Abstract: A discrete element electrode terminal and a driving IC are formed between piezoelectric element rows. A circuit substrate is placed at a side opposite to a flow path substrate side of the driving IC. An input pad is formed on an elastic film at a position corresponding to an inter terminal of the driving IC. An output terminal of the driving IC is electrically bonded to the discrete element electrode terminal, the input terminal of the driving IC is electrically bonded to the input pad, and the input pad is electrically bonded to a substrate terminal of the circuit substrate.

Abstract: A liquid injecting head includes a flow path forming substrate in which a pressure generating chamber communicated with a nozzle opening that injects liquid is formed, a pressure generating element that is formed so as to apply pressure to the pressure generating chamber for injecting the liquid, a lead electrode that is connected to the pressure generating element, a wiring substrate having flexibility that is connected to the lead electrode, and a support member that is bonded to the wiring substrate. A fixing opening formed by perforating the wiring substrate in the thickness direction is disposed, and the wiring substrate and the support member are bonded together through an adhesive agent disposed inside the fixing opening.

Abstract: A liquid ejecting head ejects a liquid from pressure generating chambers through nozzles by varying pressure of the pressure generating chambers. The liquid ejecting head includes a nozzle plate in which the nozzles are formed. A first passage forming board is joined to the nozzle plate. A first liquid passage, including the pressure generating chambers, is formed in the first passage forming board. A second passage forming board is joined to the surface of the first liquid passage forming board and has a second liquid passage communicating with the first liquid passage. A first electrode layer electrically connected to the liquid in the first liquid passage and a second, independent, electrode layer are disposed on a vibration plate. Each of the first and second electrode layers includes a terminal drawn to the outside of a junction portion joining the first and second passage forming boards to each other.

Abstract: A method for manufacturing a liquid jet head is provided which includes a flow channel board having at least pressure-generating chambers communicating with nozzle holes and a pressure generator above one surface that applies pressure for jetting liquid to the pressure-generating chambers, and a silicon single-crystal reservoir board having at least a reservoir section that communicates with the pressure-generating chambers and that is defined by a through hole passing through the reservoir board and a step with a riser formed so as to open up the through hole at one surface. In the method, a mask pattern having an opening is formed on a reservoir-forming board intended for the reservoir board. The opening has a correction pattern on its wall and a dummy mask pattern is formed in the opening. The correction pattern serves to expose a predetermined crystal plane of the reservoir-firming board to define the riser of the step.

Abstract: A method for dividing a wafer into a plurality of chips is provided. The method includes providing recesses in a surface of the wafer at positions along boundaries between regions to become the individual chips, providing fragile portions having a predetermined width inside the wafer at positions along the boundaries by irradiation of the other surface of the wafer with a laser beam whose condensing point is placed inside the wafer, the fragile portions including connected portions at least at one of the surfaces of the wafer, and dividing the wafer at the fragile portions into the individual chips by applying an external force to the wafer.

Abstract: There is provided a liquid ejecting head unit that includes a liquid ejecting head ejecting liquid by driving a pressure generating element. The liquid ejecting head unit includes: the liquid ejecting head that includes first wiring substrates each having a connection wiring electrically connected to the pressure generating element and a support member that supports at least two first wiring substrates in different positions; a second wiring substrate that is commonly connected to the connection wirings of a plurality of the first wiring substrates electrically; and a head substrate to which the second wiring substrate is electrically connected. A connection portion connected to the head substrate is aligned on one face side of the second wiring substrate.

Abstract: A liquid ejecting head is provided which ejects liquid from nozzle openings by driving pressure generating elements, and includes: at least two rows of lead electrodes that supply an electrical signal to the pressure generating elements; and at least two wiring boards for supplying the electrical signal to the lead electrodes, wherein: the wiring boards respectively have individual wires which are electrically connected to the pressure generating elements, respectively, via the lead electrodes, and common wires which are electrically connected in common to a plurality of pressure generating elements via the lead electrodes; and, the wiring boards are formed such that a spacing between the respective common wires of the two opposing wiring boards is narrower than a spacing between the respective individual wires of the two opposing wiring boards.

