Patents by Inventor Yoshihiro Tanaka
Yoshihiro Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20170265814Abstract: A contact detection instrument 1 is provided with a rod 12, a tip sensor portion 20 that is attached to one end of the rod 12 and is inserted into a living body through a hole, a speaker 14 that, from outside the living body, inputs a sound into a hollow space that is formed in the interior of the rod 12 and the tip sensor portion 20, and a microphone 15 that, outside the living body, outputs an electrical signal that corresponds to the sound inside the hollow space, with the tip sensor portion 20 including an elastic material that covers the hollow space.Type: ApplicationFiled: August 4, 2015Publication date: September 21, 2017Applicants: NAGOYA INSTITUTE OF TECHNOLOGY, NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITYInventors: Yoshihiro TANAKA, Akihito SANO, Michitaka FUJIWARA
-
Patent number: 9595488Abstract: A semiconductor device according to one embodiment of the present invention includes a semiconductor element, an island having a surface on which the semiconductor element is fixed using a first metal, and a first pattern formed by a second metal, the first pattern being arranged on one part of the surface, wherein the second metal has a greater wetting characteristic than the surface when the first metal is melted.Type: GrantFiled: January 29, 2016Date of Patent: March 14, 2017Assignee: J-Devices CorporationInventor: Yoshihiro Tanaka
-
Patent number: 9460984Abstract: A heat dissipating circuit board for a power semiconductor includes an electrode material on which a power semiconductor is mounted on a front surface thereof, and a member bonded to a front surface side of the electrode material. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.Type: GrantFiled: February 11, 2016Date of Patent: October 4, 2016Assignee: NGK Insulators, Ltd.Inventors: Makoto Tani, Yoshihiro Tanaka, Takashi Ebigase
-
Patent number: 9452553Abstract: Disclosed is a surface structure of an article (1) including multiple protrusions (3) on the surface. A height H of the protrusions (3) is equal to or larger than 5 ?m, and equal to or smaller than 32 ?m, as well as at least one of a distance P between each two neighboring protrusions (3) and a distance W between each neighboring two of recesses (5) formed between the protrusions (3) is larger than the height H of the protrusions (3).Type: GrantFiled: October 13, 2010Date of Patent: September 27, 2016Assignees: NISSAN MOTOR CO., LTD., NATIONAL UNIVERSITY CORPORATION NAGOYA INSTITUTE OF TECHNOLOGYInventors: Akane Motofuji, Makoto Tamuraya, Takashi Takeuchi, Hideo Fujimoto, Akihito Sano, Hiromi Mochiyama, Naoyuki Takesue, Yoshihiro Tanaka
-
Patent number: 9439279Abstract: A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.Type: GrantFiled: August 12, 2014Date of Patent: September 6, 2016Assignee: NGK Insulators, Ltd.Inventors: Makoto Tani, Yoshihiro Tanaka, Takashi Ebigase
-
Publication number: 20160225701Abstract: A semiconductor device according to one embodiment of the present invention includes a semiconductor element, an island having a surface on which the semiconductor element is fixed using a first metal, and a first pattern formed by a second metal, the first pattern being arranged on one part of the surface, wherein the second metal has a greater wetting characteristic than the surface when the first metal is melted.Type: ApplicationFiled: January 29, 2016Publication date: August 4, 2016Inventor: Yoshihiro TANAKA
-
Publication number: 20160163618Abstract: A heat dissipating circuit board for a power semiconductor includes an electrode material on which a power semiconductor is mounted on a front surface thereof, and a member bonded to a front surface side of the electrode material. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.Type: ApplicationFiled: February 11, 2016Publication date: June 9, 2016Inventors: Makoto TANI, Yoshihiro TANAKA, Takashi EBIGASE
-
Publication number: 20160163617Abstract: A ceramic circuit board includes a ceramic substrate, a first metal plate bonded to a front surface of the ceramic substrate, and a member bonded to a front surface side of the metal plate. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the first metal plate, and which exhibits a higher Young's modulus than that of the first metal plate.Type: ApplicationFiled: February 10, 2016Publication date: June 9, 2016Inventors: Makoto TANI, Yoshihiro TANAKA, Takashi EBIGASE
-
Patent number: 9212085Abstract: An easily-administered technology which demonstrates the intrinsic thermal conductivity improvement effect by addition of non-oxide system compound crystal phase (filler particles) and makes it possible to sufficiently raise the thermal conductivity of a glass-ceramics composite material is provided. In the glass phase which constitutes a glass-ceramics composite material, the quantity of aluminum oxide (Al2O3) component is increased under a condition where at least either of zinc oxide (ZnO) component or magnesium oxide (MgO) component exists in a predetermined quantity or more. Thereby, the unintended reaction between a non-oxide system compound crystal phase and a glass phase can be suppressed, and the intrinsic thermal conductivity improvement effect by addition of non-oxide system compound crystal phase (filler particles) can be demonstrated.Type: GrantFiled: March 21, 2014Date of Patent: December 15, 2015Assignee: NGK Insulators, Ltd.Inventors: Shinsuke Yano, Yoshihiro Tanaka, Tsutomu Nanataki, Hirofumi Yamaguchi, Natsumi Shimogawa, Naoto Ohira
