Abstract: A water-soluble polymeric adhesion promoter is represented by the following formula (I): 1

Abstract: A method for manufacturing a chip scale package (CSP) including a semiconductor chip and conductive bumps is disclosed. In the present invention, a flexible substrate is provided with a conductive pattern formed thereon. The substrate has a top surface and a bottom surface. Then, a first photosensitive resin pattern is formed over the top surface of the substrate. Next, the first photosensitive resin pattern is cured. Subsequently, a second photosensitive resin pattern is formed over the cured first photosensitive resin pattern. The second photosensitive resin pattern includes a slit comprising a bottom of the first photosensitive resin pattern and side walls of the second photosensitive resin pattern. With the present invention, the problem of burning of neighboring patterns as well as the problem of the overflow of the encapsulant can be overcome.

Abstract: An apparatus for allocating an E1 channel between an MSC (mobile switching center) and an IWF (interworking function) unit in a CDMA system includes a channel buffer for receiving and storing call processing data; a transmission SI RAM for storing E1 channel allocation information; a reception SI RAM for storing the E1 channel allocation information; a CPM for reading out the call processing data that are stored in the channel buffer, storing received call processing data in the channel buffer, determining which ones of high speed calls and low speed calls are more included in a plurality of call types in process currently and modifying the E1 channel allocation information stored in each of the transmission SI RAM and the reception SI RAM; a multi channel controlling unit for reading out the E1 channel allocation information stored in each of the transmission SI RAM and the reception SI RAM and allocating a super channel including 5 channels or a super channel including 10 channels to the E1 channel; and a s

Abstract: The connections device of an actuator for side mirrors of an automobile, for a back observation, is constructed by forming its main body made of synthetic resin material to reduce weight of an actuator itself and curtail a manufacture cost, and by inserting metal support plates into both sides of the main body inside so as to support and rotate the gear in a part having a danger of a damage caused owing to rotating components such as a gear etc. to prevent the main body from being damaged, whereby resulting in a light weight of the actuator and lessening a manufacture cost through a use of the main body made of the synthetic resin material, and in lengthening a life of components together with a maintenance of a mechanical strength through a use of the support plates made of metal inserted into both sides of the main body inside.

Abstract: A lead-on-chip semiconductor device package is formed by attaching a lead frame having a single adhesive layer to a semiconductor chip. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive having a certain viscosity. The adhesive material is continuously applied to spaces between adjacent inner leads as well as the top surface of the leads and then cured. The leads are disposed at the same intervals and include some side leads with a larger width in order to form the adhesive layer with a uniform thickness. Thermoplastic resins are preferably used as the adhesive, but thermosetting resins may be used as well. In the case of thermoplastic resins, the temperature of a cure step is about 200.degree. C. and that of chip attachment step is about 400.degree. C.