Abstract: A simple structure is provided to move an optical print head toward a photosensitive drum. An image forming apparatus includes an optical print head having a first link portion and a second link portion, a sliding portion configured to move by sliding as to an image forming apparatus main body, and an abutting portion where one end of the optical print head abuts. When the sliding portion moves by sliding, the first link portion and the second link portion pivot as to the sliding portion, with the one end of the optical print head abutting the abutting portion, and the optical print head moves toward the photosensitive drum.

Abstract: A light scanning apparatus including: a light source; a rotary polygon mirror configured to deflect a light beam emitted from the light source; an optical component of an incident optical system configured to introduce the light beam to the rotary polygon mirror; an optical box configured to contain the rotary polygon mirror and the optical component; and a supporting base installed between the light source and the rotary polygon mirror and configured to support the optical component, wherein the supporting base includes: a first dust-proof member configured to seal a boundary portion between the optical box and the supporting base; and a protrusion configured to enter an opening, which is formed in a side wall of the optical box from the inside of the optical box in a state in which the supporting base is mounted to the optical box, the light source being fixed to the opening.

Abstract: An image forming apparatus has a holding member that holds a lens array and a circuit board. In the holding member, a portion where a light emission portion is attached, a portion where the lens array is attached, a portion where the circuit board is attached, and a portion where a first link member and a second link member are connected, are integrally molded as a molded resin article.

Abstract: An opening, from which a cleaning member is inserted from the outer side of a main body of the image forming apparatus according to the present invention, is provided further toward the front side than an end portion of a front side of a holding member. The opening guides movement of the cleaning member in the direction of insertion as the inserted cleaning member moves toward the downstream side in the direction of insertion, so that downstream-side end portions of engaging portions in the insertion direction engage upstream-side end portions of protruding portions formed on the holding member in the direction of insertion.

Abstract: A semiconductor package includes: an insulating substrate having a circuit pattern; a semiconductor device provided on the circuit pattern; a case surrounding the semiconductor device on the insulating substrate; an external terminal electrically connecting inside and outside of the case; an inner wire electrically connecting the circuit pattern or the semiconductor device with an inner end portion of the external terminal; a sealing resin sealing the semiconductor device and the inner wire inside the case; and a lid covering an upper surface of the sealing resin, wherein the inner wire includes a fusion portion that fuses when excessive current flows, and the lid includes a scattering prevention part covering the fusion portion while securing a gap between the scattering prevention part and the upper surface of the sealing resin, and is fixed to the upper surface of the sealing resin in a region other than the scattering prevention part.

Abstract: The length of an abutting pin of an optical print head is decided such that the upper end of the abutting pin when at a cleaning position is on the opposite side of a movement path of a cleaning member, from the upper end of another abutting pin of the optical print head when in an exposure position.

Abstract: An exposing unit includes a holding member, an abutting pin protruding on both sides in the vertical direction at the rear side of the holding member, a second support portion provided further to the rear side than the holding member, and a movement mechanism that causes the holding member to move between an exposure position and a retracted position. The second support portion has a gap formed where the rear side of the holding member moves in the vertical direction, and this gap restricts movement of the holding member in the left-and-right direction. The holding member that is moved from the retracted position toward the exposure position by the movement mechanism is guided by the gap formed in the second support portion so that the abutting pin abuts a fitting portion.

Abstract: A light scanning apparatus including: a light source; a rotary polygon mirror configured to deflect a light beam emitted from the light source; an optical component of an incident optical system configured to introduce the light beam to the rotary polygon mirror; an optical box configured to contain the rotary polygon mirror and the optical component; and a supporting base installed between the light source and the rotary polygon mirror and configured to support the optical component, wherein the supporting base includes: a first dust-proof member configured to seal a boundary portion between the optical box and the supporting base; and a protrusion configured to enter an opening, which is formed in a side wall of the optical box from the inside of the optical box in a state in which the supporting base is mounted to the optical box, the light source being fixed to the opening.

Abstract: A semiconductor device includes: a base plate; an insulating substrate provided on an upper surface of the base plate; a conductive pattern provided on an upper surface of the insulating substrate; a semiconductor chip mounted on an upper surface of the conductive pattern; a case surrounding the base plate, the insulating substrate, the conductive pattern, and the semiconductor chip; a sealing resin sealing an interior of the case; and an external connection terminal provided to the case. One end portion of the external connection terminal is connected to the conductive pattern, the case has a terminal insertion portion enabling insertion of the other end portion of the external connection terminal in a peripheral wall portion thereof, and a portion of the external connection terminal other than the other end portion is sealed by the sealing resin with the other end portion being inserted in the terminal insertion portion.

