Patents by Inventor Yu Che
Yu Che has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12376346Abstract: An integrated circuit device includes a semiconductor substrate, a first gate structure, a channel layer, source and drain features, a second gate structure, a first contact, and a second contact. The first gate structure is over the semiconductor substrate. The first gate structure includes a gate dielectric layer and a first gate electrode. The channel layer is over and surrounded by the first gate structure. The source and drain features are respectively on opposite first and second sides of the channel layer. The second gate structure is over the channel layer. The second gate structure includes a programming gate dielectric layer having a data storage layer and a second gate electrode over the programming gate dielectric layer. The first gate contact is on the first gate electrode. The second gate contact is on the second gate electrode.Type: GrantFiled: January 12, 2022Date of Patent: July 29, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Che Chou, Li-Cheng Teng, Wan-Hsuan Chung, Chao-Hsin Chien
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Patent number: 12373375Abstract: The present invention provides a magnetic suction storage device that is adsorbed on a mobile device. A first through hole and a second through hole are drilled through one side of a first housing of the magnetic storage device, and a first magnetic element is disposed on the inside of the first housing, a base plate of a storage module is disposed above one of the first magnetic components, and a storage element, a first control element and a second control element are disposed above the base plate. An outer edge of the substrate is provided with a first connection port and a second connection port, and an outer edge of a second shell is connected to an outer edge of the first shell, so that the second shell and the first shell The body covers the first magnetic component and the storage module.Type: GrantFiled: May 6, 2024Date of Patent: July 29, 2025Assignee: TEAM GROUP INC.Inventors: Chin Feng Chang, Hsun Chia Ma, Yu Che Cheng
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Publication number: 20250189723Abstract: A method of fabricating a semiconductor device includes providing a substrate that includes a handle substrate, a bottom cladding layer, and a semiconductor layer stacked in sequence from bottom to top. The substrate includes an electronic integrated circuit (EIC) region and a photonic integrated circuit (PIC) region. A thermal oxidation process is performed on the semiconductor layer in the PIC region to form an oxide layer. A first thickness of the semiconductor layer in the EIC region is greater than a second thickness of the semiconductor layer below the oxide layer. The oxide layer is removed and a PIC structure is formed on the bottom cladding layer in the PIC region. An EIC structure is formed on the bottom cladding layer in the EIC region. An interconnect structure is formed to be electrically connected to the PIC and EIC structures.Type: ApplicationFiled: December 8, 2023Publication date: June 12, 2025Applicant: Vanguard International Semiconductor CorporationInventors: Ming-Cheng Lo, Shih-Chang Huang, Jui-Chun Chang, Wu-Hsi Lu, Yu-Che Tsai, Shih-Hao Liu, Yen-Shih Ho
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Publication number: 20250183955Abstract: The control method includes determining a target operating mode in response to a target instruction in a target scenario, controlling a target antenna in the target operating mode to receive a first radiated signal at a first frequency, and transmitting a second radiated signal at a second frequency. The first frequency and the second frequency belong to a same frequency band. The target operating mode includes a plurality of different antenna operating modes. Under at least two of the antenna operating modes of the plurality of different antenna operating modes, the second radiated signal at the second frequency is transmitted at different target powers to cause transmission powers of the plurality of different operating modes to be equal to or approach a power limit of the target scenario. The target power represents a power of a radio frequency path between an antenna port of the target antenna and a transceiver.Type: ApplicationFiled: November 20, 2024Publication date: June 5, 2025Inventors: Zhaobin LIN, Yu-Che LIN
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Patent number: 12324183Abstract: Structures and methods of forming self-aligned unsymmetric gate (SAUG) FinFET are provided. The SAUG FinFET structure has two different gate structures on opposite sides of each fin: a programming gate structure and a switching gate structure. The SAUG FinFET may be used as non-volatile memory (NVM) storage element that may be electrically programmed by trapping charges in the charge trapping dielectric (e.g., Si3N4) with appropriate bias on the control gate of the programming gate structure. The stored data may be sensed by sensing the channel current through the SAUG FinFET in response to a bias on the switching gate of the switching gate structure.Type: GrantFiled: April 5, 2021Date of Patent: June 3, 2025Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., National Chiao Tung UniversityInventors: Chao-Hsin Chien, Yu-Che Chou, Chien-Wei Tsai, Chin-Ya Yi
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Publication number: 20250166649Abstract: The present invention provides a processing circuit of an electronic device including an audio/video content generation circuit, a user hotspot detection module and an output module is disclosed. The audio/video content generation circuit is configured to generate audio data and video data to a speaker and a display panel, respectively. The user hotspot detection module is configured to receive a microphone input from a microphone of the electronic device, and detect the microphone input to generate a user hotspot detection result when the speaker plays the audio data and the display panel shows the video data. The output module is configured to store the user hotspot detection result.Type: ApplicationFiled: November 20, 2023Publication date: May 22, 2025Applicant: Realtek Semiconductor Corp.Inventors: Yen-Hsun Chu, Yu-Che Kao
