Abstract: Provided are a wireless power apparatus, a charging dock and an electronic equipment. In the wireless power apparatus, a housing is provided with a mounting cavity; a first battery is disposed within the mounting cavity; multiple first magnetic pieces are disposed in the housing and are configured for adsorbing multiple first adsorption pieces of an equipment body, respectively; a first charging assembly is configured to charge the first battery, a wireless power supply assembly is disposed within the mounting cavity, is electrically connected to the first battery, and is capable of transmitting power of the first battery to the equipment body.

Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

Abstract: A fan guard for a fan container includes a housing and a plurality of wings. The housing has a hollow interior defined by a cylindrical inner surface. The housing extends longitudinally between a first housing end and a second housing end. The plurality of wings is positioned within the hollow interior of the housing. Each wing of the plurality of wings extends radially, from a center of symmetry of the cylindrical inner surface to the cylindrical inner surface. Each wing of the plurality of wings is radially curved between the first housing end and the second housing end.

Abstract: A computer chassis includes walls defining an airspace containing heat-generating components (e.g., storage drives). The airspace is divided into first and second regions, such as by a printed circuit board supporting the heat-generating components within the first region. An air input feeds both the first region and second region. Input air going through the first region first passes by a forward set of heat-generating components before continuing to a rearward set of heat-generating components to extract heat therefrom. Input air going through the second region bypasses the forward set of heat-generating components before being directed out through an air opening partway down the length of the chassis, after which this air passes by a rearward set of heat-generating components to extract heat.

Abstract: A system for cooling a heat-generating electronic component includes a first stage, a second stage, and a heat exchanger. The first stage has a first cooling path that circulates a first cooling fluid past the heat-generating electronic component to cause the first cooling fluid to absorb heat from the heat-generating electronic component and the temperature of the first cooling fluid to increase. The second stage circulates a second cooling fluid to increase a pressure of the second cooling fluid, remove heat from the second cooling fluid to decrease a temperature of the second cooling fluid, and decrease the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid. The heat exchanger is fluidly connected to the first stage and the second stage, and causes the second cooling fluid to flow past and absorb heat from the first cooling fluid.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: A device for a computing system is disclosed. The device includes a body, a socket, and a connector. The body includes a panel and an internal conduit. The connector extends from the panel. The connector is removably coupled to the socket. The connector includes an outer end and an inner end. The connector also includes a nut that has an exterior surface mating with a corresponding interior surface of the socket, and a tubular inlet. The connector also has a sleeve with an internal bore and an external surface abutting the tubular inlet of the nut. The internal conduit is coupled to the inner end of the connector to circulate cooling liquid through the body. The nut includes an angled portion and the sleeve includes a flared portion for assisting in securing the nut and the sleeve in the internal conduit.

Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.

Abstract: A hybrid cooling system is disclosed that combines a liquid coolant cycle and a refrigerant cycle to efficiently and effectively transfer heat away from a heat-generating component of a computing device. The liquid coolant cycle pumps a liquid coolant through a cold plate to extract heat from the heat-generating component. The heated liquid coolant passes through a coolant-to-refrigerant heat exchanger, where refrigerant from the refrigerant cycle absorbs the heat from the liquid coolant. The heated refrigerant passes through a compressor to a condenser, where the high-pressure, heated refrigerant is cooled by air passing over the condenser. The hybrid cooling system enables cooling of a heat-generating component better than by non-hybrid cooling systems.

Abstract: A liquid cooling system includes a liquid coolant conduit in proximity to heat-generating electrical components within an enclosed space. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating components. The heat-generating components includes at least one first heat-generating electrical component and at least one second heat-generating electrical component. The first heat-generating component produces greater heat than the second heat-generating component. The enclosed space includes an inlet and an outlet. The conduit includes a nozzle fluidly connected to the inlet. The nozzle is located within the enclosed space. The nozzle forms first and second aperture sets. The first aperture set directs the liquid coolant to the first heat-generating component. The second aperture set directs the liquid coolant to the second heat-generating component.

Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

Abstract: A boiling plate including a first surface and a second surface. The first surface provided for contacting a heated component. The second surface is opposite the first surface, and the second surface provided for contacting a liquid medium. The second surface has multiple cone-shaped cavities including a first cone-shaped cavity and a second cone-shaped cavity. A distance between an axis of the first cone-shape cavity and an axis of the second cone-shaped cavity of the multiple cone-shaped cavities are separated by a minimum spacing of four times a radius of the first cone-shaped cavity or the second cone-shaped cavity.

Abstract: A partition device for improving cooling of a heat-generating electronic device includes a grid panel and an airflow deflector. The grid panel has one or more apertures and a thickness that extends from a leading surface to a trailing surface. The apertures of the grid panel extend parallel to an airflow direction of forced air flowing across the thickness of the grid panel and through the apertures. The airflow deflector is attached at least in part within one of the apertures, and the airflow deflector has an airfoil shape for reducing air resistance between the forced air and the grid panel. The airfoil shape has a leading edge that redirects initial contact with the forced air and a trailing edge that continues redirecting the forced air.

Abstract: A system is disclosed. The system includes a housing having a top wall, a bottom wall, and two opposing side walls extending generally between and connecting the top wall to the bottom wall. The housing further has an airflow inlet and an airflow outlet opposing the airflow inlet. The system further includes a plurality of components within the housing. The plurality of components are arranged in rows with spaces between the rows. The system further includes a board coupled to the plurality of components on a first side and coupled to the bottom wall of the housing on a second side, opposing the first side. The board includes an aperture. The board and the bottom wall of the housing define a channel. The system further includes one or more of an injection ramp, a diversion ramp, and/or an airfoil for directing airflow within the housing.

Abstract: A cooling system is disclosed for a server rack holding one or more servers. The cooling system includes a cooling module configured to condition coolant to provide cooling within the server rack. The cooling system further includes at least one evaporator configured to couple to an upstream side of the server rack, relative to airflow through the server rack, and cool the airflow flowing into the server rack with the coolant. The cooling system further includes at least one condenser configured to couple to a downstream side of the server rack, relative to the airflow through the server rack, and cool the coolant after the coolant passes through the at least one evaporator.

Abstract: A computer chassis includes walls defining an airspace containing heat-generating components (e.g., storage drives). The airspace is divided into first and second regions, such as by a printed circuit board supporting the heat-generating components within the first region. An air input feeds both the first region and second region. Input air going through the first region first passes by a forward set of heat-generating components before continuing to a rearward set of heat-generating components to extract heat therefrom. Input air going through the second region bypasses the forward set of heat-generating components before being directed out through an air opening partway down the length of the chassis, after which this air passes by a rearward set of heat-generating components to extract heat.

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.

Abstract: An immersion liquid cooling tank assembly includes a tank, a condenser, at least one cross-flow fan, an internal wall system, a top cover, and at least one sloping wall. The tank includes a base and at least one sidewall. The base is connected to the sidewall. The condenser is located within the tank. The condenser is adapted to transform vapor into liquid. The cross-flow fan is near the condenser. The cross-flow fan produces an airflow. The internal wall system is located adjacent to the cross-flow fan to assist in directing the airflow from the cross-flow fan. The top cover is located generally opposite to the base. The sloping wall is located between the top cover and the sidewall. The sloping wall provides a closed airflow loop for the airflow produced by the cross-flow fan.