Patents by Inventor Yu Chu

Yu Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250072039
    Abstract: A semiconductor structure includes a first circuit area having first fin active regions extending lengthwise along a first direction, each of the first fin active regions includes first channel regions; a second circuit area having second fin active regions extending lengthwise along the first direction, each of the second fin active regions includes second channel regions; a gate connector area between and separating the first and the second circuit areas, the gate connector area having filter fins extending lengthwise along the first direction; and a gate structure extending across the first circuit area, the gate connector area, and the second circuit area along a second direction over the first and second channel regions and the filter fins. A portion of the gate structure in the gate connector area has a greater resistivity than portions of the gate structure in the first and the second circuit areas.
    Type: Application
    Filed: January 24, 2024
    Publication date: February 27, 2025
    Inventors: Yi-Hong Wang, Hui-Hsuan Kung, Tien Yu Chu, Chih-Hsiao Chen, Yi-Chen Li
  • Publication number: 20250072135
    Abstract: A semiconductor device, and method of fabricating the same, includes a first substrate, the first substrate including at least one visible light photosensor disposed between a first side and a second side of the first substrate, a second substrate including an infrared light photosensor disposed between a second side of the second substrate and a first side of the second substrate, and a metalens disposed between the visible light photosensor and the infrared light photosensor, the metalens configured to focus infrared light impinging on a surface of the first substrate onto the infrared light photosensor.
    Type: Application
    Filed: August 25, 2023
    Publication date: February 27, 2025
    Inventors: Hsiang-Lin Chen, Yi-Shin Chu, Cheng-Yu Huang, Wei-Chieh Chiang, Dun-Nian Yaung
  • Patent number: 12237800
    Abstract: An electric window covering has a covering material, a driving device, a microcontroller, a position detecting module and a trigger detecting module. The position detecting module detects a position of a lower end of the covering material to generate a position information. The microcontroller compares the position information with a reference position to generate a position relationship with respect to the reference position. The trigger detecting module detects whether the covering material is moved by an external force for generating a detecting result. When the microcontroller determines that a trigger event is received according to the detecting result, the microcontroller configures the driving device to move the covering material according to the position relationship and the trigger event.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: February 25, 2025
    Assignee: Nien Made Enterprise Co., Ltd.
    Inventors: Chao-Hung Nien, Jui-Pin Jao, Ping-Yu Chu
  • Patent number: 12233368
    Abstract: A device for removing particles in a gas stream includes a first cylindrical portion configured to receive the gas stream containing a target gas and the particles, a rotatable device disposed within the first cylindrical portion and configured to generate a centrifugal force when in a rotational action to divert the particles away from the rotatable device, a second cylindrical portion coupled to the first cylindrical portion and configured to receive the target gas, and a third cylindrical portion coupled to the first cylindrical portion and surrounding the second cylindrical portion, the third cylindrical portion being configured to receive the diverted particles.
    Type: Grant
    Filed: August 13, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
  • Patent number: 12235410
    Abstract: An optical lens assembly includes, from an object side to an image side, at least four optical lens elements. At least one of the at least four optical lens elements includes an anti-reflective coating. The at least one optical lens element including the anti-reflective coating is made of a plastic material. The anti-reflective coating is arranged on an object-side surface or an image-side surface of the at least one optical lens element including the anti-reflective coating. The anti-reflective coating includes at least one coating layer. One of the at least one coating layer at the outer of the anti-reflective coating is made of ceramics. The anti-reflective coating includes a plurality of holes, and sizes of the plurality of holes adjacent to the outer of the anti-reflective coating are larger than sizes of the plurality of holes adjacent to the inner of the anti-reflective coating.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: February 25, 2025
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Wen-Yu Tsai, Chien-Pang Chang, Chi-Wei Chi, Wei-Fong Hong, Chun-Hung Teng, Kuo-Chiang Chu
  • Patent number: 12238864
    Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: February 25, 2025
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Lin Hsu, Kuan-Chu Wu, Ting-Yu Ke, Min-Hsiung Liang, Yu-Ming Peng
  • Patent number: 12237369
    Abstract: A semiconductor device includes a substrate; at least one trench located at a top surface of the substrate; and a first dielectric layer, a second dielectric layer and a third dielectric layer that are sequentially stacked on an inner wall of each of the at least one trench. A topmost surface of the first dielectric layer is lower than a topmost surface of the second dielectric layer and the top surface of the substrate, to form a first groove between the second dielectric layer and the substrate. An edge corner between the top surface of the substrate and the inner wall of each of the at least one trench is in a shape of a fillet curve. The fillet structure is smooth and round without a sharp corner, reducing point discharge and improving reliability of the shallow trench isolation structure.
