Patents by Inventor Yong Sung Eom

Yong Sung Eom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240021570
    Abstract: Provided is a bonding apparatus. The bonding apparatus includes a stage configured to accommodate a substrate, a laser light source configured to provide laser light to devices on the substrate, and a bonding plate provided between the laser light source and the stage and configured to provide the devices on the substrate. The bonding plate includes a transparent substrate; a transparent layer below the transparent substrate; an device adhesion layer below the transparent layer and a reflective pattern provided above or below the transparent substrate and the transparent layer.
    Type: Application
    Filed: July 5, 2023
    Publication date: January 18, 2024
    Inventors: Jiho JOO, Yong Sung EOM, CHANMI LEE, Ki Seok JANG, GWANG-MUN CHOI, KWANG-SEONG CHOI, Jin Hyuk OH
  • Publication number: 20230391956
    Abstract: Provided is an organic-inorganic compound including a first structural body and a curable reactive group, wherein the first structural body may have a structure in which silane and isohexide are chemically bonded through a silyl ether bond.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 7, 2023
    Inventors: GWANG-MUN CHOI, Yong Sung EOM, Jiho JOO, KWANG-SEONG CHOI, Seok-Hwan MOON, Jin Hyuk OH, Ho-Gyeong YUN, CHANMI LEE, Ki Seok JANG
  • Publication number: 20230326810
    Abstract: Provided are a microwave heating device and a method for manufacturing a semiconductor packaging using the same. The microwave heating device includes a microwave generator configured to generate microwaves, a microwave absorbing layer configured to receive the microwaves so as to be heated, a temperature measuring layer provided on the microwave absorbing layer, a sensor configured to detect a temperature of the temperature measuring layer, and a controller connected to the sensor and the microwave generator to determine the temperature of the microwave absorbing layer using a detection signal of the sensor, the controller being configured to control a voltage of the microwaves provided from the microwave generator based on the temperature of the microwave absorbing layer.
    Type: Application
    Filed: April 7, 2023
    Publication date: October 12, 2023
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: GWANG-MUN CHOI, Yong Sung EOM, Jiho JOO, KWANG-SEONG CHOI, Seok-Hwan MOON, Jin Hyuk OH, Ho-Gyeong YUN, CHANMI LEE, Ki Seok JANG
  • Patent number: 11677060
    Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: June 13, 2023
    Assignee: ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jiho Joo, Yong Sung Eom, Gwang-Mun Choi, Kwang-Seong Choi, Chanmi Lee, Ki Seok Jang
  • Patent number: 11618109
    Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: April 4, 2023
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Gwang-Mun Choi, Yong Sung Eom, Kwang-Seong Choi, Jiho Joo, Chanmi Lee, Ki Seok Jang
  • Publication number: 20230027892
    Abstract: Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.
    Type: Application
    Filed: July 14, 2022
    Publication date: January 26, 2023
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: KWANG-SEONG CHOI, Yong-Sung EOM, Jiho JOO, GWANG-MUN CHOI, Seok-Hwan MOON, Ho-Gyeong YUN, CHANMI LEE, Ki-Seok JANG
  • Publication number: 20220402070
    Abstract: Provided are a laser control structure and a laser bonding method using the same, and more particularly, a laser bonding method including: forming bonding portions on a substrate; providing a bonding object onto the bonding portions; providing a laser control structure onto the bonding object or the substrate; irradiating a laser toward the bonding object and the bonding portions; controlling quantity of laser light absorbed through the laser control structure; using the controlled quantity of laser light to heat the bonding portions and the bonding object to a bonding temperature; and bonding the bonding portions and the bonding object, wherein the laser control structure includes: a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region, wherein: the first thin film laminate includes at least one first thin film layer and at least one second thin film layer, which are laminated on the first region; th
    Type: Application
    Filed: June 17, 2022
    Publication date: December 22, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ki Seok JANG, Yong Sung EOM, GWANG-MUN CHOI, KWANG-SEONG CHOI, Jiho JOO, Seok-Hwan MOON, CHANMI LEE
  • Publication number: 20220384674
    Abstract: Provided is a method for manufacturing an electronic device. The method for manufacturing the electronic device includes mapping good elements and defective elements on a substrate, providing a first transparent structure including a first adhesive layer on the substrate, selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate, providing a second transparent structure including a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate, and selectively providing second laser light to the new elements to bond the new elements to the substrate.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 1, 2022
    Inventors: Jiho JOO, Yong Sung EOM, Kwang-Seong CHOI, Chanmi LEE, Gwang-Mun CHOI, Ki Seok JANG, Seok-Hwan MOON, Ho-Gyeong YUN
  • Patent number: 11488841
    Abstract: Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: November 1, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung Eom, Kwang-Seong Choi, Ki Seok Jang, Seok-Hwan Moon, Jiho Joo
  • Publication number: 20220102603
    Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.
