Abstract: A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer

Abstract: Disclosed is a range shift mechanism in the form of a floating planetary gear assembly for a transfer case. The range shift mechanical according to the present invention can improve power efficiency and generate low noises by suppressing gear rotation in a high range mode of the range shift system.

Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract: A display controller is provided. The display controller includes an external memory and a timing controller which compresses current frame data to generate front first in-first out (FIFO) input data, temporarily stores the front FIFO input data and writes the front FIFO input data to the external memory in a burst mode, and reads data from the external memory in the burst mode, temporarily stores the read data as back FIFO output data, and decodes the back FIFO output data to output previous frame data.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.

Abstract: The present invention discloses a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: forming a first circuit pattern on a metal layer formed on one surface of a base substrate; forming a second circuit pattern after laminating a first insulating layer in which the first circuit pattern is embedded; sequentially laminating a second insulating layer and a preliminary third circuit pattern on the second circuit pattern; separating the base substrate and forming a hole in the separated substrate; and forming a third circuit pattern, a landless first fill-plating layer, and a second fill-plating layer by performing fill-plating on the entire surface of the substrate in which the hole is formed, forming an insulating film layer on the other surface of the substrate, and performing an etching process on one surface and the other surface of the substrate.

Abstract: The present invention relates to a process system for reclaiming a sustainable landfill and fuelizing combustibles from the landfill waste. According to the present invention, the odor and landfill gas in the landfill are removed, and then the organic matters in the landfill waste are pre-stabilized so that the moisture of the landfill waste is partially reduced, the landfill waste which went through the odor stabilization and the pre-stabilization is excavated and sorted, and then the purity of the sorted landfill waste is increased for recycling and fuelizing, solid fuels are produced from the collected combustibles, thereby it is allowed to recycle resources and manage land efficiently due to circulating use of operating or closed landfills.

Abstract: The present invention relates to a method and apparatus for software management and control and, more particularly, to a method and apparatus for software management and control that control multiple office computers or user terminals connected to an internal corporate network in various ways, for example, by forcing an idle user terminal occupying a connection to software running on a central server to release the connection wherein the central server performs such control operations by providing control messages that control processes running on user terminals. In the present invention, an idle user terminal, which is connected to software running on the central server but does not use the software for a given time or more, is monitored and forced to release the connection to the software. Hence, it is possible to effectively increase the number of users capable of accessing the software.

Abstract: A pharmaceutical composition for the treatment of malignant tumors comprising a human p31comet gene encoding protein represented by SEQ ID NO: 3 or 4 as an effective component is provided. The pharmaceutical composition can suppress cancer cell growth, induce apoptosis and kill cells by overexpressing p31comet in the solid malignant tumor cells. Therefore, the pharmaceutical composition can be effectively used for gene therapy.

Abstract: A timing controller that includes a noise detection circuit and a setting control unit. The noise detection circuit includes a detection unit and a reset signal generating unit. The detection unit outputs a detection signal having a first logic level based on at least one of a plurality of reference data toggling asynchronous with a clock signal. The reset signal generating unit outputs a reset signal having a second logic level based on the detection signal. The setting control unit stores setting data and initializes the setting data in response to the reset signal having the first logic level, and the setting data are used to process red, green and blue (RGB) image data.

Abstract: A method of manufacturing a MIM capacitor of a semiconductor device and a MIM capacitor. A MIM structure and a metal layer may be formed using a single process. A method of manufacturing a MIM capacitor may include forming a hole on and/or over a lower metal wire region. A method of manufacturing a MIM capacitor may include forming a lower metal layer, an inter-metal dielectric and/or an upper metal layer on and/or over a hole to form a MIM structure. Patterns to form a MIM structure and a metal layer may be formed at substantially the same time. If etching is performed with a photoresist pattern as a mask, a MIM structure and a metal layer structure may be formed at substantially the same time using a single mask.

Abstract: A protection circuit for a battery pack is provided in which a positive temperature coefficient device is electrically connected in a current path of the battery pack to control current flowing through the current path in response to an internal temperature of the battery pack. The protection circuit for a battery pack includes a charging and discharging control unit located on a current path of the battery pack. A first protection circuit controls the charging and discharging control unit in response to a charged state of the battery pack. A second protection circuit prevents overcurrent from flowing through the current path of the battery pack. A positive temperature coefficient is electrically connected in the current path of the battery pack. The battery pack may include a bare cell or battery group including one or more secondary batteries.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern; preparing an insulating layer, and transferring the upper circuit layer to the insulating layer; and removing the metal carrier and the barrier layer.

Abstract: A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.

Abstract: An impulse charger for motor vehicle engines include impulse valves driven using driving force continuously generated by a driving apparatus so as to be instantaneously opened and closed at a high speed by a link unit in which link members are interconnected, and in which the impulse valves for all cylinders are simultaneously driven. Thus, the impulse charger provides simple drive control, reduction in necessary components, and an efficient mounting space, guarantees easy manufacturing and mounting at a low cost, and prevents noise from being generated when the impulse valves are operated.

Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.

Abstract: Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.