Abstract: A semiconductor memory device may include a cell array comprising a plurality of memory cells, each memory cell connected to a word line and a bit line, the cell array divided into a plurality of blocks, each block including a plurality of word lines, the plurality of blocks including at least a first defective block; a nonvolatile storage circuit configured to store address information of the first defective block, and to output the address information to an external device; and a fuse circuit configured to cut off an activation of word lines of the first defective block.

Abstract: The present disclosure relates to a display device including: a substrate having a rounded corner; a plurality of pixels disposed on the substrate; and a light blocking member disposed on a corner of the substrate and overlapping at least part of a first pixel of the plurality of pixels, the first pixel disposed at the rounded corner, wherein the first pixel is configured to generate a lower luminance, the lower luminance referring to a luminance lower than a normal luminance.

Abstract: A method of synchronizing a driving module includes applying a plurality of original data enable (“DE”) signals to a plurality of timing controller of the driving module, respectively, generating a synch DE signal from the driving module based on the earliest signal among the original DE signals, and transferring the synch DE signal to the plurality of timing controllers in a cascade mode.

Abstract: A display apparatus including a classifier configured to classify image data into preset data of an n-bits (“n” is a natural number), a toggle counter configured to count a number of toggles based on preset data of a present horizontal line and a previous horizontal line and to calculate a final toggle number using a weighted values corresponding to a swing width between data voltages of the present and previous horizontal lines, a determiner configured to determine a representative toggle number of a present frame based on a plurality of final toggle numbers of the present frame, compare the representative toggle number with a plurality of threshold values and determine a level of a power control signal based on a compared result.

Abstract: A use time managing method of a semiconductor device may include (1) measuring an amount of accumulated operation time of the semiconductor device and when the amount is reached to a predetermined value, generating a unit storage activation signal; (2) repeating step (1) to generate one or more additional unit storage activation signals, thereby generating a plurality of unit storage activation signals, wherein the predetermined values are different for each repeating step; (3) storing data indicating each occurrence of generating the unit storage activation signals; and (4) detecting use time of the semiconductor device based on the cumulatively stored data.

Abstract: A memory device includes a memory cell array, an intensively accessed row detection circuit, and a refresh control circuit. The memory cell array includes a plurality of memory cell rows. The intensively accessed row detection circuit generates an intensively accessed row address indicating an intensively accessed memory cell row among the plurality of memory cell rows based on an accumulated access time for each of the plurality of memory cell rows. The refresh control unit preferentially refreshes neighboring memory cell rows adjacent to the intensively accessed memory cell row indicated by the intensively accessed row address when receiving the intensively accessed row address from the intensively accessed row detection unit. The memory device effectively reduces a rate of data loss.

Abstract: An I2C router system includes an I2C router part, a first slave device and a second slave device. The I2C router part includes a first I2C router configured to output a first I2C signal via a first I2C bus, and a second I2C router configured to output a second I2C signal via a second I2C bus. The first slave device can be configured to receive the first I2C signal via the first I2C bus. The second slave device can be configured to receive the second I2C signal via the second I2C bus.

Abstract: Provided are a memory device and a memory module, which perform both an ECC operation and a redundancy repair operation. The memory device repairs a single-bit error due to a ‘fail’ cell by using an error correction code (ECC) operation, and also repairs the ‘fail’ cell by using a redundancy repair operation when the ‘fail’ cell is not repairable by the ECC operation. The redundancy repair operation includes a data line repair and a block repair. The ECC operation may change a codeword corresponding to data per one unit of memory cells including the ‘fail’ cell, and may also change the size of parity bits regarding the changed codeword.

Abstract: A memory device, system, and/or method are provided for performing a page state informing function. The memory device may compare one or more row addresses received along with a command, determine the page open/close state according to a page hit or miss generated as a result of comparison, count read or write commands with respect to pages corresponding to a same row address, and determine the page open/close state according to a read or write command number generated as a result of counting. The memory device may determine a page open/close state with respect to a corresponding page based on a page hit/miss and a read or write command number and output a flag signal. The memory device may provide the page open/close state for each channel. A memory controller may establish different page open/close policies for each channel.

Abstract: Provided are a memory device and a memory module, which perform both an ECC operation and a redundancy repair operation. The memory device repairs a single-bit error due to a ‘fail’ cell by using an error correction code (ECC) operation, and also repairs the ‘fail’ cell by using a redundancy repair operation when the ‘fail’ cell is not repairable by the ECC operation. The redundancy repair operation includes a data line repair and a block repair. The ECC operation may change a codeword corresponding to data per one unit of memory cells including the ‘fail’ cell, and may also change the size of parity bits regarding the changed codeword.

Abstract: A timing controller includes a data grouping part that generates a plurality of grayscale groups based on input image data, each grayscale group including n×m grayscales, a grayscale classifying part that generates a plurality of grayscale patterns respectively corresponding to the grayscale groups, a grayscale in the grayscale groups being classified in the grayscale patterns as a first grayscale if the grayscale is higher than a first reference grayscale or as a second grayscale if the grayscale is lower than a second reference grayscale, a pattern comparing part that compares each grayscale pattern with a first pattern including the n×m first and second grayscales, a pattern counter that counts a number of patterns of the grayscale patterns that are substantially the same as the first pattern, and a driving mode changing part that changes a driving mode of a display panel when the number is greater than a reference number.

