Abstract: The present invention provides a method for manufacturing a hot-dip galvanized steel sheet, comprising performing a heat treatment step, a hot dip plating step, and an alloying treatment step on a steel sheet having high Si and Mn content. The heat treatment step comprises a first heating phase and a soaking phase; a first heating atmosphere of the first heating stage contains 0.01-0.5% of O2 by volume, and the balance is N2 and inevitable impurities; a soaking atmosphere of the soaking stage contains 0.5% or more of H2 by volume, and the balance is N2 and inevitable impurities; dew points of the first heating atmosphere and the soaking atmosphere are controlled to be greater than or equal to ?20° C. The present invention further provides a hot-dip galvanized steel sheet and a vehicle component.

Abstract: Disclosed is an ultra-high-strength steel having excellent plasticity, comprising in mass percent the chemical elements: C: 0.26-0.30 wt %; Si: 0.8-1.00 wt %; Mn: 2.80-3.30 wt %; Al: 0.04-0.08 wt %; with the balance being Fe and other inevitable impurities. Also disclosed is a manufacturing method for manufacturing the ultra-high-strength steel having excellent plasticity, comprising the following steps: (1) smelting and thin slab continuous casting; (2) heating; (3) hot rolling, wherein an oxide scale on the surface of a hot-rolled steel strip has a thickness of ?6 ?m, and (FeO+Fe3O4)?40 wt % in the oxide scale on the surface of the hot-rolled strip steel; (4) acid pickling or acid pickling and cold rolling; and (5) continuous annealing: annealing at 800-920° C. and performing slow cooling at 3-10° C./s to 690-760° C.; performing fast cooling to 250-350° C. at 50-100° C.; and then heating to 360-460° C., maintaining the temperature for 100-400s and cooling to room temperature.

Abstract: Techniques for low power voice communications include determining a time between an arrival of data for uplink transmission by a device and a scheduling request (SR) occasion, the SR occasion occurring after the arrival of the data and within an on duration of a discontinuous reception (DRX) cycle, and delaying transmission of a SR by the device during a time period that begins at the arrival of the data for uplink transmission and continues for the determined time.

Abstract: A method for creating a virtual machine includes: receiving a virtual machine creation request to create a plurality of virtual machines; dividing the plurality of virtual machines into a plurality of virtual machine groups; determining a home physical rack for each virtual machine group, where one virtual machine group corresponds to one home physical rack; and creating each virtual machine group on the home physical rack of each virtual machine group. Because each virtual machine group is created on a home physical rack to which each virtual machine group belongs, each virtual machine group is equivalent to one physical rack.

Abstract: A polysilicon-insulator-polysilicon (PIP) structure includes: a first polysilicon region formed on a substrate; a first insulation region formed outside one side of the first polysilicon region and adjoined to the first polysilicon region in a horizontal direction; and a second polysilicon region formed outside one side of the first insulation region. The first polysilicon region, the first insulation region and the second polysilicon region are adjoined in sequence in the horizontal direction. The second polysilicon region is formed outside the first insulation region by a first self-aligned process step, and the first insulation region is formed outside the first polysilicon region by a second self-aligned process step.

Abstract: Embodiments of the present invention provide a method, a system, and an apparatus for creating a virtual machine. The method includes: receiving a virtual machine creation request to create a plurality of virtual machines; dividing the plurality of virtual machines into a plurality of virtual machine groups; determining a home physical rack for each virtual machine group, where one virtual machine group corresponds to one home physical rack; and creating each virtual machine group on the home physical rack of each virtual machine group. Because each virtual machine group is created on a home physical rack to which each virtual machine group belongs, each virtual machine group is equivalent to one physical rack.

Abstract: The disclosure relates to a two-dimensional (2D) bismuth nanocomposite, and a preparation method and use thereof, and belongs to the field of nanobiotechnology. The 2D bismuth nanocomposite of the disclosure is an ultra-thin bismuth nanosheet that is loaded with platinum nanoparticles and modified with indocyanine green (ICG) and surface targeting polypeptide Ang-2. The 2D bismuth nanocomposite Bi@Pt/ICG-Ang2 of the disclosure can not only realize the targeted photothermal and photodynamic combination therapy for tumors, but also realize the dual-mode imaging combining CT and fluorescence imaging.

Abstract: A heat dissipation structure, includes: a lead frame, including a high temperature pad and a low temperature pad, the high temperature pad and the low temperature pad being two portions in the lead frame which are separated from each other, wherein a high heat generation component is disposed on the high temperature pad; and a high thermal conduction element, including two sides which are respectively directly connected with the high temperature pad and the low temperature pad, to dissipate the heat energy from the high heat generation component to the low temperature pad.

