Patents by Inventor Yuan Chen

Yuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096400
    Abstract: A memory device includes a memory bank with a memory cell connected to a local bit line and a word line. A first local data latch is connected to the local bit line and has an enable terminal configured to receive a first local clock signal. A word line latch is configured to latch a word line select signal, and has an enable terminal configured to receive a second local clock signal. A first global data latch is connected to the first local data latch by a global bit line, and the first global data latch has an enable terminal configured to receive a global clock signal. A global address latch is connected to the word line latch and has an enable terminal configured to receive the global clock signal. A bank select latch is configured to latch a bank select signal, and has an enable terminal configured to receive the second local clock signal.
    Type: Application
    Filed: January 23, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Yuan CHEN, Hau-Tai SHIEH, Cheng Hung LEE
  • Publication number: 20240096996
    Abstract: A semiconductor device includes a first dielectric layer, a stack of semiconductor layers disposed over the first dielectric layer, a gate structure wrapping around each of the semiconductor layers and extending lengthwise along a direction, and a dielectric fin structure and an isolation structure disposed on opposite sides of the stack of semiconductor layers and embedded in the gate structure. The dielectric fin structure has a first width along the direction smaller than a second width of the isolation structure along the direction. The isolation structure includes a second dielectric layer extending through the gate structure and the first dielectric layer, and a third dielectric layer extending through the first dielectric layer and disposed on a bottom surface of the gate structure and a sidewall of the first dielectric layer.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Huan-Chieh Su, Chun-Yuan Chen, Li-Zhen Yu, Lo-Heng Chang, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang
  • Publication number: 20240097436
    Abstract: An electronic device and a method for protecting an equipment from voltage surge damage are provided. The method includes: electrically connecting an input terminal of a one-way pass circuit to a first equipment and electrically connecting an output terminal of the one-way pass circuit to a second equipment; electrically connecting an over-voltage check circuit to the output terminal and a regenerative resistor circuit, wherein the regenerative resistor circuit includes a resistor; detecting, by the over-voltage check circuit, a voltage of the output terminal; and electrically, by the over-voltage check circuit, connecting the output terminal to the resistor in response to the voltage being greater than a voltage threshold.
    Type: Application
    Filed: February 2, 2023
    Publication date: March 21, 2024
    Applicant: Bamboo Dynamics Corporation., Ltd.
    Inventors: Yuan Chen Chan, Chi-Ming Chuang
  • Patent number: 11932478
    Abstract: A method for manufacturing and packaging a special-shaped cigarette includes the following steps: designing inner packaging case paper capable of being folded into a special-shaped cigarette accommodating cavity; folding the inner packaging case paper to form the special-shaped cigarette accommodating cavity; filling an interior of the special-shaped cigarette accommodating cavity with an ordinary cigarette; and shelving for a certain period of time, so that a cross section of the ordinary cigarette changes from a circle to a special shape, and the ordinary cigarette is accommodated in the special-shaped cigarette accommodating cavity. A diameter of an inscribed circle of the special-shaped cigarette accommodating cavity is less than a diameter of the ordinary cigarette, and a material of the inner packaging case paper is a paperboard or a food grade PVC sheet.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: March 19, 2024
    Assignee: CHINA TOBACCO YUNNAN INDUSTRIAL CO., LTD
    Inventors: Xi Yang, Yuan Tian, Ying Wu, Fangrui Chen, Zhijiang Yin
  • Patent number: 11932790
    Abstract: Disclosed are a red light and near-infrared light-emitting material and a preparation method thereof, and a light-emitting device including the light-emitting material. The red light and near-infrared light-emitting material contains a compound represented by a molecular formula, aSc2O3·Ga2O3·bR2O3, wherein the element R includes one or two of Cr, Ni, Fe, Yb, Nd or Er; 0.001?a?0.6; and 0.001?b?0.1. The light-emitting material can be excited by a spectrum having a wide wavelength range (ultraviolet light or purple light or blue light) to emit light with a wide spectrum of 650 nm to 1700 nm or multiple spectra, thus having higher light-emitting intensity.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: March 19, 2024
    Assignee: GRIREM ADVANCED MATERIALS CO., LTD.
