Patents by Inventor Yong Sung Eom
Yong Sung Eom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240021570Abstract: Provided is a bonding apparatus. The bonding apparatus includes a stage configured to accommodate a substrate, a laser light source configured to provide laser light to devices on the substrate, and a bonding plate provided between the laser light source and the stage and configured to provide the devices on the substrate. The bonding plate includes a transparent substrate; a transparent layer below the transparent substrate; an device adhesion layer below the transparent layer and a reflective pattern provided above or below the transparent substrate and the transparent layer.Type: ApplicationFiled: July 5, 2023Publication date: January 18, 2024Inventors: Jiho JOO, Yong Sung EOM, CHANMI LEE, Ki Seok JANG, GWANG-MUN CHOI, KWANG-SEONG CHOI, Jin Hyuk OH
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Publication number: 20230391956Abstract: Provided is an organic-inorganic compound including a first structural body and a curable reactive group, wherein the first structural body may have a structure in which silane and isohexide are chemically bonded through a silyl ether bond.Type: ApplicationFiled: June 2, 2023Publication date: December 7, 2023Inventors: GWANG-MUN CHOI, Yong Sung EOM, Jiho JOO, KWANG-SEONG CHOI, Seok-Hwan MOON, Jin Hyuk OH, Ho-Gyeong YUN, CHANMI LEE, Ki Seok JANG
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Publication number: 20230326810Abstract: Provided are a microwave heating device and a method for manufacturing a semiconductor packaging using the same. The microwave heating device includes a microwave generator configured to generate microwaves, a microwave absorbing layer configured to receive the microwaves so as to be heated, a temperature measuring layer provided on the microwave absorbing layer, a sensor configured to detect a temperature of the temperature measuring layer, and a controller connected to the sensor and the microwave generator to determine the temperature of the microwave absorbing layer using a detection signal of the sensor, the controller being configured to control a voltage of the microwaves provided from the microwave generator based on the temperature of the microwave absorbing layer.Type: ApplicationFiled: April 7, 2023Publication date: October 12, 2023Applicant: Electronics and Telecommunications Research InstituteInventors: GWANG-MUN CHOI, Yong Sung EOM, Jiho JOO, KWANG-SEONG CHOI, Seok-Hwan MOON, Jin Hyuk OH, Ho-Gyeong YUN, CHANMI LEE, Ki Seok JANG
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Patent number: 11677060Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.Type: GrantFiled: April 12, 2021Date of Patent: June 13, 2023Assignee: ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTEInventors: Jiho Joo, Yong Sung Eom, Gwang-Mun Choi, Kwang-Seong Choi, Chanmi Lee, Ki Seok Jang
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Patent number: 11618109Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.Type: GrantFiled: June 30, 2021Date of Patent: April 4, 2023Assignee: Electronics and Telecommunications Research InstituteInventors: Gwang-Mun Choi, Yong Sung Eom, Kwang-Seong Choi, Jiho Joo, Chanmi Lee, Ki Seok Jang
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Publication number: 20230027892Abstract: Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.Type: ApplicationFiled: July 14, 2022Publication date: January 26, 2023Applicant: Electronics and Telecommunications Research InstituteInventors: KWANG-SEONG CHOI, Yong-Sung EOM, Jiho JOO, GWANG-MUN CHOI, Seok-Hwan MOON, Ho-Gyeong YUN, CHANMI LEE, Ki-Seok JANG
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Publication number: 20220402070Abstract: Provided are a laser control structure and a laser bonding method using the same, and more particularly, a laser bonding method including: forming bonding portions on a substrate; providing a bonding object onto the bonding portions; providing a laser control structure onto the bonding object or the substrate; irradiating a laser toward the bonding object and the bonding portions; controlling quantity of laser light absorbed through the laser control structure; using the controlled quantity of laser light to heat the bonding portions and the bonding object to a bonding temperature; and bonding the bonding portions and the bonding object, wherein the laser control structure includes: a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region, wherein: the first thin film laminate includes at least one first thin film layer and at least one second thin film layer, which are laminated on the first region; thType: ApplicationFiled: June 17, 2022Publication date: December 22, 2022Applicant: Electronics and Telecommunications Research InstituteInventors: Ki Seok JANG, Yong Sung EOM, GWANG-MUN CHOI, KWANG-SEONG CHOI, Jiho JOO, Seok-Hwan MOON, CHANMI LEE
