Abstract: In one example, an electronic device comprises a first substrate comprising a base, an electronic component over the first substrate and comprising a top side and a bottom side, a first terminal and a second terminal on the top side, and a third terminal on the bottom side, wherein the third terminal is coupled with the first substrate. The electronic device further comprises a second substrate over the electronic component, and an encapsulant over the first substrate, contacting a lateral side of the electronic component and contacting the second substrate. A first lead is coupled with and extends over the base of the first substrate, a second lead of the second substrate is coupled to the first terminal of the electronic component, and the first lead and the second lead are exposed from a top side of the encapsulant. Other examples and related methods are also disclosed herein.

Abstract: In one example, an electronic device comprises a substrate comprising a first side and a second side, a first a lead on the second side, and a cavity in the second side adjacent to the first lead, an electronic component in the cavity and comprising a first terminal, a second terminal, and a third terminal, and a device encapsulant in the cavity and contacting a lateral side of the electronic component, and contacting a lateral side of the first lead opposite to the cavity. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.

Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.

Abstract: In a content addressable memory device, before search operations in two TCAM cells connected to first and second match lines, respectively, a memory controller connects the first match line to a power source and connects the second match line to a ground, and then connects the first and second match lines to each other so as that electric potentials of the first and second match lines are the same as each other.

Abstract: A design support apparatus supports wiring design for bond wires that connect a semiconductor chip and an interposer. The design support apparatus includes a creating unit that creates simulated design data simulating occurrence of fluctuation in an arrangement position of a semiconductor chip on an interposer and occurrence of fluctuation in bond wire connection terminal positions of the interposer, and an analyzing unit that analyzes, based on the simulated design data, deficiencies in manufacturing of semiconductor devices due to the fluctuation in the arrangement position of the semiconductor chip on the interposer and the fluctuation in the bond wire connection terminal positions of the interposer.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: In a content addressable memory device, before search operations in two TCAM cells connected to first and second match lines, respectively, a memory controller connects the first match line to a power source and connects the second match line to a ground, and then connects the first and second match lines to each other so as that electric potentials of the first and second match lines are the same as each other.

Abstract: A design support apparatus supports wiring design for bond wires that connect a semiconductor chip and an interposer. The design support apparatus includes a creating unit that creates simulated design data simulating occurrence of fluctuation in an arrangement position of a semiconductor chip on an interposer and occurrence of fluctuation in bond wire connection terminal positions of the interposer, and an analyzing unit that analyzes, based on the simulated design data, deficiencies in manufacturing of semiconductor devices due to the fluctuation in the arrangement position of the semiconductor chip on the interposer and the fluctuation in the bond wire connection terminal positions of the interposer.

Abstract: A multifilament yarn composed of multiple filaments as thin as 0.5 to 1.5 dTex is used for all warp knitting yarns (1, 2) and warp weaving yarns (21 to 35-N) of a tape main body (A). As for an exposed portion on a side of a coupling head of each element covered with multiple fixing yarns (11, 11), when it is assumed that a distance from a front end of each coupling head (Eh) to an inside face of a connecting portion (Ec) is (a) while a dimension of a covered portion of an element (E) covered with the fixing yarns (11, 11) in a direction of a leg portion (El) thereof is (b), a value of a ratio (b/a) is larger than 1/2 and 4/5 or less.

Abstract: A knitted-in slide fastener in which a continuous fastener element row can be mounted stably in its dimensional meaning and firmly while breaking of a needle is prevented, so as to secure a smooth engagement of elements, wherein the continuous fastener element row is fixed and knitted-in by a fixing chain knitting yarn at the same time when a fastener tape is knitted, the fixing chain knitting yarn for the elements is knitted into plural wales of a fastener element attaching portion on one side edge of the fastener tape, warp knitting yarns to be knitted for reinforcement are entangled with a needle loop formed by a constituent yarn of at least one of wales in a foundation structure adjoining the plural wales through their needle loops but not entangled with a needle loop of the fixing chain knitting yarn through their needle loops.

