Abstract: An integrated radiator having a temperature gradient is disposed between a high-temperature device and a low-temperature device. The integrated radiator includes a first heat dissipation unit and a second heat dissipation unit which are integrally fixed. The first heat dissipation unit is configured to maintain the high-temperature device within a first temperature range, and the second heat dissipation unit is configured to maintain the low-temperature device within a second temperature range. A thermal conductive path of the first heat dissipation unit is isolated from a thermal conductive path of the second heat dissipation unit, and the first heat dissipation unit is physically connected to but thermally separated from the second heat dissipation unit.

Abstract: A control method and device (100) based on an industrial Ethernet relate to the technical field of Ethernet. The industrial Ethernet involves a master node and a plurality of slave nodes. The master node transmits a predetermined packet to a first slave node (S140). The first slave node transmits the predetermined packet having been rewritten by the first slave node to a succeeding slave node linked to the first slave node until a last slave node in the plurality of the slave nodes receives the predetermined packet having been rewritten by all preceding slave nodes in the plurality of the slave nodes; and the last slave node transmits the predetermined packet back to the master node (S150). The master node then parses the predetermined packet, which has been rewritten by each of the plurality of the slave nodes, to uncover a topology of the slave nodes (S160). The master node informed by the topology transmits a command packet to one of the plurality of the slave nodes to be controlled (S180).

Abstract: The present invention provides a method for detecting motor initial phase and phase sequence and a system for controlling a permanent-magnet synchronous motor. The method is applied to the system and comprises sequentially acquiring, through an encoder, first displacement data which register the encoder's reading when a rotor spins to a Q-axis, second displacement data which register the encoder's reading when the rotor spins from the Q-axis to a D-axis, third displacement data which register the encoder's reading when the rotor spins from the D-axis to a negative Q-axis and fourth displacement data which register the encoder's reading when the rotor spins from the negative Q-axis to the D-axis; obtaining an initial phase of the motor to be detected according to the second displacement data, the fourth displacement data and the encoder's CPR; and determining the phase sequence of the motor based on the first displacement data, the second displacement data and the encoder's CPR.

Abstract: A distributed multi-node control system (100) and method, relating to the field of control technology. The distributed multi-node control system (100) comprises: a first control node (11), a second control node (12), a plurality of servo nodes (20) and a plurality of execution devices (30), the first control node (11) and the second control node (12) being respectively communicationally connected to the plurality of servo nodes (20), the servo nodes (20) being electrically connected to the execution devices (30) and configured to control operating states of the corresponding execution devices (30), the first control node (11) being configured to control an operating state of at least one first servo node (21) among the plurality of servo nodes (20), the second control node (12) being configured to control an operating state of at least one second servo node (22) among the plurality of servo nodes (20).

Abstract: Methods for pre-cleaning substrates having metal and dielectric surfaces are described. A substrate comprising a surface structure with a metal bottom, dielectric sidewalls, and a field of dielectric is exposed to a dual plasma treatment in a processing chamber to remove chemical residual and/or impurities from the metal bottom, the dielectric sidewalls, and/or the field of the dielectric and/or repair surface defects in the dielectric sidewalls and/or the field of the dielectric. The dual plasma treatment comprises a direct plasma and a remote plasma.

Abstract: Provided is a processing chamber configured to contain a semiconductor substrate in a processing region of the chamber. The processing chamber includes a remote plasma unit and a direct plasma unit, wherein one of the remote plasma unit or the direct plasma unit generates a remote plasma and the other of the remote plasma unit or the direct plasma unit generates a direct plasma. The combination of a remote plasma unit and a direct plasma unit is used to remove, etch, clean, or treat residue on a substrate from previous processing and/or from native oxide formation. The combination of a remote plasma unit and direct plasma unit is used to deposit thin films on a substrate.

Abstract: A frame structure includes a frame body and at least one vibration absorbing structure. The vibration absorbing structure has a support column and at least one cantilever. The cantilever has a cantilever body, a first end portion and a second end portion. One end of the support column is connected to a wall surface of the frame body. The first end portion of the cantilever is connected to the support column. The cantilever body and the second end portion extend outwardly and swing freely on the wall surface of the frame body. When the cantilever body and the second end portion are swinging, they are not in contact with any peripheral member and the frame structure.

Abstract: The present disclosure relates to a satellite signal feeding module and circuit board structure. The circuit board includes a dielectric substrate, a plurality of grounding sheets, a plurality of top feed sheets, a plurality of bottom feed sheets, and a conductive layer. The dielectric substrate includes a main segment having an opening, a rib segment extending across a full width of the opening, and a plurality of extending segments connected to the main segment. The grounding sheets cover the rib segment and a majority portion of the main segment. The top feeding sheets and the bottom sheets cover the extending segments. The conductive layer is disposed in first holes disposed in the main segment and the rib segment for electrically coupling the grounding sheets. The conductive layer is further disposed in second holes in the extending segments for electrically coupling the top and bottom feeding sheets.

Abstract: Embodiments of the disclosure relate to methods of depositing tungsten. Some embodiments of the disclosure provide methods for depositing tungsten which are performed at relatively low temperatures. Some embodiments of the disclosure provide methods in which the ratio between reactant gasses is controlled. Some embodiments of the disclosure provide selective deposition of tungsten. Some embodiments of the disclosure provide methods for depositing tungsten films at a low temperature with relatively low roughness, stress and impurity levels.

