Patents by Inventor You MING

You MING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151623
    Abstract: A method of assessing a bodily fluid sample on a test strip may involve applying a periodic signal with a first electrode located at a first location in a microfluidic channel of the test strip, monitoring the applied periodic signal with a second electrode located at a second location in the microfluidic channel, and using a third electrode located at a third location in the microfluidic channel as a reference electrode. The method may also include: collecting the bodily fluid sample in the microfluidic channel; continuing to apply the periodic signal, monitor the periodic signal and use the third electrode as a reference electrode while collecting the bodily fluid sample; and determining that the bodily fluid sample is sufficient for analyzing, based at least in part on the applied and monitored periodic signal.
    Type: Application
    Filed: May 31, 2023
    Publication date: May 9, 2024
    Inventors: Efstratios Skafidas, Hsien Ming, You Liang, Duc Huynh, Thanh Nguyen, Michael Erlichster
  • Patent number: 11976018
    Abstract: Disclosed is a diamine compound represented by Formula (1), in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: May 7, 2024
    Assignee: DAXIN MATERIALS CORP.
    Inventors: Kai-Sheng Jeng, Yuan-Li Liao, You-Ming Chen, Yu-Ying Kuo, Shao-Chi Cheng
  • Publication number: 20240144430
    Abstract: A computing system performs artificial-intelligence (AI) super-resolution (SR). The computing system includes multiple processors, which further includes a graphics processing unit (GPU) and an AI processing unit (APU). The computing system also includes a memory to store AI models. When detecting an indication that the loading of the GPU exceeds a threshold, the processors reduce the resolution of a video output from the GPU in response to the indication. One of the AI models is selected based on graphics scenes in the video and the respective power consumption estimates of the AI models. The processors then perform AI SR operations on the video using the selected AI model to restore the resolution of the video for display.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 2, 2024
    Inventors: Chien-Nan Lin, You-Ming Tsao, Yung-Hsin Chu, An-Li Wang
  • Publication number: 20240138723
    Abstract: A test strip for sampling a bodily fluid may include multiple layers of a substrate material, an adhesive between at least some of the multiple layers, and a microfluidic channel formed between at least some of the multiple layers. The test strip may further include multiple electrodes on one of the multiple layers, positioned and partially exposed within the microfluidic channel, an additional material positioned at or near an entrance to the microfluidic channel, to selectively limit the flow of at least one of bubbles or debris into the microfluidic channel, and at least one exit port in at least one of the multiple layers to allow for release of pressure from the test strip. In some embodiments, the test strip is a saliva analysis test strip. In some embodiments, the test strip includes multiple exit ports to prevent blockage of sample flow.
    Type: Application
    Filed: May 31, 2023
    Publication date: May 2, 2024
    Inventors: Thanh Cong Nguyen, Efstratios Skafidas, Duc Hau Huynh, Michael Erlichster, Duc Phuong Nguyen, Hsien Ming, Gursharan Chana, Ting Ting Lee, Chathurika Darshani Abeyrathne, You Liang, Trevor John Kilpatrick, Michael Luther, Alan Dayvault Luther
  • Publication number: 20240120376
    Abstract: Semiconductor structures and methods are provided. A semiconductor structure according to the present disclosure includes a first active region extending lengthwise along a first direction and having a first width along a second direction perpendicular to the first direction, a second active region extending lengthwise along the first direction and having a second width along the second direction, and an epitaxial feature sandwiched between the first active region and the second active region along the first direction. The first width is greater than the second width.
    Type: Application
    Filed: January 26, 2023
    Publication date: April 11, 2024
    Inventors: Po Shao Lin, Jiun-Ming Kuo, Yuan-Ching Peng, You-Ting Lin, Yu Mei Jian
  • Patent number: 11953120
    Abstract: A champagne tower-type multi-stage throttle control valve includes a valve body, a valve cover, a throttle sleeve, and a valve core. A sleeve cavity of the throttle sleeve is shaped as a stepped hole with two or more layers. The valve core is shaped as a stepped shaft with two or more layers coaxial with the throttle sleeve. The number of shaft shoulders of the valve core is smaller than or equal to the number of hole shoulders of the sleeve cavity of the throttle sleeve, such that each set of shaft shoulders of the valve core in an axial direction can form a sealing surface fit with corresponding hole shoulders of the throttle sleeve. A flow channel groove is axially or obliquely formed on each of the hole shoulders of the throttle sleeve and/or the shaft shoulders of the valve core.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: April 9, 2024
    Assignee: HEFEI GENERAL MACHINERY RESEARCH INSTITUTE CO., LTD
    Inventors: Wei Wang, Fengguan Chen, You Ming, Hongbing Yu, Shengtao Geng, Xiaojie Ye, Qin Wang
  • Patent number: 11942795
    Abstract: A multi-antenna system for harvesting energy and transmitting data includes an energy storing unit, antenna transmission units, and a load unit. Each antenna transmission unit includes an antenna module, a splitting module, an energy generation module, and a data processing module. The splitting module splits a wireless signal received by the antenna module into a first splitting signal and a second splitting signal and transmits the first splitting signal to an energy generation module to convert the first splitting signal into electrical energy stored in an energy storing unit and provided to the data processing module. The energy storing unit provides the electrical energy for the load unit. The data processing module receives one of the second splitting signals, converts it into a control signal, and transmits the control signal to the load unit. The load unit operates according to the control signal.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: March 26, 2024
    Assignee: Netronix, Inc.
