Abstract: An audio signal modulation and amplification circuit includes a common-mode electric potential controller, a carrier generator, and channel circuits. The common-mode electric potential controller is configured to generate one or more first common-mode electric potentials and second common-mode electric potentials. The carrier generator is adapted to receive the first common-mode electric potential to generate a carrier signal. Each of the channel circuits includes a filter, a comparison circuit, and a driving circuit. The filter is adapted to filter an input signal and generate a filtered signal based on a corresponding one of the second common-mode electric potentials. The comparison circuit is configured to compare the potential of the carrier signal with the potential of the filtered signal to generate a pulse-width modulation signal. The driving circuit is configured to be turned on or off in response to the pulse-width modulation signal to output a load driving signal.

Abstract: A voltage-controlled oscillator device includes first and second voltage-controlled oscillators, a first switch group including two first switches, and a second switch group including two second switches. The first voltage-controlled oscillator includes a first inductor group, a first negative resistance circuit and a first voltage output terminal group. The second voltage-controlled oscillator includes a second inductor group, a second negative resistance circuit and a second voltage output terminal group. For the first switch group, first control terminals are electrically connected to the first voltage output terminal group, first input terminals are electrically connected to the second voltage output terminal group, first output terminals are electrically connected.

Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.

Abstract: A sensing device includes a substrate, a first circuit, a second circuit, a first photodetector, and a second photodetector. The first circuit is disposed on the substrate, and configured to sense a fingerprint. The second circuit is disposed on the substrate, and configured to detect a data of a living body. The first photodetector is electrically connected to the first circuit. The second photodetector is electrically connected to the second circuit. The area of the second photodetector is larger than the area of the first photodetector.

Abstract: A communications system between a source and a destination includes a transmitter at the source and a communication connectivity. The transmitter comprises a preprocessor and a candidate envelope folder to provide M known a priori digital envelopes, M?1. The preprocessor has N input ports and N output ports, N>M, performs at least one wavefront multiplexing (WFM) transform on N inputs received at the N input ports to generate N outputs at the N output ports. The preprocessor performs the at least one WFM transform by calculating, for each of the N outputs, a linear combination of the N inputs using one of the M digital envelopes such that a digital format of one of the N outputs appears to human sensors as having features substantially identical to a digital format of the one of the M digital envelopes.

Abstract: A method for manufacturing a sensing device is provided. The method includes: providing a substrate; forming a sensing unit on the substrate; forming a first light-shielding layer on the sensing unit; forming a first anti-reflection layer on the sensing unit; and patterning the first light-shielding layer and the first anti-reflection layer using a single lithography process to form a first pinhole corresponding to the sensing unit.

Abstract: A sensing device includes a sensing circuit, a conductive line, and a sampling circuit. The conductive line is electrically connected to the sensing circuit. The sampling circuit is electrically connected to the conductive line. The sampling circuit includes a capacitor, a first thin film transistor, and a second thin film transistor. The first terminal of the first thin film transistor is electrically connected to the first terminal of the capacitor. The first terminal of the second thin film transistor is electrically connected to the second terminal of the capacitor. The second terminal of the first thin film transistor is electrically connected to the conductive line. The second terminal of the second thin film transistor is electrically connected to the ground terminal.

Abstract: A semiconductor device includes a first interlayer dielectric layer disposed over a substrate, metal wirings, a second interlayer dielectric layer disposed over the first interlayer dielectric layer and the metal wirings, a first air gap and a second air gap. The metal wirings are embedded in the first interlayer dielectric layer, and arranged with a first space or a second space between the metal wirings. The second space has a greater length than the first space. The first air gap is formed by the second interlayer dielectric layer and formed in a first area sandwiched by adjacent two metal wirings arranged with the first space. The second air gap is formed by the second interlayer dielectric layer and formed in a second area sandwiched by adjacent two metal wirings arranged with the second space therebetween. No adjacent two metal wirings are arranged with a space smaller than the first space.

Abstract: A sensing device is provided herein, which operates in a reset period, an exposure period, and a readout period. The sensing device includes a first transistor, a second transistor, a detection device, and a third transistor. The first transistor includes a control terminal and a first terminal. The second transistor is coupled to the first transistor and configured to set the voltage of the control terminal during the exposure period. The sensing device is coupled to the first transistor and configured to change the voltage of the control terminal during the exposure period. The third transistor is coupled to the first transistor and includes an output terminal outputting a sense signal from the first terminal during the readout period. The first transistor is an N-type transistor and the third transistor is a P-type transistor.

Abstract: An electronic device is provided. The electronic device includes a sensing device. The sensing device includes an anti-reflection unit, a circuit layer and a light-sensing element. The circuit layer includes a thin-film transistor and is disposed on the anti-reflection unit. The light-sensing element is disposed on the circuit layer and is electrically connected to the thin-film transistor.

