Abstract: According to one embodiment, a superconducting coil apparatus comprising at least one superconducting coil formed of a plurality of turns under a definition that one turn is a portion of a superconducting wire annularly wound for one round, wherein: the superconducting coil has a shape along an outer peripheral surface of a tubular structure having a tubular shape; each of the plurality of turns has a coil longitudinal portion extending along an axial direction of the tubular structure; arrangement form of the coil longitudinal portion is different between a main magnetic field generation region configured to generate a main magnetic field and a magnetic field correction region configured to generate a correction magnetic field.

Abstract: A standard calibration solution includes water, a non-alcoholic solvent that is mixed with water, and a steroid hormone, and a content of the non-alcoholic solvent is 10% by volume or more and 50% by volume or less. The standard calibration solution is used for quantitative measurement using a mass spectrometry device.

Abstract: According to one embodiment, an X-ray diagnosis apparatus includes a table, an imaging unit, and processing circuitry. The table includes a table top on which a subject is placed. The imaging unit includes an X-ray tube which emits X-rays to the subject and an X-ray detector which detects the X-rays. The processing circuitry detects contact between an object and at least one of the imaging unit and the table. The processing circuitry executes control to display contact position information relating to a position in contact with the object based on a detection result.

Abstract: The present invention relates to improvement of blocking resistance when a water-based dispersion containing polylactic acid as a dispersoid is used as a heat sealant. Provided is an aqueous dispersion obtained by dispersing a dispersoid containing polylactic acid and carnauba wax in a water-based dispersion medium, in which 1 to 14% by mass of the carnauba wax is blended relative to a mass of the polylactic acid.

Abstract: A multilayer ceramic capacitor includes first dielectric ceramic layers each with a thickness of about 0.48 ?m or more and about 0.50 ?m or less in the lamination direction, and additional dielectric ceramic layers each with a thickness of about 10 ?m or more and about 15 ?m or less in the width direction. A number of dielectric particles in each first dielectric ceramic layer in a thickness direction is three or more and six or less. A number of dielectric particles in each additional dielectric ceramic layer in a thickness direction is 100 or more and 150 or less. When the number of dielectric particles in each of first dielectric ceramic layer is NT, and the number of dielectric particles in each additional dielectric ceramic layer is NW, a ratio of NT to NW is about 1:23.08 or more and about 1:46.15 or less.

Abstract: A multilayer ceramic capacitor includes first dielectric ceramic layers each with a thickness of about 0.48 ?m or more and about 0.50 ?m or less in the lamination direction, and additional dielectric ceramic layers each with a thickness of about 10 ?m or more and about 15 ?m or less in the width direction. A number of dielectric particles in each first dielectric ceramic layer in a thickness direction is three or more and six or less. A number of dielectric particles in each additional dielectric ceramic layer in a thickness direction is 100 or more and 150 or less. When the number of dielectric particles in each of first dielectric ceramic layer is NT, and the number of dielectric particles in each additional dielectric ceramic layer is NW, a ratio of NT to NW is about 1:23.08 or more and about 1:46.15 or less.

Abstract: A mounting structure of an electronic component includes a multilayer ceramic capacitor including lands on a board and spaced apart from each other, solder on the lands, and a component main body including external electrodes on both end portions of the component main body in a length direction, each of the pair of external electrodes being connected to a corresponding one of the pair of lands via the solder. When a separation direction of the lands is an X direction and a direction orthogonal or substantially orthogonal to the X direction is a Y direction, when a width dimension of the land along the Y direction is c, a dimension of each of the external electrodes in the X direction is e, and a gap between the land and the external electrode is Gap, 3.4<(c×e)/Gap<258.8 is satisfied.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, first and second main surfaces opposing each other in a lamination direction, first and second end surfaces opposing each other in a length direction which intersects the lamination direction, and first and second side surfaces opposing each other in a width direction which intersects the lamination direction and the length direction, and external electrodes on the first and second end surfaces, and each electrically connected to the internal electrode layers, wherein the multilayer body includes a slit in at least one of the first side surface, the second side surface, and the second main surface defining and functioning as a board-mounting surface.

Abstract: A multilayer ceramic capacitor includes first dielectric ceramic layers each with a thickness of about 0.48 ?m or more and about 0.50 ?m or less in the lamination direction, and additional dielectric ceramic layers each with a thickness of about 10 ?m or more and about 15 ?m or less in the width direction. A number of dielectric particles in each first dielectric ceramic layer in a thickness direction is three or more and six or less. A number of dielectric particles in each additional dielectric ceramic layer in a thickness direction is 100 or more and 150 or less. When the number of dielectric particles in each of first dielectric ceramic layer is NT, and the number of dielectric particles in each additional dielectric ceramic layer is NW, a ratio of NT to NW is about 1:23.08 or more and about 1:46.15 or less.