Abstract: A break pattern is formed on a silicon wafer using an anisotropic etching process. The break pattern includes a plurality of through holes, each of having a first plane perpendicular to a plane defined by the silicon wafer, a second plane opposite to the first plane, a third plane that is perpendicular to the plane of the silicon wafer and intersects the first plane at an acute angle, and a fourth plane that is opposite to the third plane, is perpendicular to the plane of the silicon wafer, and intersects the second plane at an acute angle. The anisotropic etching is performed using a mask pattern having a predetermined shape to form, around the break pattern, a thin portion that has a smaller thickness than other portions of the silicon wafer. The silicon wafer is then divided into a plurality of silicon substrates along the break pattern.

Abstract: A liquid injecting head includes a flow path forming substrate in which a pressure generating chamber communicated with a nozzle opening that injects liquid is formed, a pressure generating element that is formed so as to apply pressure to the pressure generating chamber for injecting the liquid, a lead electrode that is connected to the pressure generating element, a wiring substrate having flexibility that is connected to the lead electrode, and a support member that is bonded to the wiring substrate. A fixing opening formed by perforating the wiring substrate in the thickness direction is disposed, and the wiring substrate and the support member are bonded together through an adhesive agent disposed inside the fixing opening.

Abstract: Disclosed are a liquid-jet apparatus, and the liquid-jet head unit including: a liquid-jet head in which nozzle orifices for ejecting ink droplets are arranged in parallel lines; and a head case fixed to the liquid-jet head. A linear expansion coefficient in a reference direction, which is a direction in which the nozzle orifices of the head case are arranged in parallel lines, is set less than a linear expansion coefficient thereof in a direction orthogonal to the reference direction.

Abstract: A liquid ejection head includes a flow channel-forming substrate having a plurality of pressure-generating chambers communicated with nozzles configured to eject droplets, the plurality of pressure-generating chambers being arranged in parallel with each other; a plurality of pressure-applying units configured to apply pressure to interiors of the pressure-generating chambers; and a joining substrate joined onto one surface of the flow channel-forming substrate. The flow channel-forming substrate includes a silicon single crystal substrate having a (110) plane orientation and has a side surface extending in a longitudinal direction of the pressure-generating chambers, the side surface being composed of a first (111) plane perpendicular to a (110) plane.

Abstract: A liquid ejecting head which includes a flow passage forming substrate that has pressure generating chambers which communicate with nozzles capable of ejecting a liquid, pressure generating elements which apply pressure to the pressure generating chambers in order to eject the liquid from the nozzles, lead electrodes that supply electric signals to the pressure generating elements, wiring substrates that supply the electric signals to the lead electrodes, and a supporting member that supports the wiring substrates so as to raise the wiring substrates from a surface of the liquid ejecting head having the lead electrodes provided thereon.

Abstract: A liquid-jet head, comprising: a nozzle plate having nozzle orifices bored therein; a passage-forming substrate provided with recesses including pressure generating chambers communicating with the nozzle orifices; piezoelectric elements provided on a surface of the passage-forming substrate via a vibration plate, each piezoelectric element including a lower electrode, a piezoelectric layer, and an upper electrode; and a joining plate joined to the surface of the passage-forming substrate, where the piezoelectric elements are formed, via an adhesive layer comprising an adhesive agent, wherein a plurality of contact portions and a joining portion are provided in a region where the joining plate is joined to the passage-forming substrate, the plurality of contact portions are protruded at a predetermined height on the vibration plate, and are substantially contacted by the joining plate, and the joining portion has the adhesive layer of a thickness equal to or larger than the height of the contact portions.

