Abstract: Provided is a light scanning apparatus, including: a light source; a rotary polygon mirror; an optical member guiding a light beam; an optical box on which the light source is mounted and which contains the rotary polygon mirror and the optical member; a cover covering an opening of the optical box; a fixation unit fixing the cover on the optical box; the cover having a dust-proof member which is sandwiched between the cover and a side wall of the optical box; and the dust-proof member including an abutment portion against which the side wall is brought into abutment, and non-abutment portions provided on both sides of the abutment portion and separated from the side wall, and the dust-proof member including a groove in one of the non-abutment portions which is located on a side opposite to another one located on a side where the fixation unit is provided.

Abstract: Provided is a light scanning apparatus, including: a light source emitting a light beam; a rotary polygon mirror deflecting the light beam so as to scan a photosensitive member with the light beam; an optical member guiding the light beam; an optical box on which the light source is mounted and which contains the rotary polygon mirror and the optical member; a cover mounted on a side wall of the optical box so as to cover an opening of the optical box, and the cover having a dust-proof member which is molded on the cover and sandwiched between the cover and the side wall of the optical box; and the dust-proof member including convex portions protruded toward the optical box and configured to contact with a top of the side wall opposed to the dust-proof member, and a concave portion provided between the convex portions and separated from the top.

Abstract: A power semiconductor device includes: an outer case; at least one press-fit terminal buried in a top surface of the outer case; and a plurality of supporting portions formed so as to protrude from the top surface of the outer case. A top end of the press-fit terminal protrudes more than top surfaces of the supporting portions from the top surface of the outer case.

Abstract: A first conductor layer is provided on a first surface of an insulating plate, and has a first volume. A second conductor layer is provided on a second surface of the insulating plate, and has a second volume. A third conductor layer is provided on a second surface of the insulating plate, and has a second volume. The third conductor layer has a mounting region thicker than the second conductor layer. The sum of the second and third volumes is greater than or equal to 70% and smaller than or equal to 130% of the first volume. A semiconductor chip is provided on the mounting region. A sealing part is formed of an insulator, and seals the semiconductor chip within a case.

Abstract: An insertion vertical electrode region and part of a case-contact horizontal electrode region of an electrode insertion part of an external electrode is inserted and molded in an intra-case insertion region of a housing case. Inserting the case-contact horizontal electrode region, which serves as part of the electrode insertion part, in the intra-case insertion region allows the upper and lower surfaces of the case-contact horizontal electrode region to be in contact with the intra-case insertion region.

Abstract: It is possible to provide a semiconductor device which can be obtained at a high reliability by warping an insulating substrate stably into a convex shape while ensuring a close contact between a cooling member and the insulating substrate. The semiconductor device includes an insulating substrate, a semiconductor element disposed on a first surface of the insulating substrate, a case connected to the insulating substrate, and a resin filled inside the case. Assuming that the thickness of the insulating substrate is denoted by t1, the thickness of the resin is denoted by t2, the linear expansion coefficient of the insulating substrate is denoted by ?1, and the linear expansion coefficient of the resin is denoted by ?2, the relationship therebetween satisfies t2?t1 and ?2??1, and a second surface of the insulating substrate opposite to the first surface thereof is warped into a convex shape.

Abstract: A semiconductor device includes: a substrate having an insulating resin and a metal pattern provided on the insulating resin; a mounted component mounted on the metal pattern; and an epoxy resin encapsulating the metal pattern and the mounted component, wherein a slit is provided in the metal pattern around the mounted component, and the insulating resin exposed from the metal pattern and the epoxy resin are brought into intimate contact with each other in the slit.

Abstract: An insertion vertical electrode region and part of a case-contact horizontal electrode region of an electrode insertion part of an external electrode is inserted and molded in an intra-case insertion region of a housing case.