Abstract: A lead frame includes: at least one ductile structure, including a bond area, a die paddle, or a lead finger; and at least one sacrificial structure, connected between a corresponding ductile structure and a corresponding near portion in the lead frame, wherein the near portion is a portion of the lead frame close to the ductile structure.

Abstract: The present application relates to devices and components including apparatus, systems, and methods for IMS registration in wireless networks.

Abstract: A beverage dispenser includes a housing and a user interface disposed on a vertical corner of the housing. The user interface includes one or more buttons that are accessible from a front view and a side view of the housing.

Abstract: A method for creating a virtual machine includes: receiving a virtual machine creation request to create a plurality of virtual machines; dividing the plurality of virtual machines into a plurality of virtual machine groups; determining a home physical rack for each virtual machine group, where one virtual machine group corresponds to one home physical rack; and creating each virtual machine group on the home physical rack of each virtual machine group. Because each virtual machine group is created on a home physical rack to which each virtual machine group belongs, each virtual machine group is equivalent to one physical rack.

Abstract: A cold-rolled high-strength steel plate having excellent phosphating performance and formability and a manufacturing method therefor. The chemical composition of the steel plate is, in percentage by weight, C 0.01-0.20%, Si 1.50-2.50%, Mn 1.50-2.50%, P?0.02%, S?0.02%, Al 0.03-0.06%, N?0.01%, the remainder being Fe and impurities. The surface layer of the steel plate has an inner oxide layer with a thickness of 1-5 ?m, and there is no enrichment of Si and Mn on the surface of the steel plate. The steel plate has tensile strength of ?980 MPa and an elongation of ?20%. The structure at the room temperature contains retained austenite, ferrite, and martensite and/or bainite.

Abstract: A switch capable of decreasing parasitic inductance includes: a semiconductor device, a first top metal line, and a second top metal line. The second top metal line electrically connects a power supply input end and a current inflow end of the semiconductor device, wherein a first part of the first top metal line is arranged in parallel and adjacent to a second part of the second top metal line. When the semiconductor device is in an ON operation, an input current outflows from the power supply input end, and is divided into a first current and a second current. When the first current and the second current flow through the first part and the second part respectively, the first current and the second current flow opposite to each other, to reduce an total parasitic inductance of the first top metal line and the second top metal line.

Abstract: A cold-rolled steel plate (1) and a manufacturing method therefor. The chemical composition of the steel plate (1) in percentage by weight is: C 0.15-0.25%, Si 1.50-2.50%, Mn 2.00-3.00%, P?0.02%, S?0.01%, Al 0.03-0.06%, N?0.01%, with the balance being Fe and impurities. The surface layer has an inner oxide layer (2) with a thickness of 1-5 ?m, and there is no enrichment of Si or Mn on the surface. The steel plate (1) has good phosphating performance and formability, with a tensile strength of ?1180 MPa and an elongation of ?14%, and has a complex-phase structure of ferrite, martensite, and retained austenite, the content of the retained austenite being not lower than 5%. A dew point is at ?25° C. to 10° C. in continuous annealing, such that external oxidation transitions to internal oxidation.

Abstract: A chip package unit includes: a base material; at least one chip, disposed on the base material; a package material, enclosing the base material and the chip; and at least one heat dissipation paste curing layer, formed by curing the heat dissipation paste, on a top side of the package material or a back side of the chip in a printed pattern.

Abstract: A low profile dual-frequency antenna device comprises an insulative carrier having a first surface and a second surface which are opposite and a conductor unit, the conductor unit comprises a first conductor which is provided to the first surface and a second conductor which is provided to the second surface and connected with the first conductor, a first radiation slot as a low frequency slot antenna is formed between the first conductor and the second conductor, the first conductor is formed with a second radiation slot, a third radiation slot which is communicated with the first radiation slot and the second radiation slot, a fourth radiation slot and a fifth radiation slot, and the third radiation slot, the fourth radiation slot and the fifth radiation slot together constitute a high frequency slot antenna, the second radiation slot decides an impedance and a resonance frequency width of each antenna, a first side edge and a second side edge is oppositely positioned at a location where the second radiatio

Abstract: The present invention provides a chip packaging method, which includes: providing a base material, which includes plural finger contacts; disposing plural chips on the base material by flip chip mounting technology, and disposing plural vertical heat conducting elements surrounding each of the chips to connect the finger contacts on the base material; providing a packaging material to encapsulate the base material, the chips, and the vertical heat conducting elements; adhering a metal film on the packaging material via an adhesive layer, to form a package structure; and cutting the package structure into plural chip package units, wherein each of the chip package units includes one of the chips, a portion of the base material, a portion of the metal film, and a portion of the vertical heat conducting elements surrounding the chip.