-
Patent number: 9212087Abstract: A glass-ceramics composite material suitable for a low-temperature firing use, which has high moisture resistance and thermal conductivity, is provided. In the glass-ceramics composite material which contains aluminum nitride (AlN) particles as a filler, even in a case where boron oxide (B2O3) is blended as a flux of a glass phase, by adjusting the composition of raw materials which forms the glass phase to a specific conditions to make the crystal phase which contains boron (B) precipitate at the time of firing of the glass-ceramics composite material.Type: GrantFiled: March 11, 2014Date of Patent: December 15, 2015Assignee: NGK Insulators, Ltd.Inventors: Shinsuke Yano, Yoshihiro Tanaka, Naoto Ohira, Hirofumi Yamaguchi
-
Patent number: 9145337Abstract: Provided is a fiber reinforced cement based mixed material having high tensile strength and high toughness, the mixed material comprising a cementitious composition with fast development of early strength; a small hydration heat temperature; and a small shrinkage during curing. The fiber reinforced cement based mixed material contains 100 wt. parts of cement, 5-30 wt. parts of silica fume, 30-80 wt. parts of at least one pozzolanic material excluding the silica fume, 5-25 wt. parts of limestone powder, at least one chemical admixture, water, 70-150 wt. parts of aggregate having a largest aggregate diameter of 1.2-3.5 mm, and fibers, wherein at least some of the fibers comprise a fiber having asperities formed in the surface, the fiber having asperities being formed such that a ratio (h/H) of a depth h of each of recessed portions among the asperities to a smallest cross-sectional diameter H thereof is 0.05-0.8.Type: GrantFiled: November 14, 2012Date of Patent: September 29, 2015Assignee: TAISEI CORPORATIONInventors: Yoshihiro Tanaka, Osamu Hashimoto, Jun Sakamoto, Kazuhiko Nishi
-
Patent number: 9115026Abstract: A cementitious matrix in which the development of early strength is fast, the hydration heat temperature is small, and the amount of shrinkage during curing is small, while keeping the fluidity when concrete is fresh, is provided. The cementitious matrix is characterized by comprising 100 parts by weight of Portland cement, 5 to 30 parts by weight of silica fume, 5 to 25 parts by weight of limestone powder, 30 to 80 parts by weight of at least one of ground blast furnace slag or fly ash, at least one chemical admixture, water, and 70 to 150 parts by weight of aggregate having a largest aggregate diameter of 1.2 to 3.5 mm.Type: GrantFiled: August 19, 2013Date of Patent: August 25, 2015Assignee: TAISEI CORPORATIONInventors: Yoshihiro Tanaka, Jun Sakamoto, Osamu Hashimoto
-
Publication number: 20150166414Abstract: A cementitious matrix in which the development of early strength is fast, the hydration heat temperature is small, and the amount of shrinkage during curing is small, while keeping the fluidity when concrete is fresh, is provided. The cementitious matrix is characterized by comprising 100 parts by weight of Portland cement, 5 to 30 parts by weight of silica fume, 5 to 25 parts by weight of limestone powder, 30 to 80 parts by weight of at least one of ground blast furnace slag or fly ash, at least one chemical admixture, water, and 70 to 150 parts by weight of aggregate having a largest aggregate diameter of 1.2 to 3.5 mm.Type: ApplicationFiled: August 19, 2013Publication date: June 18, 2015Inventors: Yoshihiro Tanaka, Jun Sakamoto, Osamu Hashimoto
-
Publication number: 20150049442Abstract: A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.Type: ApplicationFiled: August 12, 2014Publication date: February 19, 2015Inventors: Makoto TANI, Yoshihiro TANAKA, Takashi EBIGASE
-
Publication number: 20140326168Abstract: Provided is a fiber reinforced cement based mixed material having high tensile strength and high toughness, the mixed material comprising a cementitious composition with fast development of early strength; a small hydration heat temperature; and a small shrinkage during curing. The fiber reinforced cement based mixed material contains 100 wt. parts of cement, 5-30 wt. parts of silica fume, 30-80 wt. parts of at least one pozzolanic material excluding the silica fume, 5-25 wt. parts of limestone powder, at least one chemical admixture, water, 70-150 wt. parts of aggregate having a largest aggregate diameter of 1.2-3.5 mm, and fibers, wherein at least some of the fibers comprise a fiber having asperities formed in the surface, the fiber having asperities being formed such that a ratio (h/H) of a depth h of each of recessed portions among the asperities to a smallest cross-sectional diameter H thereof is 0.05-0.8.Type: ApplicationFiled: November 14, 2012Publication date: November 6, 2014Applicant: TAISEI CORPORATIONInventors: Yoshihiro Tanaka, Osamu Hashimoto, Jun Sakamoto, Kazuhiko Nishi
