Abstract: A device includes a cutting circuit that is coupled between power supply lines in series with first and second output circuits which drive an output terminal in a push-pull manner. Each of the first and second output circuits includes a plurality of output transistors. The cutting circuit is rendered non-conductive when each of the transistors in the first and second output circuits is rendered non-conductive.

Abstract: An eyeblink measurement system 10 is a measurement apparatus for measuring a subject's eyelid position, and includes a lighting device 1 that irradiates light extending across upper to lower eyelids of the subject's eye region E, and an image measurement device 2 that has an optical axis Ia on a plane for which a plane including an irradiation optical axis La of the light is rotated by a predetermined angle ? around an axis A1 along the light to be irradiated onto the subject, obtains height information based on the position of an optical image of the light in an image imaged, and measures the eyelid position based on the height information.

Abstract: A tablet terminal 1A is a measurement apparatus for measuring a subject's eyelid position, and includes a display section 3 that generates a vertically long light emitting region to make a reflection image form on a corneal surface of the subject's eyeball, a camera 5 that images the reflection image formed by the display section 3, and an arithmetic circuit 7 that derives reflection image information concerning a size or position of the reflection image based on image data of the reflection image obtained by the camera 5, and measures the eyelid position based on the reflection image information.

Abstract: There is provided a manufacturing method of a semiconductor device including forming a first pattern of first features, according to a lithography process, in a photoresist layer disposed on a substrate, the lithography process having a minimum printable dimension and a minimum printable pitch, applying an additional layer on the photoresist layer having the first pattern formed therein, forming a second pattern of second features in the additional layer, the second features concentric with the first features, and etching portions of the substrate exposed through the second pattern. Further, in the provided method, the first features include geometrical features separated by a distance less than the dimension of minimum printable feature, and the geometrical features are disposed at a pitch less than the minimum printable pitch.

Abstract: A device includes a cutting circuit that is coupled between power supply lines in series with first and second output circuits which drive an output terminal in a push-pull manner. Each of the first and second output circuits includes a plurality of output transistors. The cutting circuit is rendered non-conductive when each of the transistors in the first and second output circuits is rendered non-conductive.

Abstract: Disclosed herein is a semiconductor device that includes: a frequency dividing circuit dividing a frequency of a first clock signal to generate second clock signals that are different in phase from one another; a multiplier circuit multiplying the second clock signals to generate a third clock signal; a data input/output terminal; data buses; and a data input/output circuit coupled between the data input/output terminal and the data buses. The data input/output circuit includes a data output circuit and a data input circuit. The data output circuit outputs read data supplied in parallel from the data buses to the data input/output terminal in serial in synchronism with the third clock signal. The data input circuit outputs write data supplied in serial from the data input/output terminal to the data buses in parallel in synchronism with a predetermined one of the second clock signals.

Abstract: Disclosed herein is an apparatus that includes: a first terminal configured to receive a serial write data signal that includes at least four bits transferred in series with each other; a second terminal configured to receive a data strobe signal; a control circuit configured to produce a plurality of internal data strobe signals in response to the data strobe signal; and a serial-to-parallel conversion circuit configured to respond to the data strobe and internal data strobe signals to convert the serial write data signal into a parallel write data signal that includes at least four bits produced in parallel to each other.

Abstract: One semiconductor device includes a clock signal buffer circuit which, in response to activation of a chip selection signal (CS_n), starts generation of an internal clock signal PCLKAR, and internal circuits which operate in synchronization with the internal clock signal PCLKAR. The clock signal buffer circuit suspends generation of the internal clock signal PCLKAR at a second timing if command signals (CA0 to CA9) indicate read commands, and suspends generation of the internal clock signal PCLKAR at a first timing which is earlier than the second timing if the command signals (CA0 to CA9) indicate active commands. According to one embodiment, an internal clock signal is generated only for periods necessary in accordance with external command signals.

Abstract: A communication control method includes: receiving data, acquired by respective terminals, through a communication network; accumulating the received data in an information recording medium; obtaining an intra-network transmission time, which is an estimated value of a maximum time taken for transmission from when the data are acquired by the respective terminals until the data are received through the communication network; determining, of the accumulated data, the data whose time from an acquisition time point when the data is acquired by the terminal until a current time is shorter than the intra-network transmission time; excluding, of the accumulated data, the data whose time is determined to be shorter than the intra-network transmission time from data used for predetermined processing; and executing the predetermined processing by using the data excluding the data whose time is determined to be shorter than the intra-network transmission time.

Abstract: A semiconductor memory device includes a memory cell array section including a plurality of memory cell arrays, a peripheral circuit section, and an internal bus connecting the plurality of memory cell arrays and the peripheral circuit section. The peripheral circuit section includes external input/output buffers, and bus interface circuits. The bus interface circuits execute conversion between data inputted/outputted in parallel to/from the memory cell arrays through the internal bus and data inputted/outputted in serial through the plurality of external input/output buffers. The bus interface circuits are densely arranged between the internal bus and the input/output buffers, so that a width d1 of the area of the plurality of bus interface circuits being arranged is narrower than a width d2 of the area of the external input/output buffers being arranged and a bus width maximum value d3 of the internal bus.