Abstract: A piezoelectric speaker comprises a frame, a piezoelectric element, a diaphragm, an edge, a spacer, a cover and a supporting portion. The frame has an upper surface and a lower surface in an up-down direction. The diaphragm has an outer peripheral end in a horizontal plane perpendicular to the up-down direction. The cover has an outer peripheral end in the horizontal plane. In the horizontal plane, the outer peripheral end of the diaphragm is positioned inside the outer peripheral end of the cover. The edge supports the outer peripheral end of the diaphragm so that the outer peripheral end of the diaphragm is freely vibratable. The spacer is fixed to both of the piezoelectric element and the diaphragm in the up-down direction. The cover is positioned above the diaphragm in the up-down direction. The supporting portion is positioned on the frame and supports the cover.

Abstract: A sealing device includes: an annular seal that is disposed on an outer periphery of a rod of a hydraulic cylinder further on a side of an extending direction than a cylinder head of the hydraulic cylinder and that has a pair of opposing first facing surfaces; a holding member disposed on an outer periphery of the seal; and a fixing member disposed on an outer periphery of the holding member, the fixing member having a tapered inner surface that contacts an outer surface of the holding member and that has an inner diameter increasing toward a retracting direction.

Abstract: A sealing device includes: an annular seal that is disposed on an outer periphery of a rod of a hydraulic cylinder further on a side of an extending direction than a cylinder head of the hydraulic cylinder and that has a pair of opposing first facing surfaces; a holding member disposed on an outer periphery of the seal; and a fixing member disposed on an outer periphery of the holding member, the fixing member having a tapered inner surface that contacts an outer surface of the holding member and that has an inner diameter increasing toward a retracting direction.

Abstract: Provided is a photoelectric conversion element comprising ITiO as a transparent electrode that is formed using an inline-type sputtering method, and utilizing the high transmittance up to the near-infrared ray region and excellent conductivity of ITiO. Using the inline-type sputtering method, a first transparent conductive oxide film 8 comprising indium oxide or tin-containing indium oxide that includes indium oxide as a main component and tin at an atomic ratio Sn/(In+Sn) of 19 atomic % or less is formed on a photoelectric conversion layer 7 side, and a second transparent conductive oxide film 9 comprising a titanium-containing indium oxide that includes indium oxide as a main component, and titanium at an atomic ratio Ti/(In+Ti) of 0.5 atomic % to 3.5 atomic % is laminated on an opposite side of the first transparent conductive film 8 from the photoelectric conversion layer 7.

Abstract: A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided. The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.

Abstract: A piezoelectric speaker according to one aspect of the present disclosure includes: a plurality of piezoelectric elements; a plurality of diaphragms vibrated by expansion/contraction of the plurality of piezoelectric elements, the plurality of diaphragms each having a rectangular principal surface; and a cover that has a box shape and is arranged to cover one surface of the principal surface of each of the diaphragms, the cover being arranged so that an air chamber is formed between the cover and the one surface of the principal surface of each of the diaphragms, in which the lengths of the long sides of the principal surfaces of the plurality of diaphragms are different from one another, and the cover includes an opening formed on one of surfaces of the cover perpendicular to the principal surface of each of the diaphragms.

Abstract: To divide a semiconductor wafer by stealth dicing, a test pad in a cutting region and an alignment target are collectively arranged along one side in a width direction of the cutting region, and a laser beam for forming a modified region is irradiated to a position away in plane from the test pad and the alignment target Am. In this manner, defects in cutting shape in a cutting process of a semiconductor wafer using stealth dicing can be reduced or prevented.

Abstract: Provided is a photoelectric conversion element comprising ITiO as a transparent electrode that is formed using an inline-type sputtering method, and utilizing the high transmittance up to the near-infrared ray region and excellent conductivity of ITiO. Using the inline-type sputtering method, a first transparent conductive oxide film 8 comprising indium oxide or tin-containing indium oxide that includes indium oxide as a main component and tin at an atomic ratio Sn/(In+Sn) of 19 atomic % or less is formed on a photoelectric conversion layer 7 side, and a second transparent conductive oxide film 9 comprising a titanium-containing indium oxide that includes indium oxide as a main component, and titanium at an atomic ratio Ti/(In+Ti) of 0.5 atomic % to 3.5 atomic % is laminated on an opposite side of the first transparent conductive film 8 from the photoelectric conversion layer 7.

Abstract: To divide a semiconductor wafer by stealth dicing, a test pad in a cutting region and an alignment target are collectively arranged along one side in a width direction of the cutting region, and a laser beam for forming a modified region is irradiated to a position away in plane from the test pad and the alignment target Am. In this manner, defects in cutting shape in a cutting process of a semiconductor wafer using stealth dicing can be reduced or prevented.

Abstract: A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided. The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.

Abstract: A piezoelectric speaker (100, 200, . . . , or 500) includes a piezoelectric element (1), and a metal vibration part (2, 22, . . . , or 352) to which the piezoelectric element (1) is made to adhere through an adhesive part (3). The piezoelectric element (1) is a substantially rectangular plate. The metal vibration part (2, 22, . . . , or 352) includes a substantially rectangular plate-shaped part (2, 12a, 32a, . . . , 132a, or the like) vibrated by the piezoelectric element. A frequency of a natural vibration mode of the piezoelectric element (1) and a frequency of a natural vibration mode of the metal vibration part (2, 12a, 32a, . . . , 132a, or the like) are set to be different from each other.