Abstract: A data processing device for transmitting a first data includes a data generator configured to provide the first data, a cyclic redundancy check (CRC) generator configured to generate a CRC information having at least one bit whose binary value is modified in response to a toggle information, and a data transmitter configured to combine the CRC information and the first data as a combined data and output the combined data in serial. A data processing method for transmitting a first data includes a step of generating a first data, a step of generating cyclic redundancy check (CRC) information having at least one bit whose binary value is modified in response to a toggle information, and a step of generating a combined data by combining the generated CRC information and the first data as a combined data and outputting the combined data in serial.

Abstract: An integrated circuit device includes an external power supply input configured to be coupled to an external power supply and a digital circuit, such as a clock signal generator circuit, that generates noise at a power supply input thereof. The device further includes a replica load circuit and a power supply circuit coupled to the external power supply input, to a power supply input of the digital circuit and to a power supply input of the replica load circuit. The power supply circuit is configured to selectively couple the external power supply node to the power supply input of the digital circuit responsive to a voltage at the power supply input of the replica load circuit. The replica load circuit may be configured to provide a load that varies responsive to a voltage at the power supply input of the digital circuit.

Abstract: Embodiments may be directed to a method of operating a semiconductor device, the method including receiving a first write training command, receiving a first write data responsive to the first write training command through a first data line, and transmitting the first write data through a second data line. Transmitting the first write data is performed without an additional training command.

Abstract: A semiconductor chip package includes a substrate, a first layer disposed on the substrate and a second layer substantially similar to and disposed on the first layer. The first layer has a first input/output (I/O) circuit, a first through-via connected to the first input/output (I/O) circuit and a second through-via that is not connected to the first I/O circuit. The second layer has a second I/O circuit, a third through-via connected to the second I/O circuit and a fourth through-via that is not connected to the second I/O circuit. The first through-via is connected to the fourth through-via, and the second through-via is connected to the third through-via. The package maybe fabricated by stacking the layers, and changing the orientation of the second layer relative to the first to ensure that the first through-via is connected to the fourth through-via, and the second through-via is connected to the third through-via.

Abstract: A stacked semiconductor memory device according to the inventive concepts may include a plurality of memory chips stacked above a processor chip, a plurality of TSVs, and I/O buffers. The TSVs may pass through the memory chips and are connected to the processor chip. I/O buffers may be coupled between all or part of the memory chips and the TSVs and may be selectively activated on the basis of defective states of the TSVs.

Abstract: A memory system includes a memory controller and a memory device. The memory device exchanges data through a first channel with the memory controller, exchanges a first cyclic redundancy check (CRC) code associated with the data through a second channel with the memory controller, and receives a command/address packet including a second CRC code associated with a command/address from the memory controller through a third channel.

Abstract: A method of tuning a phase of a clock signal includes performing data training on a plurality of data pins through which data are input and output, in synchronization with a data clock signal; determining one of the data pins to be a representative pin; performing clock and data recovery (CDR) on read data of the representative pin; and adjusting a phase of the data clock signal based on the CDR.

Abstract: An on-die termination circuit includes a termination resistor unit connected to an external pin, and a termination control unit connected to the termination resistor unit. The termination resistor unit provides termination impedance to a transmission line connected to the external pin. The termination control unit varies the termination impedance in response to a plurality of bits of strength code associated with a data rate.

Abstract: A semiconductor memory device includes a memory cell array, an address control unit and a logic circuit. The memory cell array includes a plurality of banks which are divided into a first bank block and a second bank block. The address control unit accesses the memory cell array. The logic circuit controls the address control unit based on a command and an address signal such that the first and second bank blocks commonly operate in a first operation mode, and the first and second bank blocks individually operate in a second operation mode.

Abstract: A high speed linear differential amplifier (HSLDA) having automatic gain adjustment to maximize linearity regardless of manufacturing process, changes in temperature, or swing width change of the input signal. The HSLDA comprises a differential amplifier, and a control signal generator including a replica differential amplifier, a reference voltage generator, and a comparator. The comparator outputs a control signal that automatically adjusts the gain of the high speed linear differential amplifier and of the replica differential amplifier. The replica differential amplifier receives predetermined complementary voltages as input signals and outputs a replica output signal to the comparator. The reference voltage generator outputs a voltage to the comparator at which linearity of the output signal of the differential amplifier is maximized. The control signal equalizes the voltage level of the replica output signal and the reference voltage, and controls the gain of the differential amplifier.

Abstract: A semiconductor memory device includes a latency controller which provides a power-saving effect. The latency controller includes a first-in first-out (FIFO) register. After a read command is applied, when a precharge command or power-down command is applied, the latency controller outputs a latency signal corresponding to the applied read command and blocks application of sampling and transmission clock signals to the FIFO register.

