Abstract: A wafer level stack structure, including a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input/output (I/O) pads, a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I/O pads, wherein the at least one second device chip is increased to the first chip size, wherein the first wafer and the second wafer are stacked, and wherein the first wafer and the second wafer are coupled to each other.

Abstract: An apparatus is provided including an air diffuser, a filter, a cover, a fan, and a shade in which the fan is located. The air diffuser may be surrounded by the filter except for a bottom opening in the air diffuser. The cover may surround the filter and the air diffuser except for a bottom opening in the filter and the bottom opening in the air diffuser. The air diffuser and the cover may be attached to the shade. The shade may have a bottom opening. The fan may cause air to flow into the shade through the bottom opening of the shade, then through the bottom opening of the air diffuser, the filter, and a first opening of the cover, then out a set of a plurality of openings in a side of the air diffuser, then through the filter, and then out a set of a plurality of openings in the cover.

Abstract: The present invention relates to an inclusion complex containing a benzimidazole derivative with excellent storage stability and a method of its preparation. In particular, the present invention relates to an inclusion complex containing a benzimidazole derivative with improved storage stability and a method of its preparation, where an inclusion complex is manufactured by performing an inclusion reaction by combining a benzimidazole derivative, cyclodextrin and a water-soluble polymer in an aqueous alkali solution in order to be formulated after stabilizing an acid-unstable benzimidazole derivative.

Abstract: Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film. each of the solder bumps including a bar portion and a ball portion disposed at an end of the bar portion. The semiconductor chip including the three-dimensional structured solder bumps is bonded to a solder layer on a printed circuit board to complete a flip-chip package. According to the present invention, by employing the three-dimensional structured solder bumps, it is possible to lower the height of the solder bumps, thereby improving the reliability of an ultra thin flip-chip package.

Abstract: An ultra-thin semiconductor package includes a lead frame having a die pad and a plurality of leads surrounding the die pad. The die pad includes a chip attaching part to which a semiconductor chip is attached and a peripheral part integral with and surrounding the chip attaching part. The thickness of the chip attaching part is smaller than the thickness of the leads. The package device further includes bonding wires electrically connecting the chip to the leads, and a package body for encapsulating the semiconductor chip, bonding wires, die pad, and inner portions of the leads. A first thickness of the die pad is preferably between about 30-50% of a second thickness of the leads. An overall thickness of the package device is preferably equal to or less than 0.7 mm.

Abstract: A wafer level stack structure, including a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input/output (I/O) pads, a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I/O pads, wherein the at least one second device chip is increased to the first chip size, wherein the first wafer and the second wafer are stacked, and wherein the first wafer and the second wafer are coupled to each other.

Abstract: A semiconductor package with improved solder joint reliability, and a method of fabricating the same are provided. The semiconductor package comprises a printed circuit board (PCB) having a plurality of interconnection layers formed on its surface, and having a plurality of through holes connected to the interconnection layers. An adhesive member is attached to an upper surface of the PCB, and a semiconductor chip is electrically connected to the interconnection layers and mounted on an upper surface of the adhesive member. A solder connecting part fills each through hole so as to form a mechanically strong connection that is resistant to breakage during thermal transients and physical impacts.

Abstract: An inductor apparatus including an inductor having a core formed in a loop shape to form a hollow part, and a coil winding the core, and a supporting member having a supporting surface to support the core to face the hollow part, and a vibration preventing hole formed to correspond to the hollow part of the core.

Abstract: An electric cooker having a composite heat source comprising: an external case having an air inlet and an air outlet; a cooking plate on an upper surface of the external case to be a top plate; a heat generating unit including a work coil and/or an electric heater, mounted between the external case and the cooking plate for coaxial arrangement with the air inlet; and a heat radiation unit including a fan motor and air ducts, coaxially arranged between the air inlet and the heat generating unit, such that sufficient cooling effect can be achieved even with a small-sized blow fan of a small capacity. The manufacturing cost can be reduced, and an effective utilization of space for parts arrangement can be enhanced using the relatively small capacity of blowing fan, enabling to manufacture an electric cooker in a thin, light, simple and compact manner.

