Abstract: A method of polishing substrates which enables a size of a polishing table to be reduced is provided. In the method, a surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extends outwardly from an outer periphery of the polishing surface The substrate is rotated about its center axis while keeping its surface in contact with the polishing surface of the polishing table. The attitude of the substrate carrier is controlled so that the surface of the substrate is kept parallel with the polishing surface of the polishing table during a polishing operation.

Abstract: A polisher comprises a turn table having first and second end surfaces which are substantially normal to an axis of the turn table. The first end surface defines a polishing surface for polishing an article. A drive shaft is connected to the turn table in such a manner that the shaft extends along the axis of the turn table from the second end surface of the turn table. The polisher further includes a cooling system which comprises a cooling fluid path provided in the turn table for passing a cooling fluid therethrough to deprive the polishing surface of heat generated in a polishing operation and a fluid coupler provided at the center of the first end surface of the turn table for fluidly connecting the cooling fluid path with a cooling fluid supply outside of the turn table.