    Type: Grant
    Filed: October 16, 2023
    Date of Patent: February 25, 2025
    Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Huixian Lai, Yu Cheng Tung, Chao-Wei Lin, Chiayi Chu
  • Patent number: 12235409
    Abstract: An optical lens assembly includes, from an object side to an image side, at least four optical lens elements. At least one of the at least four optical lens elements includes an anti-reflective coating. The at least one optical lens element including the anti-reflective coating is made of a plastic material. The anti-reflective coating is arranged on an object-side surface or an image-side surface of the at least one optical lens element including the anti-reflective coating. The anti-reflective coating includes at least one coating layer. One of the at least one coating layer at the outer of the anti-reflective coating is made of ceramics. The anti-reflective coating includes a plurality of holes, and sizes of the plurality of holes adjacent to the outer of the anti-reflective coating are larger than sizes of the plurality of holes adjacent to the inner of the anti-reflective coating.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: February 25, 2025
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Wen-Yu Tsai, Chien-Pang Chang, Chi-Wei Chi, Wei-Fong Hong, Chun-Hung Teng, Kuo-Chiang Chu
  • Publication number: 20250063956
    Abstract: A semiconductor structure includes a ferroelectric layer and a semiconductor layer. Thee ferroelectric layer has a first surface and a second surface opposite to the first surface. The semiconductor layer is formed on one of the first surface and the second surface.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Yu CHEN, Sheng-Hung SHIH, Kuo-Chi TU, Wen-Ting CHU, Kuo-Ching HUANG, Harry-Haklay CHUANG
  • Publication number: 20250048647
    Abstract: In some embodiments, the present disclosure relates to a method of forming an integrated chip including forming a ferroelectric layer over a bottom electrode layer, forming a top electrode layer over the ferroelectric layer, performing a first removal process to remove peripheral portions of the bottom electrode layer, the ferroelectric layer, and the top electrode layer, and performing a second removal process using a second etch that is selective to the bottom electrode layer and the top electrode layer to remove portions of the bottom electrode layer and the top electrode layer, so that after the second removal process the ferroelectric layer has a surface that protrudes past a surface of the bottom electrode layer and the top electrode layer.
    Type: Application
    Filed: October 21, 2024
    Publication date: February 6, 2025
    Inventors: Chih-Hsiang Chang, Kuo-Chi Tu, Sheng-Hung Shih, Wen-Ting Chu, Tzu-Yu Chen, Fu-Chen Chang
  • Publication number: 20250046164
    Abstract: Provided are a method and system for interactively searching for a target object and a storage medium. The method includes: obtaining a first interactive instruction from a first terminal; determining a target object corresponding to the first interactive instruction; obtaining target information of the target object; where the target information includes at least one of: a current position of the target object, picture information of the current position, a historical trajectory of the target object, a navigation route, or any combination thereof; sending the target information to the first terminal such that the first terminal displays the target information.
    Type: Application
    Filed: February 28, 2023
    Publication date: February 6, 2025
    Inventors: Ning ZHANG, Yu GU, Yue LI, Xiaozhen JIA, Fanhao KONG, Xiao CHU
  • Patent number: 12216090
    Abstract: A device is provided for blade detection. The device comprises a supporting frame, a linear track, and a fixture. The supporting frame comprises a plurality of aluminum extruded bodies with connectors thereof and a plurality of rotating adjusting pads with fixing plates thereof; the linear track comprises a plurality of tracks with connectors thereof and a plurality of sliders; and the fixture comprises a bearing holder part, a bearing connector, a sliding rod, a joint bearer with a connector thereof, a chuck, and a detector. On detecting a blade, the present invention helps the detector to be maintained on the blade surface for detection in horizontal and vertical directions without deviating from track; and the detector is in contact with the blade surface to move precisely and regularly without missing or repeating detection areas. Thus, the area is detected completely with time saved and accuracy improved.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: February 4, 2025
    Assignee: Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan, R. O.C.
