Abstract: Methods and materials for identifying and treating mammals (e.g., humans) having multiple myeloma (MM) are provided herein. For example, this document provides methods and materials that can be used to identify and treat mammals having advanced stage MM, and/or having MVI that is resistant to treatment with immunomodulatory drugs (IMiDs) and/or proteasome inhibitors (PIs).

Abstract: The present disclosure relates to an integrated chip including a dielectric structure over a substrate. A first capacitor is disposed between sidewalls of the dielectric structure. The first capacitor includes a first electrode between the sidewalls of the dielectric structure and a second electrode between the sidewalls and over the first electrode. A second capacitor is disposed between the sidewalls. The second capacitor includes the second electrode and a third electrode between the sidewalls and over the second electrode. A third capacitor is disposed between the sidewalls. The third capacitor includes the third electrode and a fourth electrode between the sidewalls and over the third electrode. The first capacitor, the second capacitor, and the third capacitor are coupled in parallel by a first contact on a first side of the first capacitor and a second contact on a second side of the first capacitor.

Abstract: A hanging structure applicable to an unmanned aerial vehicle includes a hook-shaped body and at least one hook claw. The hook-shaped body has a bottom, at least one pivoting end, and an abutting portion. A hook opening is provided between the at least one pivoting end and the abutting portion and is opposite to the bottom. In addition, the at least one hook claw has a pivoting portion, and a first claw portion and a second claw portion that extend from the pivoting portion, respectively. The pivoting portion is pivoted to the at least one pivoting end. The second claw portion is heavier than the first claw portion. When the hanging structure is in a hanging state, a first end of the first claw portion abuts against the abutting portion, and the hook opening is closed. An unmanned aerial vehicle hanging system including the above hanging structure is further provided.

Abstract: A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includes a stack of channel structures over a base structure. The semiconductor device structure also includes a first epitaxial structure and a second epitaxial structure sandwiching the channel structures. The semiconductor device structure further includes a gate stack wrapped around each of the channel structures and a backside conductive contact connected to the second epitaxial structure. A first portion of the backside conductive contact is directly below the base structure, and a second portion of the backside conductive contact extends upwards to approach a bottom surface of the second epitaxial structure. In addition, the semiconductor device structure includes an insulating spacer between a sidewall of the base structure and the backside conductive contact.

Abstract: A semiconductor device includes a substrate; a memory array over the substrate, the memory array including first magnetic tunnel junctions (MTJs), where the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit including second MTJs, where the second MTJs are in the first dielectric layer.

Abstract: A semiconductor device is provided. The semiconductor device includes a carrier, an electronic component, an adapter, a first metal wire and a second metal wire. The electronic component is disposed on the carrier. The adapter is disposed on the carrier. The first metal wire connects the electronic component and the adapter. The second metal wire connects the adapter and the carrier.

Abstract: A storage rack and a drying device including the storage rack. The storage rack includes a frame and a support beam assembly including a connector seat, a first connector and a support beam. The connector seat is connected to the frame, and the support beam is connected to the connector seat by the first connector. The support beam is connected to the frame by the first connector and the connector seat rather than by direct welding which may cause deformation. It is ensured that the support beam can provide desirable levelness for a shelf panel to be supported thereon. In this way, good levelness of the shelf panel can be achieved at a reduced thickness thereof, resulting in a reduction in economic cost. Moreover, for a detachable shelf panel, its placement and removal can be facilitated.

Abstract: The present disclosure relates to a method for treating a cancer and/or cancer metastasis in a subject comprising administering to the subject irinotecan loaded in a mesoporous silica nanoparticle. The present disclosure also provides a conjugate comprising an agent loaded in a mesoporous silica nanoparticle (MSN) defining at least one pore and having at least one functional group on a sidewall of the at least one pore.

Abstract: A gardening sprayer has a main body, an adjusting valve and an output unit. Both ends of the main body are respectively provided with an input portion and an output portion, a flow channel is provided between the input portion and the output portion, and a flow channel is connected between the input portion and the output portion through the periphery of the main body and is connected with the flow channel with a flow control aperture, so that the flow control aperture provides the adjusting valve for installation. The adjusting valve has a shaft bolt and a positioning sleeve which are put into the flow control aperture from two directions and then docked. Both of the shaft bolt and the positioning sleeve are provided with at least a sealing washer, and a blocking portion and the passing portion with a smaller diameter are formed on the shaft bolt.

Abstract: Disclosed are a material analysis method based on the crystal structure database, a system, a computer-readable storage medium and an application. The material analysis method includes comparing experimental pattern information obtained from examination of a to-be-tested sample with theoretical pattern information calculated from material structure data in the crystal structure database, and obtaining crystallographic information and phase composition of the to-be-tested sample through intelligent analysis. The crystallographic information include space group, unit cell parameter, and specific coordinates of atoms in unit cell. The crystal structure database has material structure data obtained by experimental measurement and/or theoretical prediction, including chemical formula, space group, unit cell parameter and specific coordinates of atoms in unit cell.