    Inventors: Xiaoxia Chen, Yuanhong Liu, Ronghui Liu, Yuan Xue
  • Patent number: 11932793
    Abstract: The invention relates to a phosphor with garnet structure and a light-emitting device comprising the phosphor, wherein the phosphor includes the following components in percentage by weight: 38.47-45.19% of Y element, 9.49-22.09% of Al element, 2.06-24.31% of Ga element, 27.3-32.04% of O element, 0.43-1.46% of Ce element. In the phosphor particles, the shortest distance from the surface of one side of the particle to the surface of the opposite side through the centroid of the particle is defined as R, the longest distance is R1, and 5 ?m?R?40 ?m; any distance from the particle surface to the centroid is r, and 0<r<½R; and the space with the distance from the particle surface to the centroid direction being less than or equal to r is defined as rinner.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: March 19, 2024
    Assignees: GRIREM ADVANCED MATERIALS CO., LTD., Grirem Hi-Tech Co., Ltd, Rare Earth Functional Materials (Xiong'an) Innovation Center Co., Ltd.
    Inventors: Ronghui Liu, Shaowei Qin, Yuanhong Liu, Yanfeng Li, Xiaoxia Chen, Xiaole Ma, Yuan Xue
  • Patent number: 11935894
    Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fong-yuan Chang, Chun-Chen Chen, Po-Hsiang Huang, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao, Sheng-Hsiung Chen, Chin-Chou Liu
  • Patent number: 11934916
    Abstract: An electronic device includes a pair of depletion gates, an accumulation gate, and a conductive resonator. The depletion gates are spaced apart from each other. The accumulation gate is over the depletion gates. The conductive resonator is over the depletion gates and the accumulation gate. The conductive resonator includes a first portion, a second portion, and a third portion. The first portion and the second portion are on opposite sides of the accumulation gate. The third portion interconnects the first and second portions of the conductive resonator and across the depletion gates. A bottom surface of the first portion of the conductive resonator is lower than a bottom surface of the accumulation gate.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: March 19, 2024
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Jiun-Yun Li, Shih-Yuan Chen, Yao-Chun Chang, Ian Huang, Chiung-Yu Chen
  • Publication number: 20240085808
    Abstract: A particle removal method includes loading a particle attracting member with a coating layer into a processing chamber of a processing apparatus. The processing chamber is configured to perform a lithography exposure process on a semiconductor wafer. The method also includes fixing the particle attracting member on a reticle holder in the processing chamber in a cleaning cycle, attracting particles in the processing chamber by the coating layer of the particle attracting member due to a potential difference between the particles and the coating layer, and loading the particle attracting member with the coating layer and the attracted particles out of the processing chamber, after the cleaning cycle. The method also includes loading the semiconductor wafer into the processing chamber, and performing the lithography exposure process on the semiconductor wafer in the processing chamber using a reticle fixed on the reticle holder after the cleaning cycle.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Chih-Yuan YAO, Yu-Yu CHEN, Hsiang-Lung TSOU
  • Publication number: 20240083667
    Abstract: A method for manufacturing and packaging a special-shaped cigarette includes the following steps: designing inner packaging case paper capable of being folded into a special-shaped cigarette accommodating cavity; folding the inner packaging case paper to form the special-shaped cigarette accommodating cavity; filling an interior of the special-shaped cigarette accommodating cavity with an ordinary cigarette; and shelving for a certain period of time, so that a cross section of the ordinary cigarette changes from a circle to a special shape, and the ordinary cigarette is accommodated in the special-shaped cigarette accommodating cavity. A diameter of an inscribed circle of the special-shaped cigarette accommodating cavity is less than a diameter of the ordinary cigarette, and a material of the inner packaging case paper is a paperboard or a food grade PVC sheet.
    Type: Application
    Filed: November 2, 2021
    Publication date: March 14, 2024
    Applicant: CHINA TOBACCO YUNNAN INDUSTRIAL CO., LTD
    Inventors: Xi YANG, Yuan TIAN, Ying WU, Fangrui CHEN, Zhijiang YIN
  • Publication number: 20240087879
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Publication number: 20240085349
    Abstract: The present disclosure provides a radiation inspection system, including a container respectively provided with an entrance and an exit on opposite side walls thereof; and a radiation scanning imaging device disposed in the container and having an inspection channel. The radiation scanning imaging device includes a ray source, the ray source includes ray generators, and ray generators are configured to emit ray beams at different angles, so that the radiation scanning imaging device performs radiation scanning inspection on an object to be inspected passing through the inspection channel from the entrance to the exit.