Abstract: A heater unit comprises: a hot wire heating unit; an induction heating unit provided adjacent to the hot wire heating unit and operated by induction heating; and connectors each for connecting the hot wire heating unit to the induction heating unit. A cooker comprises: a casing; a heating plate provided on an upper surface of the casing; a hot wire heating unit provided on a bottom surface of the heating plate for generating heat according to application of an electric power; an induction heating unit provided on the bottom surface of the heating plate for being adjacent to the hot wire heating unit and operated by induction heating; connectors each for connecting the hot wire heating unit to the induction heating unit; and support members each provided on the bottom surface of the hot wire heating unit and for supporting the hot wire heating unit.

Abstract: A wafer level stack structure, including a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input/output (I/O) pads, a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I/O pads, wherein the at least one second device chip is increased to the first chip size, wherein the first wafer and the second wafer are stacked, and wherein the first wafer and the second wafer are coupled to each other.

Abstract: Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film, each of the solder bumps including a bar portion and a ball portion disposed at an end of the bar portion. The semiconductor chip including the three-dimensional structured solder bumps is bonded to a solder layer on a printed circuit board to complete a flip-chip package. According to the present invention, by employing the three-dimensional structured solder bumps, it is possible to lower the height of the solder bumps, thereby improving the reliability of an ultra thin flip-chip package.

Abstract: A semiconductor package may include a semiconductor chip and a substrate. The substrate may include a plurality of bonding pads for interfacing the semiconductor chip with a printed circuit board through conductive bumps that may be electrically connected to the bonding pads, respectively. The bonding pads may include non-solder mask defined (NSMD) bonding pads and solder mask defined (SMD) bonding pads that may be alternately arranged on the substrate. The SMD bonding pads may have sufficient reliability with respect to a drop test and the NSMD bonding pads may have sufficient reliability with respect to the board-level temperature cycle.

Abstract: A cooling fan assembly includes a cooling fan unit having a rotating shaft and a plurality of rotating vanes combined with the rotating shaft, and a flow control unit provided in a front of a ventilation direction of the cooling fan unit to control a flow of air to reproduce a rotational directional flow component and to reduce a resistance of the flow of the air in a central portion thereof.

Abstract: An apparatus for outputting received broadcast signals may include a tuner unit that receives broadcast signals through at least one tuner, a distribution unit that distributes the received broadcast signals according to broadcasting systems, a control unit that extracts at least one of video signals, audio signals and data signals from broadcasting system-dependent broadcast signals distributed by the distribution unit in accordance with a user's instruction, and an output unit that outputs the extracted signals.

Abstract: A fan assembly includes a fan, a supporting case to support at least a part of the fan along a circumferential direction of the fan, and a vibration-proof member having at least one opening passing through a side thereof and interposed between the fan and the supporting case, to prevent noise from being generated from the fan. The fan assembly can efficiently prevent or dampen vibration generated by the fan and reduce noise.

Abstract: A broadcast signal receiving device includes a profile management module that manages user profile information indicating whether to execute a data broadcasting application received via a channel, an application filtering module that filters data composing a data broadcasting application from data signals of broadcast signals, and an application management module that executes a data broadcasting application composed of the filtered data and according to the user profile information

Abstract: An image projecting apparatus includes a housing in which at least one vibration generating component is disposed, a vibration-proof supporting bracket coupled to a side of the housing to support the housing against an installation surface to absorb vibrations generated by the at least one vibration generating component, and a vibration guide part to couple the vibration-proof supporting bracket with the housing at a position that corresponds to the at least one vibration generating component, thereby transferring the vibrations generated by the at least one vibration generating component to the vibration-proof supporting bracket. Thus, the image projecting apparatus has a simplified structure which effectively reduces vibration noise of vibration generating components disposed therein.

Abstract: An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.