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Publication number: 20220384674Abstract: Provided is a method for manufacturing an electronic device. The method for manufacturing the electronic device includes mapping good elements and defective elements on a substrate, providing a first transparent structure including a first adhesive layer on the substrate, selectively providing first laser light to the defective elements to cure the first adhesive layer on the defective elements and separate the defective elements from the substrate, providing a second transparent structure including a second adhesive layer, which adheres to new elements replaced for the defective elements, on the substrate, and selectively providing second laser light to the new elements to bond the new elements to the substrate.Type: ApplicationFiled: May 31, 2022Publication date: December 1, 2022Inventors: Jiho JOO, Yong Sung EOM, Kwang-Seong CHOI, Chanmi LEE, Gwang-Mun CHOI, Ki Seok JANG, Seok-Hwan MOON, Ho-Gyeong YUN
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Patent number: 11488841Abstract: Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.Type: GrantFiled: February 19, 2020Date of Patent: November 1, 2022Assignee: Electronics and Telecommunications Research InstituteInventors: Yong Sung Eom, Kwang-Seong Choi, Ki Seok Jang, Seok-Hwan Moon, Jiho Joo
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Publication number: 20220102603Abstract: Provided is a method of fabricating a semiconductor package. The method of fabricating the semiconductor package include preparing a lower element including a lower substrate, a lower electrode, an UBM layer, and a reducing agent layer, providing an upper element including an upper substrate, an upper electrode, and a solder bump layer, providing a pressing member on the upper substrate to press the upper substrate to the lower substrate, and providing a laser beam passing through the pressing member to bond the upper element to the lower element.Type: ApplicationFiled: August 11, 2021Publication date: March 31, 2022Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Kwang-Seong CHOI, Yong Sung EOM, Jiho JOO, Gwang-Mun CHOI, Seok-Hwan MOON, Chanmi LEE, Ki Seok JANG
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Publication number: 20220077099Abstract: Provided is a composition for conductive adhesive. The composition for conductive adhesive includes a heterocyclic compound containing oxygen and including at least one of an epoxy group or oxetane group, a reductive curing agent including an amine group and a carboxyl group, and a photoinitiator, wherein a mixture ratio of the heterocyclic compound and the reductive curing agent satisfies Conditional Expression 1 below. 0.5?(b+c)/a?1.5, a>0, b?0, c>0??[Conditional Expression 1] where ‘a’ denotes a mole number of a heterocycle in the heterocyclic compound, ‘b’ denotes a mole number of hydrogen bonded to a nitrogen atom of the amine group included in the reductive curing agent, and ‘c’ denotes a mole number of the carboxyl group.Type: ApplicationFiled: September 7, 2021Publication date: March 10, 2022Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Gwang-Mun CHOI, Yong-Sung EOM, Kwang-Seong CHOI, Jiho JOO, Ki-Seok JANG, Chanmi LEE
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Publication number: 20210402525Abstract: Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.Type: ApplicationFiled: June 30, 2021Publication date: December 30, 2021Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: GWANG-MUN CHOI, Yong Sung EOM, KWANG-SEONG CHOI, Jiho JOO, CHANMI LEE, Ki Seok JANG
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Publication number: 20210358885Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.Type: ApplicationFiled: July 28, 2021Publication date: November 18, 2021Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Kwang-Seong CHOI, Yong Sung EOM, KeonSoo JANG, Seok-Hwan MOON, Hyun-cheol BAE
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Publication number: 20210320236Abstract: Provided is a method for transferring and bonding devices. The method includes applying an adhesive layer to a carrier, arranging a plurality of devices, attaching the arranged devices to the carrier, applying a polymer film to a substrate, aligning the carrier to which the plurality of devices are attached with the substrate, bonding the plurality of devices to the substrate by radiating laser, and releasing the carrier from the substrate to which the plurality of devices are bonded.Type: ApplicationFiled: April 12, 2021Publication date: October 14, 2021Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Jiho JOO, Yong Sung EOM, GWANG-MUN CHOI, KWANG-SEONG CHOI, CHANMI LEE, Ki Seok JANG
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Patent number: 11107790Abstract: A laser bonding method includes forming a bonding part including an adhesive layer and a conductive particle disposed within the adhesive layer on a substrate; aligning a bonding target by disposing the bonding target on a surface of the bonding part opposite the substrate; disposing a pressing part on a surface of the bonding target that is opposite to the bonding part and pressing the bonding target onto the bonding part through the pressing part; heating the bonding target by irradiating at least the pressing part with a laser and conducting heat from the pressing part to the bonding target and from the bonding target to the bonding part; and bonding together the bonding part and the bonding target by the heat conducted from the bonding target to the bonding part so that the conductive particle electrically connects the substrate and the bonding target. The pressing part may be removed.Type: GrantFiled: August 29, 2019Date of Patent: August 31, 2021Assignee: Electronics and Telecommunications Research InstituteInventors: Kwang-Seong Choi, Yong Sung Eom, KeonSoo Jang, Seok-Hwan Moon, Hyun-cheol Bae
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Publication number: 20210252620Abstract: The present disclosure relates to a transfer and bonding method using a laser. As a plurality of devices or packages are simultaneously transferred onto a substrate from a transfer tape by irradiating a top surface of the transfer tape with a first laser, and the plurality of transferred devices or packages are simultaneously bonded to pads of a substrate by irradiating a top surface of the devices or packages with a second laser, a speed of a transfer and bonding process may be extremely maximized.Type: ApplicationFiled: February 18, 2021Publication date: August 19, 2021Applicant: Electronics and Telecommunications Research InstituteInventors: KWANG-SEONG CHOI, Yong Sung EOM, Jiho JOO, Seok-Hwan MOON, Ho-Gyeong YUN, Ki Seok JANG, GWANG-MUN CHOI
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Publication number: 20200266078Abstract: Provided is a method for manufacturing a semiconductor package, the method including providing a semiconductor chip on a substrate, providing a bonding member between the substrate and the semiconductor chip, and bonding the semiconductor chip on the substrate by irradiating of a laser on the substrate. Here, the bonding member may include a thermosetting resin, a curing agent, and a laser absorbing agent.Type: ApplicationFiled: February 19, 2020Publication date: August 20, 2020Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Yong Sung EOM, KWANG-SEONG CHOI, Ki Seok JANG, Seok-Hwan MOON, Jiho JOO
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Patent number: 10636761Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.Type: GrantFiled: August 28, 2018Date of Patent: April 28, 2020Assignee: Electronics and Telecommunications Reearch InstituteInventors: Kwang-Seong Choi, Yong-Sung Eom, Keon-Soo Jang, Seok Hwan Moon, Hyun-Cheol Bae, Ieeseul Jeong, Wagno Alves Braganca Junior
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Publication number: 20200075535Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.Type: ApplicationFiled: August 29, 2019Publication date: March 5, 2020Applicant: Electronics and Telecommunications Research InstituteInventors: Kwang-Seong CHOI, Yong Sung EOM, KeonSoo JANG, Seok-Hwan MOON, Hyun-cheol BAE
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Publication number: 20190287870Abstract: The inventive concept relates to a filling composition for a semiconductor package. The filling composition for a semiconductor package may include a resin, a curing agent, and an insulating filler. The insulating filler may include a first filler body part, a second filler body part, a polymer chain coupled to the first filler body part and the second filler body part, and supramolecules coupled to the polymer chain.Type: ApplicationFiled: March 18, 2019Publication date: September 19, 2019Applicant: Electronics and Telecommunications Research InstituteInventors: KeonSoo JANG, Yong Sung EOM, KWANG-SEONG CHOI, Seok-Hwan MOON, Hyun-cheol BAE