Abstract: A method for continuously preparing stable-type vitamin A microcapsules is disclosed. The method comprises the following steps: adding vitamin A crystals and an antioxidant into a crystal melter continuously according to a certain ratio under the protection of nitrogen to prepare vitamin A melting oil containing the antioxidant; pumping the above melting oil into a high gravity rotary packed bed emulsifier with a liquid distributor by a pump, and pumping aqueous solution containing gellable modified starch into the above high gravity rotary packed bed emulsifier after deoxidation treatment to obtain vitamin A emulsion at the outlet of the high gravity rotary packed bed emulsifier; and atomizing and spraying the emulsion continuously in a cooled starch bed for granulating, and performing fluidization drying and gelation treatment in a fluidized bed by taking nitrogen as a drying medium to obtain the stable-type vitamin A microcapsules.

Abstract: Techniques described herein generally relate to optimizing energy consumption in a computer system. In some examples an energy usage benchmark can be determined for a system component of the computer system by measuring performance levels and energy usages of the system component under a range of energy settings and utilization rates of the system component. A utilization rate of the system component can be determined based on prediction factors including the execution of a first set of instructions on the computer system. The system component can be configured to execute a second set of instructions after the first set of instructions by selecting an energy setting from the range of energy settings for operating the system component. The energy setting can be selected based on the energy usage benchmark and the determined utilization rate.

Abstract: A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.

Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive lead frame having first and second end portions and a first attachment surface and a second attachment surface. The die electrically contacts the first end portion of the lead frame on the first attachment surface. An externally exposed housing encloses the semiconductor die and the first end portion of the lead frame, said housing including a metallic plate facing the second attachment surface of the lead frame.

Abstract: A movement of an elevator cage is detected by an elevator control on the basis of signals of a rotary encoder, coupled with a rotational movement of the drive motor or the drive pulley. Before movement of the cage begins, a movement plot in the form of a trip/speed profile is calculated for travel of the elevator cage from an instantaneous elevator cage position to a destination stopping point position. An anticipated slip between the drive pulley and a support means is included in the calculation of the trip/speed profile, and during the travel of the elevator cage a rotational movement of the drive motor and thus of the drive pulley is controlled by the elevator control in dependence on the calculated trip/speed profile and on signals of the rotary encoder.

Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.

Abstract: A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.

Abstract: A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.

Abstract: A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.

Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive lead frame having first and second end portions and a first attachment surface and a second attachment surface. The die electrically contacts the first end portion of the lead frame on the first attachment surface. An externally exposed housing encloses the semiconductor die and the first end portion of the lead frame, said housing including a metallic plate facing the second attachment surface of the lead frame.

Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.

Abstract: This invention provides compounds of formula I: wherein a, b, c, d, m, n, p, r, R1, R2, R3, R4, R5, R6, R7, and W are as defined in the specification. The compounds of formula I are muscarinic receptor antagonists. The invention also provides pharmaceutical compositions containing such compounds, processes and intermediates for preparing such compounds and methods of using such compounds to treat pulmonary disorders.