Abstract: A pharmaceutical composition for the treatment of malignant tumors comprising a human p31comet gene encoding protein represented by SEQ ID NO: 3 or 4 as an effective component is provided. The pharmaceutical composition can suppress cancer cell growth, induce apoptosis and kill cells by overexpressing p31comet in the solid malignant tumor cells. Therefore, the pharmaceutical composition can be effectively used for gene therapy.

Abstract: A timing controller that includes a noise detection circuit and a setting control unit. The noise detection circuit includes a detection unit and a reset signal generating unit. The detection unit outputs a detection signal having a first logic level based on at least one of a plurality of reference data toggling asynchronous with a clock signal. The reset signal generating unit outputs a reset signal having a second logic level based on the detection signal. The setting control unit stores setting data and initializes the setting data in response to the reset signal having the first logic level, and the setting data are used to process red, green and blue (RGB) image data.

Abstract: A method of manufacturing a MIM capacitor of a semiconductor device and a MIM capacitor. A MIM structure and a metal layer may be formed using a single process. A method of manufacturing a MIM capacitor may include forming a hole on and/or over a lower metal wire region. A method of manufacturing a MIM capacitor may include forming a lower metal layer, an inter-metal dielectric and/or an upper metal layer on and/or over a hole to form a MIM structure. Patterns to form a MIM structure and a metal layer may be formed at substantially the same time. If etching is performed with a photoresist pattern as a mask, a MIM structure and a metal layer structure may be formed at substantially the same time using a single mask.

Abstract: A protection circuit for a battery pack is provided in which a positive temperature coefficient device is electrically connected in a current path of the battery pack to control current flowing through the current path in response to an internal temperature of the battery pack. The protection circuit for a battery pack includes a charging and discharging control unit located on a current path of the battery pack. A first protection circuit controls the charging and discharging control unit in response to a charged state of the battery pack. A second protection circuit prevents overcurrent from flowing through the current path of the battery pack. A positive temperature coefficient is electrically connected in the current path of the battery pack. The battery pack may include a bare cell or battery group including one or more secondary batteries.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern; preparing an insulating layer, and transferring the upper circuit layer to the insulating layer; and removing the metal carrier and the barrier layer.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.

Abstract: A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.

Abstract: An impulse charger for motor vehicle engines include impulse valves driven using driving force continuously generated by a driving apparatus so as to be instantaneously opened and closed at a high speed by a link unit in which link members are interconnected, and in which the impulse valves for all cylinders are simultaneously driven. Thus, the impulse charger provides simple drive control, reduction in necessary components, and an efficient mounting space, guarantees easy manufacturing and mounting at a low cost, and prevents noise from being generated when the impulse valves are operated.

Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.

Abstract: Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.

Abstract: A pharmaceutical composition for the treatment of malignant tumors comprising a human p31comet gene encoding protein represented by SEQ ID NO: 3 or 4 as an effective component is provided. The pharmaceutical composition can suppress cancer cell growth, induce apoptosis and kill cells by overexpressing p31comet in the solid malignant tumor cells. Therefore, the pharmaceutical composition can be effectively used for gene therapy.

Abstract: A software management apparatus and method are disclosed. A software installation attempt made in one of multiple user terminals connected through a corporate network is detected, and a management operation is performed to permit software installation, to block the use of the user terminal, or to provide a popup notification according to the rights assigned to the user terminal. In addition, unlike existing approaches to prevention of unauthorized software installation that may not handle already installed software, the software management apparatus and method enable the system manager to handle and remove software that is already installed in a user terminal before installation of the apparatus and method. As a result, unauthorized installation of software in corporate computers can be effectively prevented.

Abstract: A display controller is provided. The display controller includes an external memory and a timing controller which compresses current frame data to generate front first in-first out (FIFO) input data, temporarily stores the front FIFO input data and writes the front FIFO input data to the external memory in a burst mode, and reads data from the external memory in the burst mode, temporarily stores the read data as back FIFO output data, and decodes the back FIFO output data to output previous frame data.

Abstract: Disclosed herein are a printed circuit board and a process of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and circuit layers disposed at both sides of the insulating layer, each of the circuit layers including a land part and a pattern part. The land parts formed on both sides of the insulating layer are coupled to each other using electrical resistance welding. There is no need for a separate interlayer connection structure such as vias or bumps and a process of forming the interlayer connection structure, thus simplifying the printed circuit board and the process.

Abstract: A MIM capacitor may include a plurality of lower electrodes over a semiconductor substrate. A plurality of insulators may be formed over the lower electrodes, with each insulator having a thickness which is different from the thickness of at least one other insulator among the plurality of insulators. Upper electrodes may be formed over the plurality of insulators. This arrangement permits a plurality of MIM capacitors having differing capacitance values to be formed on a semiconductor substrate, enabling the MIM capacitors to be applied to devices or chips which have various characteristics.

Abstract: A method of manufacturing a MIM capacitor of a semiconductor device and a MIM capacitor. A MIM structure and a metal layer may be formed using a single process. A method of manufacturing a MIM capacitor may include forming a hole on and/or over a lower metal wire region. A method of manufacturing a MIM capacitor may include forming a lower metal layer, an inter-metal dielectric and/or an upper metal layer on and/or over a hole to form a MIM structure. Patterns to form a MIM structure and a metal layer may be formed at substantially the same time. If etching is performed with a photoresist pattern as a mask, a MIM structure and a metal layer structure may be formed at substantially the same time using a single mask.

Abstract: A semiconductor device and fabricating method thereof are disclosed. The present invention includes an insulating layer on a semiconductor substrate, a contact plug in and protruding from the insulating layer, and a capacitor on the insulating layer and the exposed contact plug, having a dome shape.

Abstract: The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.