Abstract: Semiconductor die packages, methods of making said packages, and systems using said packages are disclosed. An exemplary package comprises at least one semiconductor die disposed on one surface of a leadframe and electrically coupled to at least one conductive region of the leadframe, and at least one passive electrical component disposed on the other surface of a leadframe and electrically coupled to at least one conductive region of the leadframe. Molding material is disposed over the at least one passive electrical component to provide a molded passive component.

Abstract: Disclosed are semiconductor die packages comprising flexible modules having passive components, with the flexible modules and one or more semiconductor dice disposed in a stacked relationship, systems using the same, and methods of making the same. In one exemplary package embodiment, one or more semiconductor dice are disposed on a leadframe that is disposed in a stacked relationship with the flexible module. In another embodiment, one or more semiconductor dice are attached to a surface of a flexible module.

Abstract: A semiconductor die package. Embodiments of the package can include a substrate with solid conductive pins disposed throughout. A semiconductor die can be attached to a surface of the substrate. Electrical connection to the semiconductor die can be provided by the solid conductive pins.

Abstract: A molded, leadless packaged semiconductor multichip module includes 100 has four mosfets 10, 12, 14, 16 for a full bridge circuit. The mosfets may include two N-channel and two P-channel devices or four mosfets of the same type, but four N-channel are preferred. In module 100 there are two leadframes 30, 40 for assembling the mosfets. In particular, the two N-channel and two P-channel devices are disposed between two leadframes and encapsulated in an electrically insulating molding compound 84. The resulting package has four upper heat sinks 44.1-44.4 that are exposed in the molding compound 84 for transferring heat from the mosfets to the ambient environment. No wire bonds are required. This can significantly reduce the on resistance, RDSON. The top or source-drain lead frame 30 may be soldered to the sources and gates of the bridge mosfets.

Abstract: A hand-supportable digital-imaging based system for reading bar code symbols involving: automatically detecting the presence of an object within a field of view FOV of the system, and in response thereto, automatically generating an image cropping zone (ICZ) framing pattern and projecting the ICZ framing pattern within the FOV and onto the detected object; visually aligning the code symbol on the detected object, within the ICZ framing pattern; manually actuating a trigger switch when the code symbol on the object is located within the ICZ framing pattern, and while the ICZ framing pattern and a field of illumination are being simultaneously projected onto the object during object illumination operations, forming and capturing a digital image of the code symbol on the detected object; automatically cropping the image pixels contained within the spatial boundaries of the ICZ framing pattern, from the pixels of the digital image; and decode processing the cropped image so as to read one or more 1D and/or 2D cod

Abstract: Gimbal system angle compensation methods and systems are provided. A particular method includes pointing an antenna at a first target using an initial set of at least four gimbal angles and determining first bore sight pointing errors resulting from a pointing direction of the antenna relative to the first target. The method also includes estimating values of a plurality of independently observable error variables based on the first bore sight pointing errors. The method further includes determining a set of gimbal angle corrections based on the values of the plurality of independently observable error variables.

Abstract: Embodiments of a method for determining a mask pattern to be used on a photo-mask in a lithography process are described. This method may be performed by a computer system. During operation, this computer system receives at least a portion of a first mask pattern including first regions that violate pre-determined rules associated with the photo-mask. Next, the computer system determines a second mask pattern based on at least the portion of the first mask pattern, where the second mask pattern includes second regions that are estimated to comply with the pre-determined rules. Note that the second regions correspond to the first regions, and the second mask pattern is determined using a different technique than that used to determine the first mask pattern.

Abstract: A semiconductor die package. The semiconductor includes a premolded substrate. The premolded substrate includes (i) a leadframe structure, (ii) a first semiconductor die comprising a first die surface and a second die surface, attached to the leadframe structure, and (iii) a molding material covering at least a portion of the leadframe structure and the first semiconductor die. The premolded substrate includes a first premolded substrate surface and a second premolded substrate surface. A second semiconductor die is stacked on the second premolded substrate surface of the premolded substrate. A housing material is on at least a portion of the second semiconductor die and the second premolded substrate surface of the premolded substrate. One of the first semiconductor die and the second semiconductor die includes a transistor while the other includes an integrated circuit.

Abstract: A method of illuminating objects using adaptively controlled mixing of spectral illumination energy to form and detect digital images of objects at a POS. The method comprises providing, at a POS environment, a digital image capture and processing system having a system housing with an imaging window, and an area-type illumination and imaging station disposed within said system housing, for projecting a coextensive area-type illumination and imaging field (i.e. zone) through said imaging window into a 3D imaging volume during object illumination and imaging operations. As the object is moved through the 3D imaging volume, its motion is automatically detected, and signals indicative of said detected object motion are generated. In response to the generated signals, a first field of visible illumination is produced from an array of visible LEDs, simultaneously with a second field of invisible illumination from a array of infrared (IR) LEDs.

