Abstract: Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

Abstract: The present invention relates to a pharmaceutical composition for the treatment of metabolic bone disease and the method of preparation thereof, and more particularly, to an improved pharmaceutical composition for the therapeutic treatment of metabolic disease and the method of preparation thereof, wherein said composition is prepared as a composite pharmaceutical agent which comprises calcitriol; which reduces the rate of spine fractures and increases bone density; alendronate, a bone resorption inhibitor, as two main active ingredients in an optimal mixing ratio to exert the greatest synergistic therapeutic effect; and adequate amount of other additives such as a resorption fortifier of alendronate.

Abstract: A stacked chip package includes a substrate having an upper surface and a lower surface, a first semiconductor chip having an upper surface and a lower surface, wherein the lower surface of the first semiconductor chip is attached to the upper surface of the substrate and the upper surface of the first semiconductor chip includes a plurality of first electrode pads, and a second semiconductor chip having an upper surface and a lower surface. The lower surface of the second semiconductor chip is attached to the upper surface of the first semiconductor chip, and the lower surface of the second semiconductor chip includes trenches that correspond to the locations of the first electrode pads on the upper surface of the first semiconductor chip.

Abstract: A semiconductor package comprises a board, a plurality of solder bump pads, a plurality of board pads, a plurality of distribution patterns, a plurality of contact pads, at least one chip, a plurality of bonding wire, an encapsulation part and a plurality of solder bumps. In order to reduce the height of the loop of the bonding wires for connecting the bonding pad on the semiconductor chip to the board pads on the board, the ends of the bonding wires are connected to the bonding pads and board pads respectively by wedge bonding. Thus, a very thin package can be obtained. In addition, a thin package stack can be obtained by stacking the very thin packages.

Abstract: A method of load reduction on buried culvert using an EPS block is disclosed. A culvert foundation is constructed at a place where a culvert will be buried, and the culvert is put on the foundation, and then, both sides of the culvert are banked with filling earth. EPS blocks are paved in multiple layers on the top surface of the culvert, or geosynthetics and an ESP block are paved on the culvert, and then, filling earth is banked on the geosynthetics or the ESP block and a final ground level is compacted. As a result, compression occurs from the EPS block, deformation of the inside earth is caused artificially, and arching is generated. Accordingly, the method has vertical earth pressure reduction effect, thereby preventing an increase in the section of the culvert due to overburden of the banked earth and an increase in vertical load due to a settlement amount of the culvert buried on the weak ground and a relative settlement difference of surrounding earth, and improving durability of the buried culvert.

Abstract: A solder bump structure includes a contact pad, an intermediate layer located over the contact pad, a solder bump located over the intermediate layer, and at least one metal projection extending upwardly from a surface of the intermediate layer and embedded within the solder bump. Any crack in the solder bump will tend to propagate horizontally through the bump material, and in this case, the metal projections act as obstacles to crack propagation. These obstacles have the effect of increasing the crack resistance, and further lengthen the propagation path of any crack as it travels through the solder bump material, thus decreasing the likelihood device failure.

Abstract: A method for transmitting an extensible markup language (XML)-based electronic program guide (EPG) template for a user-preference program guide and a reception device thereof, are provided. The transmission method includes a cable network company converting an XML-based EPG into an XML-based EPG template for a user-preference program guide, transmitting the converted result to a reception device, and providing the reception device with a style format related to the XML-based EPG template document through an extensible style sheet language (XSL)-based document. The reception device stores and analyzes the XSL document related to the XML-based EPG template document.

Abstract: A semiconductor package comprises a board, a plurality of solder bump pads, a plurality of board pads, a plurality of distribution patterns, a plurality of contact pads, at least one chip, a plurality of bonding wire, an encapsulation part and a plurality of solder bumps. In order to reduce the height of the loop of the bonding wires for connecting the bonding pad on the semiconductor chip to the board pads on the board, the ends of the bonding wires are connected to the bonding pads and board pads respectively by wedge bonding. Thus, a very thin package can be obtained. In addition, a thin package stack can be obtained by stacking the very thin packages.

Abstract: A wireless receiver for receiving a multi-contents file and a method for outputting data using the same, which can receive, navigation information for providing intuitively recognizable search interfaces to a user by radio in real time, receive various types of contents files by radio in real time, and output the received information and files through an AV device. A video decoder decodes a video stream on the basis of an MPEG standard. An audio decoder decodes an audio contents file. An OSD processor processes a text file and additional information. A video output unit selectively configures decoded video data and text data on one screen and performs encoding and outputting operations based on the format of a display unit. An audio output unit outputs decoded audio data. A user interface receives a user's command. A WLAN card communicates WLAN data with a computer system.