-
Patent number: 8852337Abstract: Provided is a fiber reinforced cement based mixed material capable of securing high tensile strength and high toughness even after development of a crack. A fiber reinforced cement based mixed material contains cement, a mineral admixture, water, a chemical admixture, aggregate particles, and fibers, the aggregate particles contained in the fiber reinforced cement based mixed material in a proportion of 50 to 95% in terms of a weight ratio to the total weight of the cement and the mineral admixture, wherein a mean particle diameter of the aggregate particles is 0.2 to 0.8 mm, and at least some of the fibers is formed to be a bumpy fiber having asperities formed in the surface thereof, and a ratio (h/H) of a depth h of each of recessed portions among the asperities of the bumpy fiber to a smallest cross-sectional diameter H thereof is 0.05 to 0.8.Type: GrantFiled: February 7, 2012Date of Patent: October 7, 2014Assignee: Taisei CorporationInventors: Yoshihiro Tanaka, Osamu Hashimoto, Kazuhiko Nishi
-
Publication number: 20140296053Abstract: A glass-ceramics composite material suitable for a low-temperature firing use, which has high moisture resistance and thermal conductivity, is provided. In the glass-ceramics composite material which contains aluminum nitride (AlN) particles as a filler, even in a case where boron oxide (B2O3) is blended as a flux of a glass phase, by adjusting the composition of raw materials which forms the glass phase to a specific conditions to make the crystal phase which contains boron (B) precipitate at the time of firing of the glass-ceramics composite material.Type: ApplicationFiled: March 11, 2014Publication date: October 2, 2014Applicant: NGK Insulators, Ltd.Inventors: Shinsuke YANO, Yoshihiro TANAKA, Naoto OHIRA, Hirofumi YAMAGUCHI
-
Patent number: 8836660Abstract: Provided is a technique capable of allowing a person to perceive a fine relief on an object surface clearly. A tactile device of a tactile display slides above an object. The tactile device comprises three rods which are free to move up and down. Lower ends of the rods are in contact with a surface of the object. Upper ends of respective rods touch a palmar-side skin equivalent to positions of three joints of a first finger or a second finger. When the tactile device is slid, upper ends of respective rods move up and down in accordance with a surface relief of the object. In response to the movement of the tactile device, the three rods push three finger joint positions of the palmar-side skin with a stroke equal to a height of the relief.Type: GrantFiled: September 28, 2009Date of Patent: September 16, 2014Assignees: Toyota Jidosha Kabushiki Kaisha, National University Corporation Nagoya Institute of TechnologyInventors: Akihito Sano, Yoshihiro Tanaka, Hideo Fujimoto, Eisuke Kajisa, Kenji Wada
-
Publication number: 20140206522Abstract: An easily-administered technology which demonstrates the intrinsic thermal conductivity improvement effect by addition of non-oxide system compound crystal phase (filler particles) and makes it possible to sufficiently raise the thermal conductivity of a glass-ceramics composite material is provided. In the glass phase which constitutes a glass-ceramics composite material, the quantity of aluminum oxide (Al2O3) component is increased under a condition where at least either of zinc oxide (ZnO) component or magnesium oxide (MgO) component exists in a predetermined quantity or more. Thereby, the unintended reaction between a non-oxide system compound crystal phase and a glass phase can be suppressed, and the intrinsic thermal conductivity improvement effect by addition of non-oxide system compound crystal phase (filler particles) can be demonstrated.Type: ApplicationFiled: March 21, 2014Publication date: July 24, 2014Applicant: NGK Insulators, Ltd.Inventors: Shinsuke YANO, Yoshihiro TANAKA, Tsutomu NANATAKI, Hirofumi YAMAGUCHI, Natsumi SHIMOGAWA, Naoto OHIRA
-
Publication number: 20130324643Abstract: Provided is a fiber reinforced cement based mixed material capable of securing high tensile strength and high toughness even after development of a crack. A fiber reinforced cement based mixed material contains cement, a mineral admixture, water, a chemical admixture, aggregate particles, and fibers, the aggregate particles contained in the fiber reinforced cement based mixed material in a proportion of 50 to 95% in terms of a weight ratio to the total weight of the cement and the mineral admixture, wherein a mean particle diameter of the aggregate particles is 0.2 to 0.8 mm, and at least some of the fibers is formed to be a bumpy fiber having asperities formed in the surface thereof, and a ratio (h/H) of a depth h of each of recessed portions among the asperities of the bumpy fiber to a smallest cross-sectional diameter H thereof is 0.05 to 0.8.Type: ApplicationFiled: February 7, 2012Publication date: December 5, 2013Inventors: Yoshihiro Tanaka, Osamu Hashimoto, Kazuhiko Nishi