Abstract: The present invention includes a passage-forming substrate on which pressure generating chambers communicating with nozzle orifices ejecting a liquid are respectively formed separately from each other, and actuator devices each including a vibration plate provided on the passage-forming substrate, wherein, a protective plate is jointed to a side of the passage-forming substrate, the side facing the actuator devices, and driver circuits for driving the actuator devices are provided on the protective plate, and wherein each of the driver circuits is provided with individual terminals to which individual electrodes of the respective actuator devices are electrically connected, and connection terminals to which an external wiring line is directly connected, and each of the driver circuits is also provided with a common terminal electrically connected to a common electrode common to more than one of the actuator devices, and with a common connection terminal which is connected to the common terminal through a cond

Abstract: A break pattern is formed on a silicon wafer using an anisotropic etching process. The break pattern includes a plurality of through holes, each of having a first plane perpendicular to a plane defined by the silicon wafer, a second plane opposite to the first plane, a third plane that is perpendicular to the plane of the silicon wafer and intersects the first plane at an acute angle, and a fourth plane that is opposite to the third plane, is perpendicular to the plane of the silicon wafer, and intersects the second plane at an acute angle. The anisotropic etching is performed using a mask pattern having a predetermined shape to form, around the break pattern, a thin portion that has a smaller thickness than other portions of the silicon wafer. The silicon wafer is then divided into a plurality of silicon substrates along the break pattern.

Abstract: A bonding structure including bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+? or more where 1.80?X?2.1, A is as defined above, and ? denotes a variation for the bonding procedure.

Abstract: A method for dividing a wafer into a plurality of chips is provided. The method includes providing recesses in a surface of the wafer at positions along boundaries between regions to become the individual chips, providing fragile portions having a predetermined width inside the wafer at positions along the boundaries by irradiation of the other surface of the wafer with a laser beam whose condensing point is placed inside the wafer, the fragile portions including connected portions at least at one of the surfaces of the wafer, and dividing the wafer at the fragile portions into the individual chips by applying an external force to the wafer.

Abstract: A liquid-jet head is provided. In the liquid-jet head, a lower electrode, as a common electrode common to a plurality of piezoelectric elements, is continuously formed as far as an outer region opposite the piezoelectric elements, an auxiliary electrode layer is provided which comprises the same layers as layers constituting a lead-out electrode, and which is electrically connected to the lower electrode located outwardly of the region opposite the piezoelectric elements, a first insulation film at least in the vicinity of an end portion of a passage-forming substrate in a direction parallel to the arrangement of the piezoelectric elements is provided with a penetrated portion in a region opposite the auxiliary electrode layer, and the auxiliary electrode layer is in contact with the lower electrode via the penetrated portion provided in the first insulation film.

Abstract: A method for manufacturing a liquid jet head is provided which includes a flow channel board having at least pressure-generating chambers communicating with nozzle holes and a pressure generator above one surface that applies pressure for jetting liquid to the pressure-generating chambers, and a silicon single-crystal reservoir board having at least a reservoir section that communicates with the pressure-generating chambers and that is defined by a through hole passing through the reservoir board and a step with a riser formed so as to open up the through hole at one surface. In the method, a mask pattern having an opening is formed on a reservoir-forming board intended for the reservoir board. The opening has a correction pattern on its wall and a dummy mask pattern is formed in the opening. The correction pattern serves to expose a predetermined crystal plane of the reservoir-firming board to define the riser of the step.

Abstract: A liquid-jet head, comprising: a nozzle plate having nozzle orifices bored therein; a passage-forming substrate provided with recesses including pressure generating chambers communicating with the nozzle orifices; piezoelectric elements provided on a surface of the passage-forming substrate via a vibration plate, each piezoelectric element including a lower electrode, a piezoelectric layer, and an upper electrode; and a joining plate joined to the surface of the passage-forming substrate, where the piezoelectric elements are formed, via an adhesive layer comprising an adhesive agent, wherein a plurality of contact portions and a joining portion are provided in a region where the joining plate is joined to the passage-forming substrate, the plurality of contact portions are protruded at a predetermined height on the vibration plate, and are substantially contacted by the joining plate, and the joining portion has the adhesive layer of a thickness equal to or larger than the height of the contact portions.