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Publication number: 20250149812Abstract: A card edge connector includes: a housing having a mating slot for insertion of an electronic card; plural terminals retained in the housing; a latch mounted at a first longitudinal end of the housing; a movable key received in the housing; and a rod attached to the housing, wherein the latch and the movable key are connected with opposite ends of the rod, and the movable key is pushable downwards to push the rod to move in a longitudinal direction to bring the latch to a locked state.Type: ApplicationFiled: October 25, 2024Publication date: May 8, 2025Inventors: KUO-CHUN HSU, MING-YI GONG, YU-CHE HUANG, XUN WU, PO-FU CHEN, WEN-LUNG HSU
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Publication number: 20250130968Abstract: The present invention provides a magnetic suction storage device that is adsorbed on a mobile device. A first through hole and a second through hole are drilled through one side of a first housing of the magnetic storage device, and a first magnetic element is disposed on the inside of the first housing, a base plate of a storage module is disposed above one of the first magnetic components, and a storage element, a first control element and a second control element are disposed above the base plate. An outer edge of the substrate is provided with a first connection port and a second connection port, and an outer edge of a second shell is connected to an outer edge of the first shell, so that the second shell and the first shell The body covers the first magnetic component and the storage module.Type: ApplicationFiled: May 6, 2024Publication date: April 24, 2025Inventors: CHIN FENG CHANG, Hsun Chia Ma, YU CHE CHENG
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Publication number: 20250130368Abstract: A silicon photonic platform includes a composite substrate with a first photonic platform layer which includes a photonic platform material. A first signal layer covers the first photonic platform layer, has a top surface, and includes the photonic platform material and a first signal material. A photonic platform spectral signal is different from the first signal material spectral signal. The second photonic platform layer has a top surface, covers at least a portion of the top surface of the first signal, and includes the photonic platform material. The second photonic platform layer includes at least one ridge structure, and forms a silicon photonic platform together with the first photonic platform layer.Type: ApplicationFiled: October 20, 2023Publication date: April 24, 2025Applicant: Vanguard International Semiconductor CorporationInventors: Ming-Cheng Lo, Shih-Chang Huang, Jui-Chun Chang, Wu-Hsi Lu, Yu-Che Tsai, Shih-Hao Liu, Yen-Shih Ho
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Patent number: 12253518Abstract: The present invention provides a magnetic-control measurement system, comprises a reaction container and a programable magnetron measurement unit.Type: GrantFiled: October 8, 2021Date of Patent: March 18, 2025Assignee: Chung Yuan Christian UniversityInventors: Tzong-Rong Ger, Hong-Siang Wang, Yu-Che Cheng, Hsing-Cheng Chu, Jing-Wen Tsai, Chia-Ke Tsou
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Publication number: 20250076580Abstract: A photonic integrated circuit structure includes a semiconductor substrate. A waveguide is disposed above the semiconductor substrate and has an inclined plane. A mirror coating layer is conformally disposed on the inclined plane. A cladding layer covers the waveguide and the mirror coating layer. A hole is disposed in the semiconductor substrate or the cladding layer, and the hole overlaps the inclined plane in a vertical direction. In addition, an optical fiber is disposed in the hole to receive a reflected light from the mirror coating layer.Type: ApplicationFiled: August 31, 2023Publication date: March 6, 2025Applicant: Vanguard International Semiconductor CorporationInventors: Ming-Cheng Lo, Jui-Chun Chang, Shih-Chang Huang, Wu-Hsi Lu, Yu-Che Tsai, Shih-Hao Liu, Yen-Shih Ho
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Publication number: 20250071923Abstract: A card edge connector includes: a connector base having a card slot and plural terminals; a latch located at one end of the connector base for locking a card; and a releasing member. The releasing member includes two levers and a moving member, the levers are connected with the connector base in a pivoting manner, a first end of the lever is connected with the latch and an opposite second end of the lever is coupled to the moving member, wherein when the card is inserted into the slot and presses against the moving member downwards, the moving member drives the second ends of the levers to move downward, resulting in the first ends moving upwards to push the latch to lock with the card, and when the card is pulled out the moving member resets and drives the levers to release the latch from the card.Type: ApplicationFiled: August 19, 2024Publication date: February 27, 2025Inventors: KUO-CHUN HSU, Ming-Yi Gong, Yu-Che Huang, Wen-Lung Hsu, Po-Fu Chen, Xun Wu, Wen-Ting Yu, Chin-Chuan Wu, Wei-Chia Liao
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Patent number: 12234395Abstract: The present invention provides a pressure-sensitive adhesive composition, including: an acrylic copolymer and a crosslinking agent. The acrylic copolymer is a reaction product of a mixture of the following monomers: a first alkyl (meth)acrylate, an alkyl group in the first alkyl (meth)acrylate having at least 6 carbon atoms; a second alkyl (meth)acrylate, an alkyl group in the second alkyl (meth)acrylate having 1 to 5 carbon atoms; and a vinyl carboxylic acid, the weight ratio of the vinyl carboxylic acid to the mixture being 4% to 5%. The crosslinking agent is an organometallic chelating agent. The weight ratio of the organometallic chelating agent to the mixture is 0.05% to 0.25%. The pressure-sensitive adhesive composition does not contain an effective amount of a tackifier. The present invention further provides a pressure-sensitive adhesive solution, a pressure-sensitive adhesive tape, and a method for preparing the same.Type: GrantFiled: January 18, 2021Date of Patent: February 25, 2025Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Weina Wang, Lu Shen, Yunshu Zhang, Yu Che, Panpan Lin, Heng Liu, Xiaohai Sheng, Shupeng Wu, Xiangming Yang
