Patents by Inventor Yong Sung Eom

Yong Sung Eom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060056775
    Abstract: The present invention provides a transceiver module having advantages of minimizing the number of optical parts by using an optical collimator to which a lens having the same shape as a diameter of an optical fiber is attached on a light input/output end. An transceiver module according to the present invention includes, laser diode for generating an optical signal to transmit, a first photodiode for controlling the laser diode, a second and third photodiodes for receiving an optical signal of a first and second wave lengths, and an optical collimator formed at a light input/output end. On the optical collimator, a lens having an optical fiber shape is attached in a direction the light proceeds.
    Type: Application
    Filed: September 13, 2005
    Publication date: March 16, 2006
    Inventors: Yong-Sung Eom, Jong-Tae Moon, Ho-Gyeong Yun, Byung-Seok Choi, Jong-Hyun Lee
  • Patent number: 7012939
    Abstract: A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: March 14, 2006
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kwang Seong Choi, Heung Woo Park, Ho Gyeong Yun, Byung Seok Choi, Yong Sung Eom, Jong Hyun Lee, Jong Tae Moon
  • Patent number: 6825065
    Abstract: A method for flip-chip-bonded optical module packaging is presented. An optical device chip including an input/output pad formed on a substrate, an under bump metal layer formed on the input/output pad, and a solder bump formed on the under bump metal layer to transmit an electric signal to the outside is prepared. A silicon wafer is prepared to rearrange input/output terminals of the chip and passively align an optical fiber with the optical device chip. Through holes are formed in the silicon wafer at predetermined intervals. An under ball metal layer is formed at the surface of the silicon wafer. A solder ball is formed on the under ball metal layer to transmit a signal to the outside. The optical device chip is flip-chip-bonded to the silicon wafer. An optical sub module is made by cutting the silicon wafer. The chip is optically connected with the optical sub module.
    Type: Grant
    Filed: August 1, 2003
    Date of Patent: November 30, 2004
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jong-tae Moon, Yong-sung Eom
  • Publication number: 20040101319
    Abstract: A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed.
    Type: Application
    Filed: August 27, 2003
    Publication date: May 27, 2004
    Inventors: Kwang Seong Choi, Heung Woo Park, Ho Gyeong Yun, Byung Seok Choi, Yong Sung Eom, Jong Hyun Lee, Jong Tae Moon
  • Publication number: 20040076367
    Abstract: A silicon optical bench for packaging an optical switch device is provided. The silicon optical bench includes a silicon substrate. The silicon substrate includes a first region where the optical switch device will be installed, a second region placed on a first side of the first region so as to allow an optical input unit to be installed therein, and a third region placed on a second side of the first region so as to allow an optical output unit to be installed therein. Here, a cavity is formed in the first region through the silicon substrate, and grooves are arranged in the second and third regions of the silicon substrate so that a lens and an optical fiber for defining optical fibers can be installed in the grooves.
    Type: Application
    Filed: June 4, 2003
    Publication date: April 22, 2004
    Inventors: Yong-sung Eom, Heung-woo Park, Jong-hyun Lee, Ho-gyeong Yun, Byung-seok Choi
  • Patent number: 6707161
    Abstract: A flip-chip-bonded optical module package using flip chip bonding is provided. The flip-chip-bonded optical module package includes an optical device chip which has an input/output pad formed on a substrate, an under bump metal layer fanned on the input/output pad, and a solder bump formed on the under bump metal layer to transmit an electric signal to the outside. The flip-chip-bonded optical module package includes a silicon wafer through which a through hole is formed, on which an under ball metal layer is formed, and to which the optical device chip is flip-chip-banded. The flip-chip-banded optical module package includes a solder ball which is fanned on the under ball metal layer and transmits an electrical signal from the solder bump to the outside, and an optical fiber which is inserted into the through hole and is optically coupled with the optical device chip.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: March 16, 2004
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jong-tae Moon, Yong-sung Eom
  • Publication number: 20040023437
    Abstract: A method for flip-chip-bonded optical module packaging is presented. An optical device chip including an input/output pad formed on a substrate, an under bump metal layer formed on the input/output pad, and a solder bump formed on the under bump metal layer to transmit an electric signal to the outside is prepared. A silicon wafer is prepared to rearrange input/output terminals of the chip and passively align an optical fiber with the optical device chip. Through holes are formed in the silicon wafer at predetermined intervals. An under ball metal layer is formed at the surface of the silicon wafer. A solder ball is formed on the under ball metal layer to transmit a signal to the outside. The optical device chip is flip-chip-bonded to the silicon wafer. An optical sub module is made by cutting the silicon wafer. The chip is optically connected with the optical sub module.
    Type: Application
    Filed: August 1, 2003
    Publication date: February 5, 2004
    Inventors: Jong-Tae Moon, Yong-Sung Eom
  • Publication number: 20030098511
    Abstract: A flip-chip-bonded optical module package and a method of packaging an optical module using flip chip bonding are provided. The flip-chip-bonded optical module package includes an optical device chip which has an input/output pad formed on a substrate, an under bump metal layer formed on the input/output pad, and a solder bump formed on the under bump metal layer to transmit an electric signal to the outside. The flip-chip-bonded optical module package includes a silicon wafer through which a through hole is formed, on which an under ball metal layer is formed, and to which the optical device chip is flip-chip-bonded. The flip-chip-bonded optical module package includes a solder ball which is formed on the under ball metal layer and transmits an electrical signal from the solder bump to the outside, and an optical fiber which is inserted into the through hole and is optically coupled with the optical device chip.
    Type: Application
    Filed: June 27, 2002
    Publication date: May 29, 2003
    Inventors: Jong-Tae Moon, Yong-Sung Eom