Abstract: A semiconductor memory device includes a memory cell array, a controller, and a data input/output (I/O) unit. The memory cell array includes a plurality of memory cells and is configured to store data. The controller is configured to enable a write clock signal in response to an active command when a write latency of the semiconductor device is less than a reference write latency and disable the write clock signal during a disabling period in which read data is output from the semiconductor device. The data I/O unit is configured to receive data in response to the write clock signal and output the data to the memory cell array.

Abstract: The PLL includes a selection signal generator configured to output a selection signal varying in response to a first clock signal, and a first dividing circuit configured to divide an externally input reference clock signal by a division ratio and output a first division signal. The first dividing circuit selects one of a plurality of edges of the reference clock signal applied for at least one cycle of the first division signal in response to the selection signal, and synchronizes and generates the first division signal on the basis of the selected edge of the reference clock signal. A second dividing circuit is configured to receive an output clock signal, divide the output clock signal by a division ratio, and output a second division signal.

Abstract: Example embodiments relate to a receiving apparatus and method thereof. In an example, the receiving apparatus may include a clock generating unit generating a plurality of internal clock signals based on a received external clock signal and an equalization receiving unit receiving the plurality of internal clock signals and an input signal. The equalization receiving unit may determine an offset value and an equalization coefficient in an initial setting mode and may adjust the received data signal based on the determined offset value and equalization coefficient.

Abstract: Integrated circuit memory devices include an internal command generator and a memory control circuit responsive to an internal command generated by the internal command generator. The internal command generator is configured to generate an internal command in response to a combination of an independent command and at least one dependent command received in sequence by the memory device. For example, the internal command generator may be configured to require the independent command to follow the at least one dependent command in the sequence when generating the internal command from the combination of the independent and dependent commands. Alternatively, the internal command generator may be configured to require the independent command to precede the at least one dependent command in the sequence before generating the internal command from the combination of the independent and dependent commands.

Abstract: A data amplifying circuit for an output driver has a swing level that is controllable according to an operation mode. The data amplifying circuit includes a mode responding circuit supplying an additional source current to a source node of an amplifying circuit in response to a mode selection signal. The mode responding circuit controls the supply of the additional source current in accordance with an operation mode. Another data amplifying circuit of a semiconductor device, according to the invention, includes a small-swing amplifier and a full-swing amplifier. The small-swing amplifier causes a swing level of the output signal to be relatively smaller, while the full-swing amplifier causes the output signal swing level be relatively larger. The small-swing and full-swing amplifiers are alternatively enabled in response to the mode selection signal.

Abstract: An On Die Termination (ODT) circuit for performing an ODT operation. The ODT circuit includes a resistor having a first end to receive an ODT enable signal; and a switch unit coupled to a second end of the resistor. The ODT operation is performed in response to the ODT enable signal passing through the resistor.

Abstract: A reference voltage generator generates a reference voltage that is less dependent on temperature and can adjust the dependence of the reference voltage on temperature and the reference voltage at the same time independently of each other. The reference voltage generator including a preliminary reference voltage generation unit which generates a preliminary reference voltage which is inversely proportional to temperature and a reference voltage generation unit which generates a reference voltage by dividing the preliminary reference voltage. The reference voltage generation unit includes: at least one resistor which is connected between the preliminary reference voltage and the reference voltage; at least one transistor which is connected between the reference voltage and an internal node; and at least one second resistor which is connected between the internal node and a ground. The preliminary reference voltage or a power supply voltage is applied to at least one gate of the transistor.

Abstract: Provided are a differential amplifier circuit and a method of generating a bias voltage in a differential amplifier circuit. The differential amplifier circuit is turned on or turned off in response to an input voltage and includes a differential amplifier and a bias circuit. The bias circuit provides a first bias voltage to a gate of a pull-down transistor included in the differential amplifier when the differential amplifier is turned on and provides second bias voltage which is lower than the first bias voltage to the gate of the pull-down transistor when the differential amplifier is turned off.

Abstract: An output driver and an I/O apparatus including the output driver are disclosed. The output driver includes a driving unit having a first type transistor and a second type transistor connected in series, the driving unit amplifying an input signal applied to the gates of the first type transistor and the second type transistor and outputting the amplified signal to a node between the series connected first type transistor and second type transistor, a first source peaking unit connected between the first type transistor and a first voltage source and having a first impedance that varies in accordance with the frequency of the input signal, and a second source peaking unit connected between the second type transistor and a second voltage source and having a second impedance that varies in accordance with the frequency of the input signal.