Abstract: A radiation imaging apparatus includes a radiation detector that detects incident radiation and converts the radiation into an electric signal regarding a radiation image, a housing containing the radiation detector, a cable that electrically connects the radiation detector and an external apparatus, and a cable holder fixed to the housing and configured to hold the cable and that has a plurality of openings for routing the cable in different directions.

Abstract: A holding member includes a first opposing portion (first inner wall surface) and a second opposing portion (second inner wall surface) which oppose side wall surfaces of a lens array. Side wall surfaces of the lens array on opposite end sides with respect to a longitudinal direction of the lens array are exposed from opposite ends of the first opposing portion and opposite ends of the second opposing portion.

Abstract: An optical scanning apparatus includes a light source, a light deflecting unit, an optical member, a casing, a cover member, and a detecting unit. The cover member is provided with a first opening permitting passage of a light beam emitted from the light source, a second opening permitting passage of the light beam deflected by the deflecting unit, and third and fourth openings which are provided in positions on a side opposite from the first and second openings with respect to the deflecting unit. Through the third opening, an outflow of the air from the cover member by rotation of said deflecting unit is relatively high. Through the fourth opening, an inflow of the air into the cover member by rotation of said deflecting unit is relatively high. The detecting unit is provided at a position where the air flow blowing through the third opening hits the detecting unit.

Abstract: A semiconductor device includes a semiconductor element, a terminal electrode, and internal wiring. The semiconductor element is housed in a case. The terminal electrode is provided electrically connectable to an outside of the case. The internal wiring is provided in the case and electrically connects the semiconductor element and the terminal electrode. The internal wiring includes a fuse portion provided at a part of the internal wiring and configured to be melted by an overcurrent. The fuse portion includes a plurality of metal wires which are a group of parallel wires. Of the plurality of metal wires, a first metal wire is higher in resistance value than a second metal wire laid on an outer side relative to the first metal wire.

Abstract: The image forming apparatus stores a plurality of candidate formulas in a memory. Each of the candidate formulas is a formula for calculating a prediction formula for calculating a predicted value of the color misregistration amount based on an external exposure device temperature, which is a temperature of the atmosphere around the exposure device, an external machine temperature, and a heater temperature of a heater which heats the plurality of image forming units. The CPU determines the prediction formula from the plurality of candidate formulas according to the external exposure device temperature, the external machine temperature, and the heater temperature. The CPU calculates the predicted value of the color misregistration amount using the determined predicted formula, and performs a color misregistration correction according to the calculated predicted value.

Abstract: The object of the technique disclosed in the specification is to provide a technique in which the production cost is reduced without impairing the mechanical strength of the resin, and the heat radiation is improved. The semiconductor device relates to the technique disclosed in the specification includes an insulating substrate, a semiconductor element disposed on an upper surface of the insulating substrate, a case connected to the insulating substrate, such that the semiconductor element is accommodated inside thereof, and resin filled inside of the case, such that the semiconductor element is embedded, on the upper surface of the resin in the inside of the case, a first concave part is formed, the first concave part is formed at a position covering an entire of the semiconductor element in plan view.

Abstract: A semiconductor device includes: a base plate; a semiconductor chip mounted on the base plate; a case surrounding the semiconductor chip on the base plate; an electrode terminal connected to the semiconductor chip; a sealing material covering an upper face of the base plate, the semiconductor chip and a part of the electrode terminal in the case; and a lid fastened to the case above the sealing material, wherein the electrode terminal is not exposed on an upper face of the sealing material, and there is a gap between the upper face of the sealing material and a lower face of the lid.

Abstract: Disclosed is an image forming apparatus, including an optical scanning device, wherein the optical scanning device includes: a holding member configured to integrally hold a first cleaning member and a second cleaning member; a first guide member configured to guide a movement of the holding member; a second guide member configured to guide a movement of the holding member; a first groove portion; a second groove portion, and wherein when the holding member moves from end portions of the first guide portion and the second guide portion to an opposite side with respect to a central portion side and a first engaging portion and a second engaging portion of the holding member respectively pass in the first groove portion and the second groove portion, engagements of the first engaging portion and the second engaging portion with the first guide portion and the second guide portion are released.

Abstract: An image forming apparatus which includes an optical scanning device, wherein the optical scanning device includes: a holding member configured to integrally hold a first cleaning member and a second cleaning member; a first guide member configured to guide a movement of the holding member; and a second guide member configured to guide a movement of the holding member. A first protruding portion protrudes upward from an upper surface of the holding member and is provided at a position closer to an end portion of the holding member than the first cleaning member, and a second protruding portion protrudes upward from the upper surface of the holding member and is provided at a position closer to an end portion of the holding member than the second cleaning member. The first protruding portion and second protruding portion are provided for bending the holding member.

Abstract: An image forming apparatus includes a third link portion which is rotatably connected to said first link portion at a position between said first connecting portion and said first moving portion so that said first moving portion and said second moving portion are moved toward said drum unit by rotation of said first link portion about said first connecting portion as a rotation shaft and by rotation of said second link portion about said second connecting portion as a rotation shaft in interrelation with slide of said slidable portion, and which is rotatable relative to the apparatus main assembly. The third link portion is out of contact with the optical print head at a portion corresponding to an end portion on the optical print head side.