Abstract: The present disclosure relates to a satellite signal feeding module and circuit board structure. The circuit board includes a dielectric substrate, a plurality of grounding sheets, a plurality of top feed sheets, a plurality of bottom feed sheets, and a conductive layer. The dielectric substrate includes a main segment having an opening, a rib segment extending across a full width of the opening, and a plurality of extending segments connected to the main segment. The grounding sheets cover the rib segment and a majority portion of the main segment. The top feeding sheets and the bottom sheets cover the extending segments. The conductive layer is disposed in first holes disposed in the main segment and the rib segment for electrically coupling the grounding sheets. The conductive layer is further disposed in second holes in the extending segments for electrically coupling the top and bottom feeding sheets.

Abstract: The present disclosure generally relates to methods for processing of substrates, and more particularly relates to methods for forming a metal gapfill. In one implementation, the method includes forming a metal gapfill in an opening using a multi-step process. The multi-step process includes forming a first portion of the metal gapfill, performing a sputter process to form one or more layers on one or more side walls, and growing a second portion of the metal gapfill to fill the opening with the metal gapfill. The metal gapfill formed by the multi-step process is seamless, and the one or more layers formed on the one or more side walls seal any gaps or defects between the metal gapfill and the side walls. As a result, fluids utilized in subsequent processes do not diffuse through the metal gapfill.

Abstract: An image processing method. The method includes determining a first mapping relationship between first coordinates in a first coordinate system of a Multi-Resolution-Shading image and second coordinates in a second coordinate system of a Multi-Resolution-Shading screen image; and applying an anti-distortion process to the Multi-Resolution-Shading image based on the first mapping relationship, thereby obtaining an anti-distortion image.

Abstract: Improved sensor assemblies are provided. More particularly, the present disclosure provides microelectrode array (“MEA”) real-time in situ global sensing assemblies for enhancing efficiency and stability of wastewater treatment systems. In general, the present disclosure provides for a novel global sensing technology utilizing a microelectrode array (MEA) to solve various problems of monitoring wastewater treatment systems. The present disclosure provides for improved systems/methods for monitoring wastewater treatment systems, with the improved systems/methods obtaining a substantially complete global profile of multiple parameters simultaneously. More particularly, the present disclosure provides that by patterning multiple electrodes (e.g., mm-sized electrodes) on a film (e.g.

Abstract: Methods and apparatus for filling a feature disposed in a substrate, including: depositing a first metal within the feature to a first predetermined thickness in a first process chamber; etching the first metal to remove a first portion of the metal at a top of the feature in a second process chamber different than the first process chamber to form an exposed surface of the first metal, and selectively depositing a second metal atop the exposed surface of the first metal within the feature to a second predetermined thickness in a third process chamber; wherein etching the first metal and selectively depositing a second metal are performed without oxygen contacting the top surface.

Abstract: A control method for a head-mounted visual apparatus, a corresponding computing apparatus, a head-mounted visual apparatus and a computer-readable storage medium. The head-mounted visual apparatus has an infrared transceiver including an infrared light source array and an infrared detector. The control method comprises the steps of: driving each sub-light source to emit coherent infrared light to form an interference enhanced scanning light spot on a face of a user who wears the head-mounted visual apparatus; controlling each phase of the coherent infrared light emitted by each sub-light source respectively to make the scanning light spot move in the local area, including eyes, of the face of the user, to realize a scanning of the local area; and using the infrared detector to receive the infrared light reflected from the local area to generate scanning data.

Abstract: A wearable device, a signal processing method and a signal processing device are disclosed. The wearable device includes a processor and a signal collector electrically connected to the processor. The signal collector includes at least one electroencephalogram sensor configured to collect an electroencephalogram signal and at least one electrooculogram sensor configured to collect an electrooculogram signal. The processor is configured to generate a control signal based on the electroencephalogram signal and the electrooculogram signal, and the electroencephalogram sensor and the electrooculogram sensor are different sensors.

Abstract: Interconnects and methods for forming interconnects are described and disclosed herein. The interconnect contains a stack formed on a substrate having a via and a trench formed therein, a first metal formed from a first material of a first type deposited in the via, and a second metal formed from a second material of a second type deposited in the trench.

Abstract: A floating offshore wind turbine integrated with a steel fish farming cage mainly includes a wind turbine, a wind turbine tower, a living quarter, a floating wind turbine foundation in a conic steel structure, a mooring system, a lateral net encircling the floating wind turbine foundation, a bottom net, and lifting systems. The upper end of the wind turbine tower hosts a wind turbine, and the lower end of the wind turbine tower is fixed on the floating wind turbine foundation. In the present invention, the inner space of the floating wind turbine foundation is used to form a huge farming cage, which functions for the objectives of “power exploitation on the top and fish farming at the bottom”. The foundation has excellent stability and seakeeping performance, and is applicable to deep waters.

Abstract: A driving circuit for head-worn display device, and a virtual reality display device, and the driving circuit includes: a display panel driving circuit, the display panel driving circuit comprises a sensor circuit, and a data processing circuit; the sensor circuit is configured to generate a posture information signal corresponding to a rotation direction of the display panel; and the data processing circuit is configured to receive the posture information signal and a display data signal for a display panel, and to control the display panel according to the posture information signal and the display data signal to display an image corresponding to a rotation direction.

Abstract: Methods for depositing a metal layer in a feature definition of a semiconductor device are provided. In one implementation, a method for depositing a metal layer for forming a semiconductor device is provided. The method comprises performing a cyclic metal deposition process to deposit a metal layer on a substrate and annealing the metal layer disposed on the substrate. The cyclic metal deposition process comprises exposing the substrate to a deposition precursor gas mixture to deposit a portion of the metal layer on the substrate, exposing the portion of the metal layer to either a plasma treatment process or hydrogen annealing process and repeating the exposing the substrate to a deposition precursor gas mixture and exposing the portion of the metal layer to either a plasma treatment process or hydrogen annealing process until a predetermined thickness of the metal layer is achieved.