Abstract: A portable electronic device includes a housing, a heat-dissipation component, a bracket, a door structure, a driving mechanism, and a driven linkage. The housing includes a heat-dissipation opening disposed in the housing. The bracket is disposed in the housing and surrounds the heat-dissipation component. The door structure is configured to move between a closed position covering the heat-dissipation opening and an open position exposing the heat-dissipation opening. The driving mechanism is coupled between the bracket and the door structure to drive the door structure to rotate and move. The driven linkage is coupled between the bracket and the door structure. When the door structure is driven to rotate and move, the door structure drives the driven linkage to rotate and move, so that the driven linkage and the driving mechanism jointly drive the door structure to move between the closed position and the open position.

Abstract: A package comprises a substrate including a first surface, and an upper conductive layer arranged on the first surface, a first light-emitting unit arranged on the upper conductive layer, and comprises a first semiconductor layer, a first substrate, a first light-emitting surface and a first side wall, a second light-emitting unit, which is arranged on the upper conductive layer, and comprises a second light-emitting surface and a second side wall, a light-transmitting layer arranged on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit, a light-absorbing layer, which is arranged between the substrate and the light-transmitting layer in a continuous configuration of separating the first light-emitting unit and the second light-emitting unit from each other, and a reflective wall arranged on the first side wall, wherein a height of the reflective wall is lower than that of the light-absorbing layer.

Abstract: A method of monitoring a clock signal of a server is provided. The server includes a phase-locked loop (PLL), a baseboard management controller (BMC), and a light emitting unit. The method includes steps of: A) the server executing a time synchronization service to obtain a synchronization mode that the PLL is operating in, where the synchronization mode is one of a free-run mode, a locked mode, and a holdover mode; B) the server updating the synchronization mode to the BMC when executing the time synchronization service; and C) the BMC storing the synchronization mode and controlling the light emitting unit to display in one of a plurality of displaying manners that corresponds to the synchronization mode.

Abstract: Apparatus and methods are provided for UE-assisted tethering report. In one novel aspect, UE-assisted tethering report is generated with UE-assisted procedure based on latency measurement configuration. In one embodiment, the UE-assisted tethering report includes one or more elements comprising one bit to inform the activation of tethering mode, latency of packet transmission, and other side-information related to tethering path. In one embodiment, the UE-assisted procedure is inserting a measurement timestamp or recording timing of a predefined transport block (TB) of the packet. In another novel aspect, the UE performs a jitter measurement for an extended reality (XR) traffic, sends a UE-assisted information report for an end-to-end path of the XR traffic based on the jitter measurements, wherein the UE-assisted information includes one or more elements comprising jitter information and burst arrival time.

Abstract: A semiconductor structure includes a substrate and a first capacitor. The substrate includes an active region. The first capacitor is over the substrate and free from overlapping the active region from a top view perspective.

Abstract: A display device includes a first display unit emitting a green light having a first output spectrum corresponding to a highest gray level of the display device and a second display unit emitting a blue light having a second output spectrum corresponding to the highest gray level of the display device. The first output spectrum has a main wave with a first peak. The second output spectrum has a main wave with a second peak and a sub wave with a sub peak. The second peak corresponds to a main wavelength, the sub peak corresponds to a sub wavelength, and the main wavelength is less than the sub wavelength. An intensity of the second peak is greater than an intensity of the sub peak and an intensity of the first peak.

Abstract: Disclosed is a method for enhancing memory utilization and throughput of a computing platform in training a deep neural network (DNN). The critical features of the method includes: calculating a memory size for every operation in a computational graph, storing the operations in the computational graph in multiple groups with the operations in each group being executable in parallel and a total memory size less than a memory threshold of a computational device, sequentially selecting a group and updating a prefetched group buffer, and simultaneously executing the group and prefetching data for a group in the prefetched group buffer to the corresponding computational device when the prefetched group buffer is update. Because of group execution and data prefetch, the memory utilization is optimized and the throughput is significantly increased to eliminate issues of out-of-memory and thrashing.

Abstract: The present application disclosures a double production line and a rapid prefabrication process of a segmental beam. The double production line including two production machine and a track system provided on the construction ground; the production machine includes a fixed end mold, two side molds, a bottom mold trolley, a middle internal mold trolley and two side internal mold trolley; two side molds are positioned on two sides of the fixed end mold respectively, the fixed end mold and two side molds together define a pouring position with an end opening, two openings of the pouring position are arranged facing each other; the track system includes a transverse track and a longitudinal track communicated with each other, two pouring positions are both positioned in the extension path of the transverse track, and the longitudinal track is positioned between two pouring positions.

Abstract: A heart valve prosthesis device includes a stent and leaflets. The stent includes an annular part and guide parts. A first end of the annular part includes cell sections arranged in sequence in a circumferential direction of the annular part. The guide parts are arranged at intervals in the circumferential direction of the annular part, one side of each guide part is connected to a corresponding cell section, and the other side gradually tapers to an end where a retrieval cell is provided for a pulling wire to pass through. Each guide part includes a first region being the retrieval cell, a second region aligned with the first region and configured as a central region, and a third region and a fourth region distributed on two sides of the central region in the circumferential direction of the annular part.

Abstract: An electronic device includes a substrate, a semiconductor unit and an insulating layer. The semiconductor unit is disposed on the substrate. The insulating layer is disposed on the semiconductor unit, and the insulating layer includes a first portion and a second portion connected to the first portion. In a top view, the first portion partially overlaps the semiconductor unit, the second portion does not overlap the semiconductor unit, and a part of an edge of the insulating layer is irregular.