Abstract: A digital-imaging based code symbol reading system comprising an image sensing array with a field of view (FOV), an illumination subsystem with an LED illumination array, an automatic illumination measurement subsystem, an illumination control subsystem, and programmed imager processor supporting an image-processing based illumination metering program. The automatic illumination measurement subsystem, employing a photodetector operating independently from the image sensing array, is used to automatically measure the illumination level at a particular region of the FOV and determine the illumination duration necessary to achieve a desired spatial intensity in the detected digital image.

Abstract: A method of reading bar code symbols using a digital-imaging based code symbol reading system employing an event-driven multi-tier modular software architecture and supporting automatic operating system login and loading of a bar code symbol reading application.

Abstract: Semiconductor die packages, methods of making said packages, and systems using said packages are disclosed. An exemplary package comprising at least one semiconductor die disposed on one surface of a leadframe and electrically coupled to at least one conductive region of the leadframe, and at least one passive electrical component disposed on the other surface of a leadframe and electrically coupled to at least one conductive region of the leadframe.

Abstract: An exemplary semiconductor die package is disclosed having one or more semiconductor dice disposed on a first substrate, one or more packaged electrical components disposed on a second substrate that is electrical coupled to the first substrate, and an electrically insulating material disposed over portions of the substrates. The first substrate may hold power-handling devices and may be specially constructed to dissipation heat and to facilitate fast and inexpensive manufacturing. The second substrate may hold packaged components of control circuitry for the power-handling devices, and may be specially constructed to enable fast and inexpensive wiring design and fast and inexpensive component assembly. The first substrate may be used with different designs of the second substrate.

Abstract: An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays. The apparatus includes a prober assembly that is movable relative to the large area substrate and may be configured to test various patterns of displays and contact points. The prober assembly is also configured to test fractional sections of the large area substrate. The apparatus also includes a test chamber configured to store at least two prober assemblies within an interior volume.

Abstract: A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.

Abstract: A method and mobile electronic device are provided that display, for a user, a packet switched congestion status of a wireless communication network that is useful for estimating a network quality of service. The method includes transmitting a packet switched congestion status inquiry message from the mobile electronic device to a first network element in the wireless communication network. A reply message received from the first network element in response to the packet switched congestion status inquiry message is then processed. The reply message includes transmission delay information obtained from a device transmission delay between the first network element and the mobile electronic device and a network transmission delay between the first network element and at least one packet switched support node. The packet switched congestion status is then determined based on the transmission delay information. Finally, the packet switched congestion status is displayed on the mobile electronic device.

Abstract: A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.

Abstract: A semiconductor die package. The semiconductor die package includes a leadframe structure comprising a first die attach pad, and a second die attach pad laterally spaced from the first die attach pad, a first side and a second side opposite to the first side. The semiconductor die package further includes a first semiconductor die attached the first die attach pad at the first side of the leadframe structure, and a second semiconductor die attached to the second die attach pad at the second side of the leadframe structure. The semiconductor die package further includes a housing material covering at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die.

Abstract: A digital-imaging based code symbol reading system having a hands-on mode operation and a hands-free presentation mode of operation, and supporting automatic programming of system parameters for automatic configuration of the system in hands-on and hands-free modes of operation. The system comprises: an image formation and detection subsystem; an illumination subsystem; a digital image processing subsystem; a system control subsystem for managing system parameters, and controlling and/or coordinating operations of the system; and a configuration detection mechanism. The image formation and detection subsystem has the area-type image sensing array for detecting digital images of objects formed thereon by image formation optics providing a field of view (FOV) for the system.

Abstract: A digital image capturing and processing system including an image formation and detection (IFD) subsystem having a linear image sensing array and optics providing a field of view (FOV) on the linear image sensing array. A spectral-mixing based illumination subsystem produces a first field of visible laser illumination produced from an array of visible VLDs, and a second field of invisible laser illumination produced from an array of IR laser diodes (LDs) that spatially overlap and intermix with each other so as to produce a composite planar laser illumination beam which is substantially with the FOV of the linear image sensing array. An illumination control subsystem controls the spectral mixing of visible and invisible laser illumination produced from the spectral-mixing based illumination subsystem, by adaptively controlling the relative power ratio (VIS/IR) of said fields of visible and invisible laser illumination.