Abstract: A method of load reduction on buried culvert using an EPS block is disclosed. A culvert foundation is constructed at a place where a culvert will be buried, and the culvert is put on the foundation, and then, both sides of the culvert are banked with filling earth. EPS blocks are paved in multiple layers on the top surface of the culvert, or geosynthetics and an ESP block are paved on the culvert, and then, filling earth is banked on the geosynthetics or the ESP block and a final ground level is compacted. As a result, compression occurs from the EPS block, deformation of the inside earth is caused artificially, and arching is generated. Accordingly, the method has vertical earth pressure reduction effect, thereby preventing an increase in the section of the culvert due to overburden of the banked earth and an increase in vertical load due to a settlement amount of the culvert buried on the weak ground and a relative settlement difference of surrounding earth, and improving durability of the buried culvert.

Abstract: In one embodiment, a memory card comprises a card substrate, at least one memory chip attached to the card substrate, a control chip mounted on the memory chip, bonding wires electrically connecting the chips with the card substrate, a passive device attached to the card substrate near the memory chip, and a molded body encapsulating the memory chip, the control chip, the bonding wires and the passive device. In addition, the memory card comprises an adhesive spacer interposed between the same-sized chips to secure a wire loop of the bonding wires.

Abstract: Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): wherein R is a hydrogen atom, a hydroxyl group or a lower alkyl group having 1 to 4 carbon atoms, and m and k are numbers selected such that m/k is in the range from about 1/0.001 to about 1/0.1, and such that that the polymer (I) has a weight average molecular weight of about 3,000 to about 600,000.

Abstract: A stacked chip package includes a substrate having an upper surface and a lower surface, a first semiconductor chip having an upper surface and a lower surface, wherein the lower surface of the first semiconductor chip is attached to the upper surface of the substrate and the upper surface of the first semiconductor chip includes a plurality of first electrode pads, and a second semiconductor chip having an upper surface and a lower surface. The lower surface of the second semiconductor chip is attached to the upper surface of the first semiconductor chip, and the lower surface of the second semiconductor chip includes trenches that correspond to the locations of the first electrode pads on the upper surface of the first semiconductor chip.

Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): 1

Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): wherein R is a hydrogen atom, a hydroxyl group or a lower alkyl group having 1 to 4 carbon atoms, and m and k are numbers selected such that m/k is in the range from about 1/0.001 to about 1/0.1, and such that that the polymer (I) has a weight average molecular weight of about 3,000 to about 600,000.

Abstract: An ultra-thin semiconductor package includes a lead frame having a die pad and a plurality of leads surrounding the die pad. The die pad includes a chip attaching part to which a semiconductor chip is attached and a peripheral part integral with and surrounding the chip attaching part. The thickness of the chip attaching part is smaller than the thickness of the leads. The package device further includes bonding wires electrically connecting the chip to the leads, and a package body for encapsulating the semiconductor chip, bonding wires, die pad, and inner portions of the leads. A first thickness of the die pad is preferably between about 30-50% of a second thickness of the leads. An overall thickness of the package device is preferably equal to or less than 0.7 mm.

Abstract: A semiconductor package using a tape circuit board with a groove for preventing an encapsulant from overflowing and a manufacturing method for this package are disclosed. The semiconductor package comprises a semiconductor chip with a plurality of electrode pads formed on an active surface thereof; a tape circuit board including an insulating tape with a window formed in a center thereof; circuit patterns formed on an upper surface of the insulating tape, the circuit patterns having a plurality of board pads adjacent the window and a plurality of conductive ball pads connected to the board pads; and a protection layer overlying the upper surface of the insulating tape, leaving the board pads and the conductive ball pads uncovered. The active surface of the chip is attached to a lower surface of the insulating tape and the electrode pads are exposed through the window and electrically connected to board pads.

Abstract: A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

Abstract: The invention herein relates to a pharmaceutical composition comprising ticlopidine and Ginkgo biloba extract. In detail, as an anti-thrombotic preparation, the pharmaceutical composition comprising said ticlopidine and Ginkgo biloba extract with the PAF-antagonistic and anti-oxidant actions is used in combination to naturally suppress the neutropenia and agranulocytosis caused by the toxicity resulting from the repeated use of ticlopidine alone.