Abstract: A semiconductor device includes a semiconductor element and a ceramic circuit substrate on which the semiconductor element is mounted. The ceramic circuit substrate includes a ceramic substrate having one surface and the other surface facing each other, a metal circuit board joined to the one surface of the ceramic substrate and electrically connected to the semiconductor element, and a metal heat-dissipation plate joined to the other surface of the ceramic substrate. The metal circuit board is greater in thickness than the metal heat-dissipation plate. A surface of the metal heat-dissipation plate on a side opposite to the ceramic substrate is larger in area than a surface of the metal circuit board on a side opposite to the ceramic substrate. Thereby, a semiconductor device capable of suppressing warpage of the ceramic substrate can be achieved.

Abstract: It is possible to provide a semiconductor device which can be obtained at a high reliability by warping an insulating substrate stably into a convex shape while ensuring a close contact between a cooling member and the insulating substrate. The semiconductor device includes an insulating substrate, a semiconductor element disposed on a first surface of the insulating substrate, a case connected to the insulating substrate, and a resin filled inside the case. Assuming that the thickness of the insulating substrate is denoted by t1, the thickness of the resin is denoted by t2, the linear expansion coefficient of the insulating substrate is denoted by ?1, and the linear expansion coefficient of the resin is denoted by ?2, the relationship therebetween satisfies t2?t1 and ?2??1, and a second surface of the insulating substrate opposite to the first surface thereof is warped into a convex shape.

Abstract: A semiconductor device includes: a substrate having an insulating resin and a metal pattern provided on the insulating resin; a mounted component mounted on the metal pattern; and an epoxy resin encapsulating the metal pattern and the mounted component, wherein a slit is provided in the metal pattern around the mounted component, and the insulating resin exposed from the metal pattern and the epoxy resin are brought into intimate contact with each other in the slit.

Abstract: In a conventional semiconductor device, a pattern serving as a heat dissipating material is formed by applying a phase transition material. Provided is a semiconductor device that can reduce collapse of a pattern shape even if a shock is applied to the pattern formed with the phase transition material that is liquefied when the environmental temperature is not sufficiently controlled. The semiconductor device includes semiconductor elements mounted inside a semiconductor module (10); a heat radiating surface (13), formed in the semiconductor module (10), dissipating heat generated in the semiconductor elements to a heat radiator; a pattern (14) formed on the heat radiating surface and made from a phase transition material; and a film (15) serving as a first film that covers the pattern (14).

Abstract: A semiconductor device includes an insulating substrate including a substrate, a metal pattern formed on an upper surface of the substrate, and a metal film formed on a lower surface of the substrate, a semiconductor element fixed on the metal pattern, a case surrounding the metal pattern and having a contact portion maintained in contact with the upper surface of the substrate, and an adhesive with which the case and a portion of the upper surface of the substrate outside a portion maintained in contact with the contact portion are bonded together, wherein a plurality of through holes are formed in a peripheral portion of the case, the through holes extending vertically through the case, and wherein the metal film exists in at least part of a place right below the contact portion.

Abstract: A semiconductor device includes an insulating substrate, a semiconductor element secured to a top surface of the insulating substrate, a case formed of a resin and having a frame portion surrounding the semiconductor element, a metal support located above the insulating substrate and having an end secured to the frame portion, a holding-down portion extending downward from the metal support so as to prevent upwardly convex bending of the insulating substrate, and an adhesive bonding the insulating substrate and the case together.

Abstract: A vibration damper with improved durability achieved by preventing stress concentration in a partition wall portion to avoid an excessive increase in strain in that portion. An intermediate cylinder member (20) is fitted to the inner peripheral surface of an outer cylindrical member (16), and a rubber elastic body (22) is arranged between a mounting member (18) and the intermediate cylinder member (20) to elastically connect them. A first and a second hollow cavities are formed in those regions of the rubber elastic body (22) which correspond to regions in the inner peripheral side of a small diameter portion (20B) of the intermediate cylinder member (20). Partition wall portion (22D) for partitioning the hollow cavities from each other are formed in regions of the rubber elastic body (22) between the first and second hollow cavities.