Abstract: In a method of operating a memory device, a command and a first address from a memory controller are received. A read code word including a first set of data corresponding to the first address, a second set of data corresponding to a second address and a read parity data is read from a memory cell array of the memory device. Corrected data are generated by operating error checking and correction (ECC) using an ECC circuit based on the read cord word.

Abstract: A gate driver includes a first shift-register including a plurality of odd-numbered stages which outputs a plurality of odd-numbered original gate signals having a pre-charge pulse and a main-charge pulse in synchronization with a first gate clock signal, a second shift-register comprising a plurality of even-numbered stages which outputs a plurality of even-numbered original gate signals having a pre-charge pulse and a main-charge pulse in synchronization with a second gate clock signal, a first inverter configured to output a first inversion pre-charge control signal having a phase opposite to a phase of a first pre-charge control signal, and a second inverter configured to output a second inversion pre-charge control signal having a phase opposite to a phase of a second pre-charge control signal.

Abstract: A memory chip includes a chip input-output pad unit, a plurality of semiconductor dies. The chip input-output pad unit includes a plurality of input-output pins connected to an external device and the plurality of semiconductor dies are connected commonly to the chip input-output pad unit and having a full memory capacity respectively. Each semiconductor die includes a die input-output pad unit, a memory region and a conversion block. The die input-output pad unit includes a plurality of input-output terminals respectively connected to the input-output pins of the chip input-output pad unit. The memory region includes an activated region corresponding to a portion of the full memory capacity and a deactivated region corresponding to a remainder portion of the full memory capacity. The conversion block connects the activated region except the deactivated region to the die input-output pad unit.

Abstract: A semiconductor memory device includes a control logic and a memory cell array in which a plurality of memory cells are arranged. The memory cell array includes a plurality of bank arrays, and each of the plurality of bank arrays includes a plurality of sub-arrays. The control logic controls an access to the memory cell array based on a command and an address signal. The control logic dynamically sets a keep-away zone that includes a plurality of memory cell rows which are deactivated based on a first word-line when the first word-line is enabled. The first word-line is coupled to a first memory cell row of a first sub-array of the plurality of sub-arrays. Therefore, increased timing parameters may be compensated, and parallelism may be increased.

Abstract: A memory device includes a memory cell array, an intensively accessed row detection circuit, and a refresh control circuit. The memory cell array includes a plurality of memory cell rows. The intensively accessed row detection circuit generates an intensively accessed row address indicating an intensively accessed memory cell row among the plurality of memory cell rows based on an accumulated access time for each of the plurality of memory cell rows. The refresh control unit preferentially refreshes neighboring memory cell rows adjacent to the intensively accessed memory cell row indicated by the intensively accessed row address when receiving the intensively accessed row address from the intensively accessed row detection unit. The memory device effectively reduces a rate of data loss.

Abstract: A memory device includes a memory cell array, an intensively accessed row detection circuit, and a refresh control circuit. The memory cell array includes a plurality of memory cell rows. The intensively accessed row detection circuit generates an intensively accessed row address indicating an intensively accessed memory cell row among the plurality of memory cell rows based on an accumulated access time for each of the plurality of memory cell rows. The refresh control unit preferentially refreshes neighboring memory cell rows adjacent to the intensively accessed memory cell row indicated by the intensively accessed row address when receiving the intensively accessed row address from the intensively accessed row detection unit. The memory device effectively reduces a rate of data loss.

Abstract: An injection-locked phase-locked loop (ILPLL) circuit includes a delay-locked loop (DLL) and an ILPLL. The DLL is configured to generate a DLL clock by performing a delay-locked operation on a reference clock. The ILPLL includes a voltage-controlled oscillator (VCO), and is configured to generate an output clock by performing an injection synchronous phase-locked operation on the reference clock. The DLL clock is injected into the VCO as an injection clock of the VCO.

Abstract: A memory device including: a memory cell array including normal memory cells and spare memory cells arranged in rows and columns including normal columns including the normal memory cells and at least one spare column including spare memory cells, a segment match determining circuit configured to compare a segment address with row address information corresponding to a failed segment and to generate a load control signal, and a column match determining circuit configured to compare column address information corresponding to a failed column in response to the load control signal with a column address and to generate a column address replacement control signal, wherein the memory cells connected to fail columns of the fail segment are replaced with memory cells connected to columns of the spare memory cells in response to the column address replacement control signal.

Abstract: A semiconductor memory device includes a memory cell array, sub word-line drivers and power selection switches. The memory cell array includes memory cell rows coupled to word lines. The sub word line drivers are coupled to the word lines. The power selection switches are coupled to the sub word-line drivers. Each power selection switch controls a deactivation voltage level of a first word-line activated from the word-lines and an off-voltage level of a second word line adjacent to the first word line so that the deactivation voltage level and the off-voltage level have at least one of a ground voltage, a first negative voltage and a second negative voltage. The ground voltage, the first negative voltage and the second negative voltage have different voltage levels from each other.