    Inventors: Fang Ming Tsai, You Wei Zhang, Jun Sheng Lin
  • Publication number: 20230170301
    Abstract: A semiconductor structure includes a substrate, a dielectric layer, a connection layer and wire layers. The dielectric layer is disposed on a surface of the substrate and includes vias showing the surface. The connection layer is disposed on the dielectric layer, a first connection portion of the connection layer is located in the vias and connected to the surface, a second connection portion of the connection layer is connected to the dielectric layer. A first ground portion of the ground metal layer is connected to the first connection portion of the connection layer, and a second ground portion of the ground metal layer is connected to the second connection portion of the connection layer. Each of the wire layers is disposed on the second connection portion of the connection layer, and the second ground portion is located between the adjacent wire layers.
    Type: Application
    Filed: October 25, 2022
    Publication date: June 1, 2023
    Inventors: Chin-Tang Hsieh, You-Ming Hsu, Chun-Ting Kuo, Lung-Hua Ho, Chih-Ming Kuo
  • Patent number: 11662658
    Abstract: A photo-mask and a semiconductor process are provided. The photo-mask includes a substrate and a non-printable pattern on the substrate. A pattern size of the non-printable pattern is smaller than a critical resolution of a lithography equipment using the photo-mask to perform a lithography process.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: May 30, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventor: You-Ming Ke
  • Patent number: 11651974
    Abstract: A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: May 16, 2023
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Chih-Ming Kuo, Lung-Hua Ho, You-Ming Hsu, Fei-Jain Wu
  • Publication number: 20230052558
    Abstract: A champagne tower-type multi-stage throttle control valve includes a valve body, a valve cover, a throttle sleeve, and a valve core. A sleeve cavity of the throttle sleeve is shaped as a stepped hole with two or more layers. The valve core is shaped as a stepped shaft with two or more layers coaxial with the throttle sleeve. The number of shaft shoulders of the valve core is smaller than or equal to the number of hole shoulders of the sleeve cavity of the throttle sleeve, such that each set of shaft shoulders of the valve core in an axial direction can form a sealing surface fit with corresponding hole shoulders of the throttle sleeve. A flow channel groove is axially or obliquely formed on each of the hole shoulders of the throttle sleeve and/or the shaft shoulders of the valve core.
    Type: Application
    Filed: March 11, 2021
    Publication date: February 16, 2023
    Applicant: HEFEI GENERAL MACHINERY RESEARCH INSTITUTE CO., LTD
    Inventors: Wei WANG, Fengguan CHEN, You MING, Hongbing YU, Shengtao GENG, Xiaojie YE, Qin WANG
  • Publication number: 20220336233
    Abstract: A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.
    Type: Application
    Filed: July 1, 2022
    Publication date: October 20, 2022
    Inventors: Chih-Ming Kuo, Lung-Hua Ho, You-Ming Hsu, Fei-Jain Wu
  • Publication number: 20220146926
    Abstract: A photo-mask and a semiconductor process are provided. The photo-mask includes a substrate and a non-printable pattern on the substrate. A pattern size of the non-printable pattern is smaller than a critical resolution of a lithography equipment using the photo-mask to perform a lithography process.
    Type: Application
    Filed: December 21, 2020
    Publication date: May 12, 2022
    Inventor: You-Ming KE
  • Publication number: 20220037166
    Abstract: A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.
    Type: Application
    Filed: January 29, 2021
    Publication date: February 3, 2022
    Inventors: Chih-Ming Kuo, Lung-Hua Ho, You-Ming Hsu, Fei-Jain Wu
  • Publication number: 20210284596
    Abstract: Disclosed is a diamine compound represented by Formula (1), in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.
    Type: Application
    Filed: March 9, 2021
    Publication date: September 16, 2021
    Inventors: Kai-Sheng JENG, Yuan-Li LIAO, You-Ming CHEN, Yu-Ying KUO, Shao-Chi CHENG
  • Patent number: 10545530
    Abstract: An electronic device includes a memory controller and a processor. The memory controller controls access of a memory device. The processor performs a calibration operation to find a first setting range of a memory controller parameter under a first clock frequency of the memory device, to find a second setting range of the memory controller parameter under a second clock frequency of the memory device, and to determine a calibrated setting of the memory controller parameter according to an overlapped range of the first setting range and the second setting range.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: January 28, 2020
    Assignee: MEDIATEK INC.
    Inventors: You-Ming Tsao, Chun-Liang Chen, Chen-Chia Lee
  • Patent number: 10450455
    Abstract: The present invention relates to hydrogenated block copolymers of vinyl aromatic polymer blocks and conjugated diene polymer blocks having specific molecular weights, compositions, molecular structures and architectures, such that improved processability, mechanical and optical properties are attained. The hydrogenated block copolymer can be further added with different hydrogenated block copolymers to enhance the desired properties.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: October 22, 2019
    Assignee: USI CORPORATION
    Inventors: Yung-Shen Chang, Cheng-Hao Liu, Zong-Fu Shih, You-Ming Wang, Yi-Hsing Chiang, Yin-Chieh Chen, Moh-Ching Oliver Chang, Che-I Kao, Han-Tai Liu
  • Patent number: D1024959
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: April 30, 2024
    Assignee: VOLTRONIC POWER TECHNOLOGY CORP.
    Inventors: You-Sheng Chiang, Yu-Cheng Lu, Juor-Ming Hsieh
  • Patent number: D1026816
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: May 14, 2024
    Assignee: VOLTRONIC POWER TECHNOLOGY CORP.
    Inventors: You-Sheng Chiang, Yu-Cheng Lu, Juor-Ming Hsieh
  • Patent number: D1026817
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: May 14, 2024
    Assignee: VOLTRONIC POWER TECHNOLOGY CORP.
    Inventors: You-Sheng Chiang, Yu-Cheng Lu, Juor-Ming Hsieh