Abstract: In a vibration proofing apparatus, two second pressure receiving liquid chambers are arranged between an outer tube and a mounting attachment, and are configured to communicate with an auxiliary liquid chamber through two second orifices when an auxiliary vibration along an auxiliary amplitude direction orthogonal to an axial direction is input to the mounting attachment, a rubber elastic body is elastically deformed along an auxiliary amplitude direction, and expands and contracts an internal volume of the second pressure receiving liquid chambers. At this time, since a resonance phenomenon is generated in the liquid circulating between the second pressure receiving liquid chambers and the auxiliary liquid chamber through the second orifices in synchronization with the input auxiliary vibration, a low-frequency vibration input along the auxiliary amplitude direction due to a pressure change, and a viscous resistance generated together with the resonance phenomenon of the liquid is effectively absorbed.

Abstract: A vibration isolator having a pair of pressure receiving fluid chambers between an outer cylinder and a mounting member, at two end sides along a main amplitude direction. A rubber elastic body changes the internal volumes of the pair of pressure receiving fluid chambers in directions opposite to each other, and fluid flows from the pressure receiving fluid chambers to an auxiliary fluid chamber through one of two orifices and flows from the auxiliary fluid chamber to the pressure receiving fluid chambers through the other orifice. Since a fluid pressure in the auxiliary fluid chamber is kept approximately constant, the fluid in the pair of pressure receiving fluid chambers smoothly flows, with a low resistance, into the auxiliary fluid chamber through the orifices. Therefore, any rise of the fluid pressure in the pressure receiving fluid chambers may be suppressed, such that rise of the dynamic spring constant may be suppressed.

Abstract: A vibration damper with improved durability achieved by preventing stress concentration in a partition wall portion to avoid an excessive increase in strain in that portion. An intermediate cylinder member (20) is fitted to the inner peripheral surface of an outer cylindrical member (16), and a rubber elastic body (22) is arranged between a mounting member (18) and the intermediate cylinder member (20) to elastically connect them. A first and a second hollow cavities are formed in those regions of the rubber elastic body (22) which correspond to regions in the inner peripheral side of a small diameter portion (20B) of the intermediate cylinder member (20). Partition wall portion (22D) for partitioning the hollow cavities from each other are formed in regions of the rubber elastic body (22) between the first and second hollow cavities.

Abstract: The present invention can effectively attenuate and absorb an auxiliary vibration even in the case that the auxiliary vibration input along a direction approximately orthogonal to a main vibration input along an axial direction of the apparatus, in addition that it is possible to effectively attenuate and absorb the main vibration while suppressing an engagement of a size of the apparatus. In a vibration proofing apparatus (210), two second pressure receiving liquid chambers (302A, 302B) are arranged between an outer tube (224) and a mounting attachment (226), and two second pressure receiving liquid chambers (302A, 302B) are communicated with an auxiliary liquid chamber (272) through two second orifices (308A, 308B).

Abstract: A vibration isolator capable of efficiently increasing damping against inputted vibration provided by a fluid flowing in a restrict passage and also suppressing the rise of a dynamic spring constant when vibration is inputted therein. In the vibration isolator 10, a pair of pressure receiving fluid chambers 46 and 48 are disposed, between an outer cylinder 12 and a mounting member 20, at one end side and at the other end side along a main amplitude direction. Since a rubber elastic body 22 changes the internal volumes of the pair of pressure receiving fluid chambers 46 and 48 in directions opposite to each other, and fluid flows from the pressure receiving fluid chambers 46 and 48 to an auxiliary fluid chamber 30 through one of orifices 62 and 64 and flows from the auxiliary fluid chamber 30 to the pressure receiving fluid chambers 46 and 48 through the other of the orifices 62 and 64.