Abstract: A metal shielding frame is provided. The metal shielding frame is adapted to be disposed in a socket, wherein the socket is adapted to be electrically connected to a connector. The metal shielding frame includes a sleeve-shaped frame body and at least one ground hemming portion. The sleeve-shaped frame body includes a first enclosed edge. The ground hemming portion is formed on the first enclosed edge. The socket includes a socket case and a socket joint. The socket case surrounds the socket joint. The sleeve-shaped frame body is adapted to be inserted between the socket case and the socket joint.

Abstract: A method and a system for verifying an integrated circuit stack having at least one silicon photonic device is introduced. A dummy layer and a dummy layer text are added to a terminal of at least one silicon photonic device of the integrated circuit. The method may perform a layout versus schematic check of the integrated circuit including the dummy layer and the dummy layer text.

Abstract: A touch control method is provided. The method includes: providing a touch device with multiple touch electrodes; determining whether an object is located in a sensing distance; detecting a sensing group sensing the object if the determination is yes; determining whether an electrode amount in the electrode group is between a first value and a second value; determining whether a sensing time of a predetermined proportion of the touch electrodes in the sensing group is equal to or greater than a predetermined time; executing a fingerprint recognition mode if the electrode amount is between the first value and the second value, and the sensing time is equal to or greater than the predetermined time; executing a touch operation mode if the electrode amount is less than the first value or greater than the second value, or the sensing time is less than the predetermined time.

Abstract: A method for allocating wireless resources based on sensitivity to interference provides a base station controller which, within an area of overlap of adjacent wireless cells, determines a set of neighboring cell pairs from a plurality of cells. The base station controller sorts the set of neighboring cell pairs according to the number of inner-pair interfered user equipment devices of each neighboring cell pair where inner-pair interfered user equipment devices are user equipment devices located in coverage areas of the neighboring cell pair and allocates resource blocks for each neighboring cell pair sequentially based on the sorted set. An apparatus employing the method is also disclosed.

Abstract: A biometric sensing device and a display apparatus including the same are provided. The biometric sensing device includes a first thin film transistor, a second thin film transistor, and a photodiode. The first thin film transistor has a gate. The second thin film transistor has a semiconductor layer and a non-gate electrode terminal. The non-gate electrode terminal is electrically connected to the gate of the first thin film transistor. The photodiode contacts a semiconductor layer.

Abstract: An integrated circuit includes a first semiconductor wafer, a second semiconductor wafer, a first interconnect structure, an inductor, and a through substrate via. The first semiconductor wafer has a first device in a first side of the first semiconductor wafer. The second semiconductor wafer is over the first semiconductor wafer. The first interconnect structure is on a second side of the first semiconductor wafer opposite from the first side of the first semiconductor wafer. The inductor is below the first semiconductor wafer, and at least a portion of the inductor is within the first interconnect structure. The through substrate via extends through the first semiconductor wafer. The inductor is coupled to at least the first device by at least the through substrate via.

Abstract: A lightweight paddle capable of improving surface flatness includes a paddle body and a handle connected to the paddle body. The paddle body includes a substrate layer and two face plates. The substrate layer is formed with a groove. An elastic member is embedded in the groove. When the two face plates are glued to the substrate layer, the groove of the substrate layer provides a deformation space for the elastic member, which can make the outer surface of the elastic member flush with the surface of the substrate layer. The overall weight of the product can be reduced effectively, so the paddle is more lightweight.

Abstract: A computer-implemented method includes receiving an anomaly clustering request that requests data processing hardware to assign each image of a plurality of images into one of a plurality of groups. The method also includes obtaining a plurality of images. For each respective image, the method includes extracting a respective set of patch embeddings from the respective image, determining a distance between the respective set of patch embeddings and each other set of patch embeddings, and assigning the respective image into one of the plurality of groups using the distances between the respective set of patch embeddings and each other set of patch embeddings.

Abstract: A fingerprint sensing apparatus includes a plurality of fingerprint sensing electrodes, a plurality of data lines respectively sandwiched by a first capacitance-shielding wire and a second capacitance-shielding wire, a fingerprint sensing circuit including a driver circuit with a gain larger than zero or equal to zero. During fingerprint sensing, the fingerprint sensing circuit sends a capacitance-exciting signal to a selected fingerprint sensing electrode, receiving a fingerprint sensing signal from the selected fingerprint sensing electrode, processing the fingerprint sensing signal with the driver circuit into a capacitance-eliminating signal and applying the capacitance-eliminating signal to the first capacitance-shielding wire and the second capacitance-shielding wire respectively.

Abstract: A communication system comprises a remote digital beam-forming network configured to receive a set of input signals destined for a set of user devices and generate element signals to be radiated by a set of remote antenna array elements; a pre-processor coupled to the remote digital beam-forming network, configured to perform a wavefront multiplexing transform on signal waveforms including the element signals and generate wavefront multiplexed signals; an optical line terminal coupled to the pre-processor, configured to process the wavefront multiplexed signal streams to generate optical waveform streams; and optical fibers coupling the optical line terminal to a set of optical network units.