Abstract: This invention provides a fastener tape and a stinger for a slide fastener constituted of a warp knitting or weaving structure and including a tape main portion and a fastener element attaching portion, wherein a warp and a weft, which are composition yarns of the fastener tape, are composed of multifilament yarns and a size of a composition filament of the warp is 1.0 to 2.0 dTex, and a size of that of the weft is 2.0 to 5.0 dTex, these sizes of the single filaments being not larger than ¼ of the conventional composition filament, thereby achieving advantages that they adapt well to a fabric when and after a slide fastener is sewed to a thin fabric having flexibility and excellent drape performance and secure tape strength and coupling strength required as a slide fastener, the fastener tape and stringer ensuring flexibility and soft feeling.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: A knitted-in slide fastener in which a continuous fastener element row can be mounted stably in its dimensional meaning and firmly while breaking of a needle is prevented, so as to secure a smooth engagement of elements, wherein the continuous fastener element row is fixed and knitted-in by a fixing chain knitting yarn at the same time when a fastener tape is knitted, the fixing chain knitting yarn for the elements is knitted into plural wales of a fastener element attaching portion on one side edge of the fastener tape, warp knitting yarns to be knitted for reinforcement are entangled with a needle loop formed by a constituent yarn of at least one of wales in a foundation structure adjoining the plural wales through their needle loops but not entangled with a needle loop of the fixing chain knitting yarn through their needle loops.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: This invention provides a knitted slide fastener, wherein at least a part of a base structure composing respective wales (W11 to W13) of a fastener element attaching portion (EF) of a fastener tape includes a ground chain knitting yarn composed of a single structure, and a partial needle loop of a fixing chain knitting yarn composes a double base structure while being interlaced only with the needle loop of the ground chain knitting yarn of the second wale (W12), the partial needle loop of a fixing chain knitting yarn to be formed on at least the second wale (W12) at a second row from the side nearest to a coupling head portion (EH) of the fastener element attaching portion (EF) among the three or more fixing chain knitting yarns of the fastener element attaching portion (EF), the knitted slide fastener being organized at a high speed with few kinds of stitches without an excess load on a needle, an element being solidly fixed.

Abstract: This invention provides a knitted slide fastener, wherein at least a part of a base structure composing respective wales (W11 to W13) of a fastener element attaching portion (EF) of a fastener tape includes a ground chain knitting yarn composed of a single structure, and a partial needle loop of a fixing chain knitting yarn composes a double base structure while being interlaced only with the needle loop of the ground chain knitting yarn of the second wale (W12), the partial needle loop of a fixing chain knitting yarn to be formed on at least the second wale (W12) at a second row from the side nearest to a coupling head portion (EH) of the fastener element attaching portion (EF) among the three or more fixing chain knitting yarns of the fastener element attaching portion (EF), the knitted slide fastener being organized at a high speed with few kinds of stitches without an excess load on a needle, an element being solidly fixed.

Abstract: Among knitting yarns forming stitches of a fastener element attaching portion of a warp knitted tape for a slide fastener composed of multiple wales, a dry heat shrinkage ratio of one or more knitting yarns disposed across adjoining wales such that they at least entangle with another knitting yarn on the wales in the fastener element attaching portion is set lower than a dry heat shrinkage ratio of other knitting yarns composing the warp knitted tape. Preferably, a multifilament yarn composed of fine filament fibers of 0.5 to 4 dTex is used for all the knitting yarns. With such a structure, fastener elements can be sewed accurately, so that a soft warp knitted tape having no hardness due to thermal setting and an excellent drape performance can be obtained, this knitted tape allowing a smooth opening/closing operation of a slider after the fastener elements are mounted.

Abstract: This invention provides a fastener tape and a stinger for a slide fastener constituted of a warp knitting or weaving structure and including a tape main portion and a fastener element attaching portion, wherein a warp and a weft, which are composition yarns of the fastener tape, are composed of multifilament yarns and a size of a composition filament of the warp is 1.0 to 2.0 dTex, and a size of that of the weft is 2.0 to 5.0 dTex, these sizes of the single filaments being not larger than ¼ of the conventional composition filament, thereby achieving advantages that they adapt well to a fabric when and after a slide fastener is sewed to a thin fabric having flexibility and excellent drape performance and secure tape strength and coupling strength required as a slide fastener, the fastener tape and stringer ensuring flexibility and soft feeling.

Abstract: Among knitting yarns forming stitches of a fastener element attaching portion of a warp knitted tape for a slide fastener composed of multiple wales, a dry heat shrinkage ratio of one or more knitting yarns disposed across adjoining wales such that they at least entangle with another knitting yarn on the wales in the fastener element attaching portion is set lower than a dry heat shrinkage ratio of other knitting yarns composing the warp knitted tape. Preferably, a multifilament yarn composed of fine filament fibers of 0.5 to 4 dTex is used for all the knitting yarns. With such a structure, fastener elements can be sewed accurately, so that a soft warp knitted tape having no hardness due to thermal setting and an excellent drape performance can be obtained, this knitted tape allowing a smooth opening/closing operation of a slider after the fastener elements are mounted.