Patents by Inventor Yoshiyuki Yoneda

Yoshiyuki Yoneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5654243
    Abstract: A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate of a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.
    Type: Grant
    Filed: August 14, 1996
    Date of Patent: August 5, 1997
    Assignee: Fujitsu Limited
    Inventors: Yoshiyuki Yoneda, Kazuto Tsuji
  • Patent number: 5625222
    Abstract: A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate at a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.
    Type: Grant
    Filed: July 27, 1994
    Date of Patent: April 29, 1997
    Assignee: Fujitsu Limited
    Inventors: Yoshiyuki Yoneda, Kazuto Tsuji
  • Patent number: 5569625
    Abstract: A semiconductor process includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is formed between the stage and one electrode member and a second gap is formed between two electrode members, a plurality of leads including inner leads which are wire bonded to at least one of the semiconductor chip and the electrode members and electrically connected thereto, and a resin package which encapsulates the semiconductor chip, the stage, the electrode members and the inner leads by a resin. The resin fills the first and second gaps, so that the stage and the one electrode member are isolated and the two electrode members are isolated.
    Type: Grant
    Filed: November 22, 1994
    Date of Patent: October 29, 1996
    Assignee: Fujitsu Limited
    Inventors: Yoshiyuki Yoneda, Kazuto Tsuji, Junichi Kasai, Hideharu Sakoda
  • Patent number: 5521432
    Abstract: A semiconductor device includes a semiconductor chip, a die-pad on which the semiconductor chip is mounted, a package encapsulating the die pad and the semiconductor chip, and a plurality of leads electrically connected to the semiconductor chip and projecting from the package, wherein each of the leads has a lead body made of pure nickel (Ni) having a purity equal to or greater than 99% and a first film formed thereon, the first film being made of palladium (Pd).
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: May 28, 1996
    Assignee: Fujitsu Limited
    Inventors: Kazuto Tsuji, Yoshiyuki Yoneda, Junichi Kasai, Michio Sono
  • Patent number: 5497032
    Abstract: A semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.
    Type: Grant
    Filed: March 16, 1994
    Date of Patent: March 5, 1996
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited
    Inventors: Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi, Toshio Hamano, Yoshihiro Kubota, Michio Hayakawa, Yoshihiko Ikemoto, Yukio Saigo, Naomi Miyaji
  • Patent number: 5475259
    Abstract: A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
    Type: Grant
    Filed: October 16, 1992
    Date of Patent: December 12, 1995
    Assignees: Fujitsu Limited, Kyushu Fujitsu Electronics Limited, Fujitsu Automation Limited
    Inventors: Junichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo, Yoshiyuki Yoneda, Masashi Takenaka
  • Patent number: 5440170
    Abstract: A semiconductor device employs a lead frame including a die pad (24) and a plurality of leads (25) provided outside the die pad, and is manufactured by sealing the die pad and its periphery by a resin after the die pad is fitted with the semiconductor chip (11). The die pad (24) is formed separately from the main part of the lead frame provided with leads, and is rounded at an entire outermost edge thereof and includes a flat plate shape. This die pad can be either formed rounded with ceramic or resin, or formed in metal and given a rounded edge through honing.
    Type: Grant
    Filed: June 29, 1992
    Date of Patent: August 8, 1995
    Assignee: Fujitsu Limited
    Inventors: Kazuto Tsuji, Yoshiyuki Yoneda, Junichi Kasai
  • Patent number: 5399804
    Abstract: A semiconductor device includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is formed between the stage and one electrode member and a second gap is formed between two electrode members, a plurality of leads including inner leads which are wire bonded to at least one of the semiconductor chip and the electrode members and electrically connected thereto, and a resin package which encapsulates the semiconductor chip, the stage, the electrode members and the inner leads by a resin. The resin fills the first and second gaps, so that the stage and the one electrode member are isolated and the two electrode members are isolated.
    Type: Grant
    Filed: January 4, 1993
    Date of Patent: March 21, 1995
    Assignee: Fujitsu Limited
    Inventors: Yoshiyuki Yoneda, Kazuto Tsuji, Junichi Kasai, Hideharu Sakoda
  • Patent number: 5246492
    Abstract: The present invention provides a paint composition which contains a non-glorious color pigment and a scaly glorious color pigment, wherein both the contained non-glorious color pigment and scaly glorious color pigment are selected so as not to be similar colors.
    Type: Grant
    Filed: June 14, 1990
    Date of Patent: September 21, 1993
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Masamichi Arima, Yoshiyuki Yoneda, Tetsuo Masuno
  • Patent number: 4742692
    Abstract: The present invention includes a method of air-conditioning which forms, in a space to be air-conditioned, a plurality of circulating flows of air respectively blown through air outlets of an air-conditioning system disposed at predetermined positions within this space and which successively repeats two steps: a first step of changing the effective range of at least one of the circulating flows; and a second step of returning that circulating flow or flows as effected in the first step to the effective range thereof which obtained before the first step, and an air-conditioning system for carrying out this method, which forms, in a space to be air-conditioned, a plurality of circulating flows of air respectively blown through air outlets of an air-conditioning system disposed at predetermined positions within the space and which comprises: a means for changing the effective range of at least one of the circulating flows and returning that circulating flow or flows as changed to the effective range thereof whic
    Type: Grant
    Filed: November 7, 1986
    Date of Patent: May 10, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Yoshiyuki Yoneda, Tadashi Gotoh, Masanori Yamakawa, Masakazu Matsumoto, Hisashi Yamamoto