Abstract: A semiconductor device includes a semiconductor element, a terminal electrode, and internal wiring. The semiconductor element is housed in a case. The terminal electrode is provided electrically connectable to an outside of the case. The internal wiring is provided in the case and electrically connects the semiconductor element and the terminal electrode. The internal wiring includes a fuse portion provided at a part of the internal wiring and configured to be melted by an overcurrent. The fuse portion includes a plurality of metal wires which are a group of parallel wires. Of the plurality of metal wires, a first metal wire is higher in resistance value than a second metal wire laid on an outer side relative to the first metal wire.

Abstract: An optical scanning apparatus includes a light source, a light deflecting unit, an optical member, a casing, a cover member, and a detecting unit. The cover member is provided with a first opening permitting passage of a light beam emitted from the light source, a second opening permitting passage of the light beam deflected by the deflecting unit, and third and fourth openings which are provided in positions on a side opposite from the first and second openings with respect to the deflecting unit. Through the third opening, an outflow of the air from the cover member by rotation of said deflecting unit is relatively high. Through the fourth opening, an inflow of the air into the cover member by rotation of said deflecting unit is relatively high. The detecting unit is provided at a position where the air flow blowing through the third opening hits the detecting unit.

Abstract: Provided are a first seating face and a second seating face, to which a lower side of a holding member of an optical print head being moved from an exposure position toward a retracted position by a movement mechanism strikes in the direction of movement thereof. A light emission face of a lens array of the holding member that has abutted the first seating face and second seating face is thereby positioned on a movement path of a rubbing portion provided on a cleaning member that is inserted from an opening.

Abstract: A holding member includes a first opposing portion (first inner wall surface) and a second opposing portion (second inner wall surface) which oppose side wall surfaces of a lens array. Side wall surfaces of the lens array on opposite end sides with respect to a longitudinal direction of the lens array are exposed from opposite ends of the first opposing portion and opposite ends of the second opposing portion.

Abstract: Disclosed is an image forming apparatus, including an optical scanning device, wherein the optical scanning device includes: a holding member configured to integrally hold a first cleaning member and a second cleaning member; a first guide member configured to guide a movement of the holding member; a second guide member configured to guide a movement of the holding member; a first groove portion; a second groove portion, and wherein when the holding member moves from end portions of the first guide portion and the second guide portion to an opposite side with respect to a central portion side and a first engaging portion and a second engaging portion of the holding member respectively pass in the first groove portion and the second groove portion, engagements of the first engaging portion and the second engaging portion with the first guide portion and the second guide portion are released.

Abstract: Disclosed is an image forming apparatus includes an optical scanning device, wherein the optical scanning device includes: a holding member configured to integrally hold a first cleaning member and a second cleaning member; a first guide member configured to guide a movement of the holding member; a second guide member configured to guide a movement of the holding member, and wherein a first protruding portion that protrudes upward from an upper surface of the holding member is provided at a position closer to an end portion of the holding member than the first cleaning member, and a second protruding portion that protrudes upward from the upper surface of the holding member is provided at a position closer to an end portion of the holding member than the second cleaning member, the first protruding portion and second protruding portion being for bending the holding member.

Abstract: A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.

Abstract: An image forming apparatus includes a third link portion which is rotatably connected to said first link portion at a position between said first connecting portion and said first moving portion so that said first moving portion and said second moving portion are moved toward said drum unit by rotation of said first link portion about said first connecting portion as a rotation shaft and by rotation of said second link portion about said second connecting portion as a rotation shaft in interrelation with slide of said slidable portion, and which is rotatable relative to the apparatus main assembly. The third link portion is out of contact with the optical print head at a portion corresponding to an end portion on the optical print head side.

Abstract: The image forming apparatus stores a plurality of candidate formulas in a memory. Each of the candidate formulas are a formula for calculating a prediction formula for calculating a predicted value of the color misregistration amount based on an external exposure device temperature which is a temperature of the atmosphere around the exposure device, an external machine temperature, and a heater temperature of a heater which heats the plurality of image forming units. The CPU determines the prediction formula from the plurality of candidate formulas according to the external exposure device temperature, the external machine temperature, and the heater temperature. The CPU calculates the predicted value of the color misregistration amount using the determined predicted formula, and perform a color misregistration correction according to the calculated predicted value.

Abstract: A semiconductor package includes: an insulating substrate having a circuit pattern; a semiconductor device provided on the circuit pattern; a case surrounding the semiconductor device on the insulating substrate; an external terminal electrically connecting inside and outside of the case; an inner wire electrically connecting the circuit pattern or the semiconductor device with an inner end portion of the external terminal; a sealing resin sealing the semiconductor device and the inner wire inside the case; and a lid covering an upper surface of the sealing resin, wherein the inner wire includes a fusion portion that fuses when excessive current flows, and the lid includes a scattering prevention part covering the fusion portion while securing a gap between the scattering prevention part and the upper surface of the sealing resin, and is fixed to the upper surface of the sealing resin in a region other than the scattering prevention part.