    Inventors: Yu-Chu Lin, Wei-Nian Su
  • Patent number: 12216332
    Abstract: An imaging lens assembly has an optical axis and includes a plastic lens element set. The plastic lens element set includes two plastic lens elements and at least one anti-reflective layer. The two plastic lens elements, in order from an object side to an image side along the optical axis are a first plastic lens element and a second plastic lens element. The anti-reflective layer has a nanostructure and is disposed on at least one of an image-side surface of the first plastic lens element and an object-side surface of the second plastic lens element.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: February 4, 2025
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chien-Pang Chang, Wen-Yu Tsai, Lin-An Chang, Ming-Ta Chou, Kuo-Chiang Chu
  • Patent number: 12218184
    Abstract: A semiconductor structure includes a capacitor structure and a contact structure. The capacitor structure includes an electrode layer, a protective dielectric layer, and a capacitor dielectric layer. The protective dielectric layer covers a top surface of the electrode layer. The capacitor dielectric layer is on the protective oxide layer. The contact structure penetrates the protective oxide layer and electrically connects to the electrode layer.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jui-Lin Chu, Szu-Yu Wang, Ching I Li
  • Patent number: 12216869
    Abstract: Provided are a display panel and a display device. An isolation dam is provided in a peripheral area of the display panel. The display panel includes: a display functional layer comprising a plurality of display signal traces; and a touch-control functional layer comprising a plurality of touch-control signal traces. On the binding side, there are a first boundary and a second boundary, and a first trace area located between the first boundary and the second boundary, the first boundary is closer to the display area than the second boundary. In the first trace area, the touch-control signal trace is arranged along a first direction and are led out from the binding circuit and connected to the touch-control pattern via the isolation dam and the first trace area in sequence, the display signal trace is arranged along a second direction and intersects with the touch signal trace.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: February 4, 2025
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yi Qu, Zhiwen Chu, Yang Zhou, Lu Bai, Junxiu Dai, Xinxin Wang, Yi Zhang, Shun Zhang, Xin Chen, Yu Wang, Ping Wen, Yuanqi Zhang, Wei Wang
  • Patent number: 12218253
    Abstract: A flash memory device and method of making the same are disclosed. The flash memory device is located on a substrate and includes a floating gate electrode, a tunnel dielectric layer located between the substrate and the floating gate electrode, a smaller length control gate electrode and a control gate dielectric layer located between the floating gate electrode and the smaller length control gate electrode. The length of a major axis of the smaller length control gate electrode is less than a length of a major axis of the floating gate electrode.
    Type: Grant
    Filed: April 15, 2023
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yu-Chu Lin, Chi-Chung Jen, Wen-Chih Chiang, Yi-Ling Liu, Huai-Jen Tung, Keng-Ying Liao
  • Patent number: 12211811
    Abstract: An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: January 28, 2025
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Ming Peng, Chien-Chou Tseng, Chih-Chia Chang, Kuan-Chu Wu, Yu-Lin Hsu
  • Patent number: 12211802
    Abstract: A package structure includes a plurality of semiconductor die, an insulating encapsulant and a redistribution layer. Each of the plurality of semiconductor dies includes a semiconductor substrate, conductive pads disposed on the semiconductor substrate, conductive posts disposed on the conductive pads, and at least one alignment mark located on the semiconductor substrate. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant and electrically connected to the plurality of semiconductor dies.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu
  • Publication number: 20250030236
    Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The weight average molecular weight of the second fluoropolymer ranges from 630000 g/mol to 1100000 g/mol. The conductive filler is dispersed in the polymer matrix, thereby forming an electrically conductive path in the heat-sensitive layer.
    Type: Application
    Filed: December 20, 2023
    Publication date: January 23, 2025
    Inventors: Hsiu-Che YEN, Chingting CHIU, Chia-Yuan LEE, Chen-Nan LIU, Cheng-Yu TUNG, Yung-Hsien CHANG, Yao-Te CHANG, Fu-Hua CHU
  • Publication number: 20250029756
    Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The first fluoropolymer includes a first melting point, and the second fluoropolymer has a second melting point lower than the first melting point. The difference between the first melting point and the second melting point is smaller than 14° C. The second fluoropolymer has a second melt flow index ranging from 0.4 g/10 min to 0.7 g/10 min.
    Type: Application
    Filed: January 23, 2024
    Publication date: January 23, 2025
    Inventors: CHENG-YU TUNG, Chia-Yuan Lee, HSIU-CHE YEN, CHINGTING CHIU, CHEN-NAN LIU, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU