Abstract: A method includes selecting a word line included in one of a plurality of memory mats based on a row address, where each of the plurality of memory mats includes a plurality of word lines, a plurality of bit lines, and a redundant bit line, selecting one of the bit lines included in the selected memory mat based on a column address, selecting, by a column relief circuit, the redundant bit line in place of the one of the bit lines to be selected based on the column address, in response to the column address indicating a defective address, activating the column relief circuit when the row address is supplied in response to a first command, and inactivating the column relief circuit when the row address is supplied in response to a second command.

Abstract: A semiconductor device includes a first driver circuit for supplying a first potential to a first power supply node of the sense amplifier, second and third driver circuits for supplying a second potential and a third potential to a second power supply node of the sense amplifier, and a timing control circuit for controlling operations of the first to third driver circuits. The timing control circuit includes a delay circuit for deciding an ON period of the third driver circuit. The delay circuit includes a first delay circuit having a delay amount that depends on an external power supply potential and a second delay circuit having a delay amount that does not depend on the external power supply potential, and the ON period of the third driver circuit is decided based on a sum of the delay amounts of the first and second delay circuits.

Abstract: In a semiconductor device of a stacked structure type having a control chip and a plurality of controlled chips, wherein the control chip allocates different I/O sets to the respective controlled chips and processes the I/O sets within the same access cycle, the controlled chip close to the control chip and positioned to a lower position in the stacked structure has I/O penetrating through substrate vias connected to penetrating through interconnections. The penetrating through interconnections are extended to an upper one of the controlled chips that not use the penetrating through interconnections and, as a result, all of the penetrating through interconnections have the same lengths as each other.

Abstract: Disclosed herein is a device that responds to mat selection information, which is used to select one of memory mats, and selects at least one defective address from a plurality of defective addresses which are stored, for example, in a fuse circuit. When the access address information is coincident with a selected defective address, a redundant memory cell is accessed for reading or writing data in place of a normal memory cell. In a refresh operation, on the other hand, a column addressing, including the above replacement of a normal memory cell with a redundant memory cell, is deactivated.

Abstract: In a semiconductor device of a stacked structure type having a control chip and a plurality of controlled chips, wherein the control chip allocates different I/O sets to the respective controlled chips and processes the I/O sets within the same access cycle, the controlled chip close to the control chip and positioned to a lower position in the stacked structure has I/O penetrating through substrate vias connected to penetrating through interconnections. The penetrating through interconnections are extended to an upper one of the controlled chips that not use the penetrating through interconnections and, as a result, all of the penetrating through interconnections have the same lengths as each other.

Abstract: A method of testing a semiconductor device includes providing a first wafer that includes a first surface, a second surface that is allocated at an opposite side of the first surface, a first electrode penetrating the first wafer from the first surface to the second surface, and a pad formed on the first surface and coupled electrically with the first electrode, providing a second wafer that includes a second electrode penetrating the second wafer, stacking the first wafer onto the second wafer to connect the first electrode with the second electrode such that the second surface of the first wafer faces the second wafer, probing a needle to the pad, and supplying, in such a state that the first wafer is stacked on the second wafer, a test signal to the first electrode to input the test signal into the second wafer via the first electrode and the second electrode.

Abstract: Variations of the impedance of each output driver of a semiconductor device can be reduced, and high-speed calibration is achieved. A calibration circuit including a replica circuit having the same configuration as each pull-up circuit or pull-down circuit included in an output driver of a semiconductor device is provided within a chip. During a first calibration operation, the replica circuit is provided with voltage conditions that allow the maximum current to flow through the output driver so that an impedance of the replica circuit is equal to a value of an external resistor. During a second calibration operation, table parameters obtained in the first calibration operation are used to adjust the impedance of the output driver without use of the replica circuit.

Abstract: A semiconductor device compares potential AF_G at an end of an anti-fuse element with potential VPPR. If potential AF_G is equal to or higher than potential VPPR, then the semiconductor device boosts potential VPPSVT of a power supply line that is connected to the end of the anti-fuse element. If the of the anti-fuse element and the other end thereof are connected to each other by the boosted potential, thereby making potential AF_G lower than potential VPPR, then the semiconductor device stops boosting potential VPPSVT.

Abstract: In a semiconductor device of a stacked structure type having a control chip and a plurality of controlled chips, wherein the control chip allocates different I/O sets to the respective controlled chips and processes the I/O sets within the same access cycle, the controlled chip close to the control chip and positioned to a lower position in the stacked structure has I/O penetrating through substrate vias connected to penetrating through interconnections. The penetrating through interconnections are extended to an upper one of the controlled chips that not use the penetrating through interconnections and, as a result, all of the penetrating through interconnections have the same lengths as each other.

Abstract: A method of testing a semiconductor device includes providing a first wafer that includes a first surface, a second surface that is allocated at an opposite side of the first surface, a first electrode penetrating the first wafer from the first surface to the second surface, and a pad formed on the first surface and coupled electrically with the first electrode, providing a second wafer that includes a second electrode penetrating the second wafer, stacking the first wafer onto the second wafer to connect the first electrode with the second electrode such that the second surface of the first wafer faces the second wafer, probing a needle to the pad, and supplying, in such a state that the first wafer is stacked on the second wafer, a test signal to the first electrode to input the test signal into the second wafer via the first electrode and the second electrode.

Abstract: Disclosed herein is a device that responds to mat selection information, which is used to select one of memory mats, and selects at least one defective address from a plurality of defective addresses which are stored, for example, in a fuse circuit. When the access address information is coincident with a selected defective address, a redundant memory cell is accessed for reading or writing data in place of a normal memory cell. In a refresh operation, on the other hand, a column addressing, including the above replacement of a normal memory cell with a redundant memory cell, is deactivated.

Abstract: The invention provides a semiconductor device having, in each of stacked chip dies, not only vias the number of which corresponds to the number of signals input to and output from a single chip die but also vias the number of which corresponds to the number of signals input to and output from the stacked chip dies, and switches for controlling the input and output to and from the vias. The conduction and non-conduction of the switches are controlled by means of ROMs, whereby signals from the plurality of chip dies stacked can be output in parallel. This eliminates the need of increasing the data transfer speed of each chip die in accordance with the transfer speed of the system.

Abstract: Disclosed herein is a device that includes a first terminal operatively supplied with a pulse signal, a second terminal, a set of third terminals operatively supplied with identification information, a storage unit configured to store the identification information in response to the pulse signal, and a control unit configured to electrically disconnect the first terminal from the second terminal until the storage unit stores the identification information and electrically connect the first terminal to the second terminal after the storage unit has stored the identification information. This device may be used as each of semiconductor chips that are stacked with each other.

Abstract: A semiconductor device includes a first driver circuit for supplying a first potential to a first power supply node of the sense amplifier, second and third driver circuits for supplying a second potential and a third potential to a second power supply node of the sense amplifier, and a timing control circuit for controlling operations of the first to third driver circuits. The timing control circuit includes a delay circuit for deciding an ON period of the third driver circuit. The delay circuit includes a first delay circuit having a delay amount that depends on an external power supply potential and a second delay circuit having a delay amount that does not depend on the external power supply potential, and the ON period of the third driver circuit is decided based on a sum of the delay amounts of the first and second delay circuits.

Abstract: A semiconductor device includes a memory cell array that is divided into a plurality of memory cell mats by a plurality of sense amplifier arrays. Each of the plurality of memory cell mats includes a plurality of word lines and a test circuit for performing a test control to activate, at one time, a plurality of word lines included in each of a plurality of selected memory cell mats that are not disposed adjacent each other in the plurality of memory cell mats. The memory cell mats with the plurality of activated word lines are distributed.

Abstract: There are provided a row predecoder that predocodes an address irrespective of whether the address to which access is requested is a defective address, a row main decoder that controls a sub-word driver, based on a predecode signal generated by the row predecoder, and a repair determining circuit that determines whether the address is a defective address. The row main decoder, the row predecoder, and the repair determining circuit all have a shape in which a column direction is set to be a longitudinal direction. The row predecoder and the repair determining circuit are arranged adjacent to each other in the column direction, and are arranged in parallel with the row main decoder.

Abstract: A semiconductor device compares potential AF_G at an end of an anti-fuse element with potential VPPR. If potential AF_G is equal to or higher than potential VPPR, then the semiconductor device boosts potential VPPSVT of a power supply line that is connected to the end of the anti-fuse element. If the of the anti-fuse element and the other end thereof are connected to each other by the boosted potential, thereby making potential AF_G lower than potential VPPR, then the semiconductor device stops boosting potential VPPSVT.

Abstract: There are provided are a plurality of memory mats, a sub-word driver that accesses a normal memory cell irrespective of whether a row address to which access is requested is a defective address, a sub-word driver that accesses a redundant memory cell belonging to a memory mat different from the normal memory cell indicated by the row address, when the row address is a defective address. According to the present invention, the normal memory cell and a redundant memory cell belong to memory mats different to each other, and thus the normal memory cell can be accessed concurrently with determining operation of the repair determining circuit.

Abstract: Variations of the impedance of each output driver of a semiconductor device can be reduced, and high-speed calibration is achieved. A calibration circuit including a replica circuit having the same configuration as each pull-up circuit or pull-down circuit included in an output driver of a semiconductor device is provided within a chip. During a first calibration operation, the replica circuit is provided with voltage conditions that allow the maximum current to flow through the output driver so that an impedance of the replica circuit is equal to a value of an external resistor. During a second calibration operation, table parameters obtained in the first calibration operation are used to adjust the impedance of the output driver without use of the replica circuit.

Abstract: A sense amplifier circuit, which is connected to a bit line and to an inverted bit line to which a voltage, inverted alternatively from a high level or a low level of a voltage applied to the bit line, is applied, includes a first resistance section reducing a voltage output from a memory cell through the inverted bit line, a second resistance section reducing a voltage output from a memory cell through the bit line, and an amplification section amplifying the first voltage reduced by the first resistance section and amplifying the second voltage reduced by the second resistance section.