    Type: Application
    Filed: December 15, 2021
    Publication date: March 14, 2024
    Inventors: Zhiqiang CHEN, Lei LIU, Shangmin SUN, Chunguang ZONG, Yu HU, Yuan MA, Zheng JI
  • Publication number: 20240083137
    Abstract: Embodiments of this application provide a composite structure including a substrate layer and a functional layer disposed on a surface of at least one side of the substrate layer. The substrate layer includes a first support member and a second support member that are disposed side by side and a bendable connecting member connected to and disposed between the first support member and the second support member. A material of the first support member and the second support member includes a hard rubber fiber composite material, and the functional layer includes one or more of an electrically conductive layer, a thermally conductive layer, or an impact-resistant layer.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Yuan QIN, Yangyang LI, Chun ZOU, Weiwei YAO, Nanjian SUN, Taimeng CHEN, Zhaoliang SU
  • Publication number: 20240088030
    Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.
    Type: Application
    Filed: January 23, 2023
    Publication date: March 14, 2024
    Inventors: Chin-Liang CHEN, Chi-Yu LU, Ching-Wei TSAI, Chun-Yuan CHEN, Li-Chun TIEN
  • Publication number: 20240088001
    Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 14, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Cheng Yuan CHEN
  • Publication number: 20240088210
    Abstract: Various embodiments of the present disclosure are directed towards a trench capacitor with a trench pattern for yield improvement. The trench capacitor is on a substrate and comprises a plurality of capacitor segments. The capacitor segments extend into the substrate according to the trench pattern and are spaced with a pitch on an axis. The plurality of capacitor segments comprises an edge capacitor segment at an edge of the trench capacitor and a center capacitor segment at a center of the trench capacitor. The edge capacitor segment has a greater width than the center capacitor segment and/or the pitch is greater at the edge capacitor segment than at the center capacitor segment. The greater width may facilitate stress absorption and the greater pitch may increase substrate rigidity at the edge of the trench capacitor where thermal expansion stress is greatest, thereby reducing substrate bending and trench burnout for yield improvements.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Yuan-Sheng Huang, Yi-Chen Chen
  • Publication number: 20240086612
    Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Po-Hsiang HUANG, Fong-Yuan CHANG, Clement Hsingjen WANN, Chih-Hsin KO, Sheng-Hsiung CHEN, Li-Chun TIEN, Chia-Ming HSU
  • Publication number: 20240088027
    Abstract: An integrated circuit includes an inductor that includes a first set of conductors in at least a first metal layer, and a guard ring enclosing the inductor. The guard ring includes a first conductor extending in a first direction, a second conductor extending in a second direction, and a first set of staggered conductors coupled to a first end of the first conductor and a first end of the second conductor. The first set of staggered conductors includes a second set of conductors in a second metal layer, a third set of conductors in a third metal layer and a first set of vias coupling the second set of conductors with the third set of conductors. The third metal layer is above the second metal layer. All metal lines in the second metal layer that are part of the guard ring extend in the first direction.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Chiao-Han LEE, Chi-Hsien LIN, Ho-Hsiang CHEN, Hsien-Yuan LIAO, Tzu-Jin YEH, Ying-Ta LU
  • Publication number: 20240082160
    Abstract: An amlodipine dry suspension, comprising a diluent, a suspending aid, etc. and being free of surfactants. A preparation method therefor comprises the following steps: a) preparing an aqueous mixture 1 containing amlodipine besylate by using a high-speed homogenization method; b) adding sodium benzoate to the mixture 1, and homogenizing same at a high speed to obtain a mixture 2; and c) granulating the mixture 2 and other components, and then drying same. The raw materials are homogenized and mixed at a high speed, no surfactant is added during the preparation, amlodipine is fully wetted by using a high-speed homogenization process, prescription components are simplified, and the amlodipine dry suspension is more suitable for children to use. Compared with ultrasonic stirring, scaled-up and industrial production are easier to realize for the high-speed homogenization process, and at the same time, the preparation is good in stability and convenient to carry.
    Type: Application
    Filed: December 31, 2021
    Publication date: March 14, 2024
    Inventors: Hanxiong Li, Xianzhu Wang, Weitang Chen, Yuan Chen, Ping Guo, Yongyi Wu, Yongmei Qin, Hongxue Huang, Li Wang
  • Patent number: D1018778
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: March 19, 2024
    Assignee: SHIN TAI SPURT WATER OF THE GARDEN TOOLS CO., LTD.
    Inventor: Chin-Yuan Chen