Abstract: The object of the technique disclosed in the specification is to provide a technique in which the production cost is reduced without impairing the mechanical strength of the resin, and the heat radiation is improved. The semiconductor device relates to the technique disclosed in the specification includes an insulating substrate, a semiconductor element disposed on an upper surface of the insulating substrate, a case connected to the insulating substrate, such that the semiconductor element is accommodated inside thereof, and resin filled inside of the case, such that the semiconductor element is embedded, on the upper surface of the resin in the inside of the case, a first concave part is formed, the first concave part is formed at a position covering an entire of the semiconductor element in plan view.

Abstract: In a semiconductor device, an outer peripheral case body has guiding portions formed therein as a plurality of recesses. The plurality of guiding portions each include an upper end opening. The outer peripheral case body has inner peripheral side openings formed in its inner peripheral surface, each of which is continuous with the upper end opening, extends from an upper end face toward a base body and is continuous with the guiding portion. The first insertion portion is inserted into a first guiding portion of the plurality of guiding portions. The first external terminal portion is continuous with the first insertion portion and extends through the upper end opening in the first guiding portion to outside of the outer peripheral case body. The first connection terminal portion is continuous with the first insertion portion and connected to a conductive pattern through the inner peripheral side opening.

Abstract: A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.

Abstract: Provided is a technique of reducing detachment of a sealing resin in a semiconductor device, thereby achieving an increased improvement in lifetime of the semiconductor device. The semiconductor device includes the following: an insulating substrate; a metal block disposed on the upper surface of the insulating substrate; a semiconductor element mounted on the upper surface of the metal block; a case enclosing the semiconductor element, the metal block, and the insulating substrate; and a sealing resin sealing the semiconductor element and the metal block. The metal block includes at least one groove on a surface of the metal block, the surface being in contact with the sealing resin. The opening of the at least one groove has a width narrower than a width of the bottom surface of the at least one groove.

Abstract: A semiconductor device includes: a base plate; a semiconductor chip mounted on the base plate; a case surrounding the semiconductor chip on the base plate; an electrode terminal connected to the semiconductor chip; a sealing material covering an upper face of the base plate, the semiconductor chip and a part of the electrode terminal in the case; and a lid fastened to the case above the sealing material, wherein the electrode terminal is not exposed on an upper face of the sealing material, and there is a gap between the upper face of the sealing material and a lower face of the lid.

Abstract: An opening, from which a cleaning member is inserted from the outer side of a main body of the image forming apparatus according to the present invention, is provided further toward the front side than an end portion of a front side of a holding member. The opening guides movement of the cleaning member in the direction of insertion as the inserted cleaning member moves toward the downstream side in the direction of insertion, so that downstream-side end portions of engaging portions in the insertion direction engage upstream-side end portions of protruding portions formed on the holding member in the direction of insertion.

Abstract: An image forming apparatus has a holding member that holds a lens array and a circuit board. In the holding member, a portion where a light emission portion is attached, a portion where the lens array is attached, a portion where the circuit board is attached, and a portion where a first link member and a second link member are connected, are integrally molded as a molded resin article.

Abstract: An exposing unit includes a holding member, an abutting pin protruding on both sides in the vertical direction at the rear side of the holding member, a second support portion provided further to the rear side than the holding member, and a movement mechanism that causes the holding member to move between an exposure position and a retracted position. The second support portion has a gap formed where the rear side of the holding member moves in the vertical direction, and this gap restricts movement of the holding member in the left-and-right direction. The holding member that is moved from the retracted position toward the exposure position by the movement mechanism is guided by the gap formed in the second support portion so that the abutting pin abuts a fitting portion.

Abstract: Provided are a first seating face and a second seating face, to which a lower side of a holding member of an optical print head being moved from an exposure position toward a retracted position by a movement mechanism strikes in the direction of movement thereof. A light emission face of a lens array of the holding member that has abutted the first seating face and second seating face is thereby positioned on a movement path of a rubbing portion provided on a cleaning member that is inserted from an opening.

Abstract: The length of an abutting pin of an optical print head is decided such that the upper end of the abutting pin when at a cleaning position is on the opposite side of a movement path of a cleaning member, from the upper end of another abutting pin of the optical print head when in an exposure position.

Abstract: A simple structure is provided to move an optical print head toward a photosensitive drum. An image forming apparatus includes an optical print head having a first link portion and a second link portion, a sliding portion configured to move by sliding as to an image forming apparatus main body, and an abutting portion where one end of the optical print head abuts. When the sliding portion moves by sliding, the first link portion and the second link portion pivot as to the sliding portion, with the one end of the optical print head abutting the abutting portion, and the optical print head moves toward the photosensitive drum.