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Publication number: 20250050485Abstract: A method for an electric nail gun to drive the flywheel to transmit nailing energy, including boosting a start voltage of a battery so as to excite an electromagnet to work and then drive the flywheel loaded with nailing energy in a frictional manner to drive a nailing rod to hit the nail. Specifically, the start voltage is boosted by a voltage boost circuit and stored, and the start voltage can release electric charge to constantly excite the electromagnet to work until completion of the nailing action. Based on the present invention, the nailing quality of the electric nail gun can be enhanced.Type: ApplicationFiled: July 29, 2024Publication date: February 13, 2025Inventors: CHIA-SHENG LIANG, I-TSUNG WU, YU-CHE LIN, WEN-CHIN CHEN
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Patent number: 12186932Abstract: An internal rotor type nail drive device of electric nail gun, comprising a nailing rod and an internal rotor type rotary actuator that can output a specific rotation angle and can drive the nailing rod to move downward for nailing. Specifically, the rotary actuator comprises a stator and a rotor arranged inside the stator, even groups of electromagnetic mutual action components are configured in pairs between the stator and the rotor, to generate a tangential force to drive the rotor to rotate for a specific rotation angle, and to drive the nailing rod to move for a nailing stroke. The nailing stroke can be determined by a specific rotation angle. Thus, through the above configuration of the rotary actuator, the structure of the electric nail gun can be simplified, and the kinetic energy for nailing can be increased.Type: GrantFiled: August 22, 2023Date of Patent: January 7, 2025Assignee: DE POAN PNEUMATIC CORP.Inventors: I-Tsung Wu, Chia-Sheng Liang, Yu-Che Lin, Wen-Chin Chen
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Publication number: 20250004106Abstract: An electronic device includes a target metal segment, a first sensing circuit, and a second sensing circuit. The first sensing circuit is connected to the target metal segment and obtains a first parameter based on a first sensing signal of the target metal segment. The first parameter is used to indicate a distance between a target object and the target metal segment. The second sensing circuit is connected to the target metal segment and obtains a second parameter based on a second sensing signal of the target metal segment. The second parameter is used to indicate a type of the target object.Type: ApplicationFiled: June 26, 2024Publication date: January 2, 2025Inventor: Yu-Che LIN
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Publication number: 20250002751Abstract: The present disclosure relates to a two-component aqueous coating composition for wood based substrates and an article made therefrom. The aqueous coating composition includes (i) a primary agent, said primary agent including a) an aqueous polyurethane dispersion (PUD), b) an aqueous acrylic modified polyurethane (PUA), c) an aqueous liquid carrier, and d) additional additives; and ii) a curing agent composition, said curing agent composition including a hydrophilic modified aliphatic polyisocyanate, wherein a mass ratio of said primary agent to said curing agent composition is in the range of 100:5 to 100:20. The two-component aqueous coating composition of the present disclosure has a longer pot life, and a superior constructability and the coating formed therefrom has a particular excellent gloss stability.Type: ApplicationFiled: June 26, 2024Publication date: January 2, 2025Inventors: Yu Che, Guijun Fan, Zhenlin Lu, Tingyu Hu
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Publication number: 20240427092Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.Type: ApplicationFiled: September 10, 2024Publication date: December 26, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Chieh TANG, Lu-Ming LAI, Yu-Che HUANG, Ying-Chung CHEN
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Publication number: 20240363343Abstract: A method includes following steps. A single-crystalline two-dimensional (2D) semiconductor layer is formed over a substrate. A single-crystalline 2D material layer is epitaxially grown on the single-crystalline 2D semiconductor layer. The single-crystalline 2D material layer is lattice-matched with the single-crystalline 2D semiconductor layer. A semiconductor device is over the single-crystalline 2D semiconductor layer.Type: ApplicationFiled: April 27, 2023Publication date: October 31, 2024Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., National Yang Ming Chiao Tung UniversityInventors: Shu-Jui CHANG, Shin-Yuan WANG, Yu-Che HUANG, Chao-Hsin CHIEN, Chenming HU
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Publication number: 20240347340Abstract: An epitaxial structure includes a substrate and a dielectric layer. The dielectric layer is on the substrate. The substrate comprises a single crystal metal or a single crystal 2D material. The dielectric layer is in physical contact with the substrate. The dielectric layer comprises a non-perovskite structure with defined grain orientation with ferroelectric (FE) phase or antiferroelectric (AFE) phase.Type: ApplicationFiled: April 12, 2023Publication date: October 17, 2024Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL YANG MING CHIAO TUNG UNIVERSITYInventors: Shu-Jui CHANG, Shin-Yuan WANG, Yu-Che HUANG, Chao-Hsin CHIEN, Chenming HU