    Type: Application
    Filed: August 11, 2021
    Publication date: March 31, 2022
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong CHOI, Yong Sung EOM, Jiho JOO, Gwang-Mun CHOI, Seok-Hwan MOON, Chanmi LEE, Ki Seok JANG
  • Publication number: 20220077099
    Abstract: Provided is a composition for conductive adhesive. The composition for conductive adhesive includes a heterocyclic compound containing oxygen and including at least one of an epoxy group or oxetane group, a reductive curing agent including an amine group and a carboxyl group, and a photoinitiator, wherein a mixture ratio of the heterocyclic compound and the reductive curing agent satisfies Conditional Expression 1 below. 0.5?(b+c)/a?1.5, a>0, b?0, c>0??[Conditional Expression 1] where ‘a’ denotes a mole number of a heterocycle in the heterocyclic compound, ‘b’ denotes a mole number of hydrogen bonded to a nitrogen atom of the amine group included in the reductive curing agent, and ‘c’ denotes a mole number of the carboxyl group.
    Type: Application
    Filed: September 7, 2021
    Publication date: March 10, 2022
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Gwang-Mun CHOI, Yong-Sung EOM, Kwang-Seong CHOI, Jiho JOO, Ki-Seok JANG, Chanmi LEE
  • Publication number: 20210402525
    Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.
    Type: Application
    Filed: June 30, 2021
    Publication date: December 30, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: GWANG-MUN CHOI, Yong Sung EOM, KWANG-SEONG CHOI, Jiho JOO, CHANMI LEE, Ki Seok JANG
  • Publication number: 20210358885
    Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
    Type: Application
    Filed: July 28, 2021
    Publication date: November 18, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong CHOI, Yong Sung EOM, KeonSoo JANG, Seok-Hwan MOON, Hyun-cheol BAE
  • Publication number: 20210320236
    Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.
    Type: Application
    Filed: April 12, 2021
    Publication date: October 14, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jiho JOO, Yong Sung EOM, GWANG-MUN CHOI, KWANG-SEONG CHOI, CHANMI LEE, Ki Seok JANG
  • Patent number: 11107790
    Abstract: A laser bonding method includes forming a bonding part including an adhesive layer and a conductive particle disposed within the adhesive layer on a substrate; aligning a bonding target by disposing the bonding target on a surface of the bonding part opposite the substrate; disposing a pressing part on a surface of the bonding target that is opposite to the bonding part and pressing the bonding target onto the bonding part through the pressing part; heating the bonding target by irradiating at least the pressing part with a laser and conducting heat from the pressing part to the bonding target and from the bonding target to the bonding part; and bonding together the bonding part and the bonding target by the heat conducted from the bonding target to the bonding part so that the conductive particle electrically connects the substrate and the bonding target. The pressing part may be removed.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 31, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong Choi, Yong Sung Eom, KeonSoo Jang, Seok-Hwan Moon, Hyun-cheol Bae
  • Publication number: 20210252620
    Abstract: The present disclosure relates to a transfer and bonding method using a laser. As a plurality of devices or packages are simultaneously transferred onto a substrate from a transfer tape by irradiating a top surface of the transfer tape with a first laser, and the plurality of transferred devices or packages are simultaneously bonded to pads of a substrate by irradiating a top surface of the devices or packages with a second laser, a speed of a transfer and bonding process may be extremely maximized.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 19, 2021
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: KWANG-SEONG CHOI, Yong Sung EOM, Jiho JOO, Seok-Hwan MOON, Ho-Gyeong YUN, Ki Seok JANG, GWANG-MUN CHOI
  • Publication number: 20200266078
    Abstract: Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.
    Type: Application
    Filed: February 19, 2020
    Publication date: August 20, 2020
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Sung EOM, KWANG-SEONG CHOI, Ki Seok JANG, Seok-Hwan MOON, Jiho JOO
  • Patent number: 10636761
    Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: April 28, 2020
    Assignee: Electronics and Telecommunications Reearch Institute
    Inventors: Kwang-Seong Choi, Yong-Sung Eom, Keon-Soo Jang, Seok Hwan Moon, Hyun-Cheol Bae, Ieeseul Jeong, Wagno Alves Braganca Junior
  • Publication number: 20200075535
    Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong CHOI, Yong Sung EOM, KeonSoo JANG, Seok-Hwan MOON, Hyun-cheol BAE
  • Publication number: 20190287870
    Abstract: The inventive concept relates to a filling composition for a semiconductor package. The filling composition for a semiconductor package may include a resin, a curing agent, and an insulating filler. The insulating filler may include a first filler body part, a second filler body part, a polymer chain coupled to the first filler body part and the second filler body part, and supramolecules coupled to the polymer chain.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: KeonSoo JANG, Yong Sung EOM, KWANG-SEONG CHOI, Seok-Hwan MOON, Hyun-cheol BAE