Abstract: Disclosed herein is a semiconductor device that includes: a frequency dividing circuit dividing a frequency of a first clock signal to generate second clock signals that are different in phase from one another; a multiplier circuit multiplying the second clock signals to generate a third clock signal; a data input/output terminal; data buses; and a data input/output circuit coupled between the data input/output terminal and the data buses. The data input/output circuit includes a data output circuit and a data input circuit. The data output circuit outputs read data supplied in parallel from the data buses to the data input/output terminal in serial in synchronism with the third clock signal. The data input circuit outputs write data supplied in serial from the data input/output terminal to the data buses in parallel in synchronism with a predetermined one of the second clock signals.

Abstract: Disclosed herein is a semiconductor device that includes: a measurement circuit which measures propagation time of an internal clock signal; a delay adjustment circuit which adjusts the propagation time of the internal clock signal on the basis of a result of measurement by the measurement circuit; and a data output circuit which outputs a data signal in synchronization with the internal clock signal.

Abstract: Disclosed herein is a semiconductor device that includes: a frequency dividing circuit dividing a frequency of a first clock signal to generate second clock signals that are different in phase from one another; a multiplier circuit multiplying the second clock signals to generate a third clock signal; a data input/output terminal; data buses; and a data input/output circuit coupled between the data input/output terminal and the data buses. The data input/output circuit includes a data output circuit and a data input circuit. The data output circuit outputs read data supplied in parallel from the data buses to the data input/output terminal in serial in synchronism with the third clock signal. The data input circuit outputs write data supplied in serial from the data input/output terminal to the data buses in parallel in synchronism with a predetermined one of the second clock signals.

Abstract: There is provided a manufacturing method of a semiconductor device including forming a first pattern of first features, according to a lithography process, in a photoresist layer disposed on a substrate, the lithography process having a minimum printable dimension and a minimum printable pitch, applying an additional layer on the photoresist layer having the first pattern formed therein, forming a second pattern of second features in the additional layer, the second features concentric with the first features, and etching portions of the substrate exposed through the second pattern. Further, in the provided method, the first features include geometrical features separated by a distance less than the dimension of minimum printable feature, and the geometrical features are disposed at a pitch less than the minimum printable pitch.

Abstract: In a memory module including a plurality of DRAM chips which transmit/receive a system data signal with a predetermined data width and at a transfer rate and which transmit/receive an internal data signal having a larger data width and a lower transfer rate as compared with the system data signal, the transfer rate of the system data signal is restricted. Current consumption in DRAMs constituting the memory module is large, hindering speed increases. For this memory module, a plurality of DRAM chips are stacked on an IO chip. Each DRAM chip is connected to the IO chip by a through electrode, and includes a constitution for mutually converting the system data signal and the internal data signal in each DRAM chip by the IO chip. Therefore, wiring between the DRAM chips can be shortened, and DLL having a large current consumption may be disposed only on the IO chip.

Abstract: One illustrative method disclosed herein involves forming a layer of insulating material, forming a patterned layer of photoresist above the layer of insulating material, wherein the patterned layer of photoresist has an opening defined therein, forming an internal spacer within the opening in the patterned layer of photoresist, wherein the spacer defines a reduced-size opening, performing an etching process through the reduced-size opening on the layer of insulating material to define a trench/hole type feature in the layer of insulating material, and forming a conductive structure in the trench/hole type feature in the layer of insulating material.

Abstract: In a memory module including a plurality of DRAM chips which transmit/receive a system data signal with a predetermined data width and at a transfer rate and which transmit/receive an internal data signal having a larger data width and a lower transfer rate as compared with the system data signal, the transfer rate of the system data signal is restricted. Current consumption in DRAMs constituting the memory module is large, hindering speed increases. For this memory module, a plurality of DRAM chips are stacked on an IO chip. Each DRAM chip is connected to the IO chip by a through electrode, and includes a constitution for mutually converting the system data signal and the internal data signal in each DRAM chip by the IO chip. Therefore, wiring between the DRAM chips can be shortened, and DLL having a large current consumption may be disposed only on the IO chip.

Abstract: One illustrative method disclosed herein involves forming a layer of insulating material, forming a patterned layer of photoresist above the layer of insulating material, wherein the patterned layer of photoresist has an opening defined therein, forming an internal spacer within the opening in the patterned layer of photoresist, wherein the spacer defines a reduced-size opening, performing an etching process through the reduced-size opening on the layer of insulating material to define a trench/hole type feature in the layer of insulating material, and forming a conductive structure in the trench/hole type feature in the layer of insulating material.

Abstract: Disclosed herein is an apparatus that includes: a first terminal configured to receive a serial write data signal that includes at least four bits transferred in series with each other; a second terminal configured to receive a data strobe signal; a control circuit configured to produce a plurality of internal data strobe signals in response to the data strobe signal; and a serial-to-parallel conversion circuit configured to respond to the data strobe and internal data strobe signals to convert the serial write data signal into a parallel write data signal that includes at least four bits produced in parallel to each other.

Abstract: In a memory module including a plurality of DRAM chips which transmit/receive a system data signal with a predetermined data width and at a transfer rate and which transmit/receive an internal data signal having a larger data width and a lower transfer rate as compared with the system data signal, the transfer rate of the system data signal is restricted. Current consumption in DRAMs constituting the memory module is large, hindering speed increases. For this memory module, a plurality of DRAM chips are stacked on an IO chip. Each DRAM chip is connected to the IO chip by a through electrode, and includes a constitution for mutually converting the system data signal and the internal data signal in each DRAM chip by the IO chip. Therefore, wiring between the DRAM chips can be shortened, and DLL having a large current consumption may be disposed only on the IO chip.