication devices via different spatial wireless channels. The signals can be spatially steered to the wireless communication devices based on the steering matrices.
    Type: Application
    Filed: March 30, 2010
    Publication date: September 30, 2010
    Inventors: Hongyuan Zhang, Hui-Ling Lou, Rohit U. Nabar, Yong Liu
  • Publication number: 20100241413
    Abstract: A processor with a computer program product embodied thereon for modeling an LDMOS transistor having a drift region is provided. Characteristic behavior of a CMOS transistor with its body coupled to its source is generated, and characteristic behavior of a resistor is generated, where the resistor is coupled to the drain of the CMOS transistor. Then to account for impact ionization, an impact ionization current for electrons in the drift region an impact ionization current for holes in the drift region are calculated.
    Type: Application
    Filed: March 18, 2009
    Publication date: September 23, 2010
    Applicant: Texas Instruments Incorporated
    Inventors: Yong Liu, Keith R. Green, Sameer Pendharkar
  • Publication number: 20100230792
    Abstract: Disclosed are premolded substrates for semiconductor die packages and methods of making such substrates. An exemplary premolded substrate comprises a leadframe having a first surface, a second surface, a central portion disposed between the first and second surfaces, and a plurality of electrically conductive leads disposed about the central portion; a body of electrically insulating material disposed in a portion of the central portion of the leadframe and between the leads of the leadframe; and an aperture disposed in the leadframe's central portion and between the leadframe's first and second surfaces.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 16, 2010
    Inventors: Scott Irving, Yong Liu, Yumin Liu
  • Publication number: 20100232131
    Abstract: An encapsulated buck converter module includes a low side transistor and a control integrated circuit bonded to a first section on a first side of a leadframe, a first clip between a source of the low side transistor and a second section, a source contact of a high side transistor attached to the first section on a second side of the leadframe with a gate contact of the high side transistor attached to a third section, a conductive member attached to the first and second sections on the second side of the leadframe wherein the first side of the conductive member attached to the second conductive member forms a conductive path with a portion of a second side of the conductive member while any portion of the first side of the conductive member attached to the first component attachment section is insulated from the first side of the conductive member, a first plate of a capacitor attached to a drain contact of the high side transistor and a second plate of the capacitor attached to the second side of the conduc
    Type: Application
    Filed: March 16, 2009
    Publication date: September 16, 2010
    Inventors: Qiuxiao Qian, Yong Liu
  • Patent number: 7793841
    Abstract: A laser illumination beam generation system including a laser diode (LD) for producing a laser beam in response to a diode current supplied thereto, wherein the laser beam has a central characteristic wavelength. Diode current drive circuitry generates the diode current and supplies the same to the VLD. A high frequency modulation (HFM) circuitry modulates the diode current supplied to the laser diode, so as to produce a spectral side-band components about the central characteristic wavelength, and thereby reduces the coherence of the laser illumination beam as well as its coherence length. An optical multiplexing (OMUX) device receives the laser beam as an input beam and generates multiple laser beams therefrom and recombines the multiple laser beams so as to produce a composite output laser illumination beam having reduce coherence.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: September 14, 2010
    Assignee: Metrologic Instruments, Inc.
    Inventors: C. Harry Knowles, Xiaoxun Zhu, Timothy Good, Tao Xian, Anatoly Kotlarsky, Michael Veksland, Mark Hernandez, John Gardner, Steven Essinger, Patrick Giordano, Sean Kearney, Mark Schmidt, John A. Furlong, Nicholas Ciarlante, Yong Liu, Jie Ren, Xi Tao, JiBin Liu, Ming Zhuo, Duane Ellis
  • Patent number: 7793253
    Abstract: A method for determining a mask pattern to be used on a photo-mask in a photolithographic process is described. During the method, a target pattern that includes at least one continuous feature is provided. Then a mask pattern that includes a plurality of distinct types of regions corresponding to the distinct types of regions of the photo-mask is determined. Note that the mask pattern includes at least two separate features corresponding to at least the one continuous feature. Furthermore, at least the two separate features are separated by a spacing having a length and the spacing overlaps at least a portion of at least the one continuous feature.
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: September 7, 2010
    Assignee: Luminescent Technologies, Inc.
    Inventors: Daniel S. Abrams, Danping Peng, Yong Liu, Paul Rissman
  • Patent number: 7791084
    Abstract: A die package is disclosed. The die package includes a substrate, a first device attached to the substrate, and a leadframe structure attached to the substrate. The leadframe structure includes a portion disposed over the first device, and a second device is attached to the first portion of the leadframe structure.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: September 7, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Yong Liu, Yumin Liu