Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.

Abstract: An immersion liquid cooling tank assembly includes a tank, a condenser, at least one cross-flow fan, an internal wall system, a top cover, and at least one sloping wall. The tank includes a base and at least one sidewall. The base is connected to the sidewall. The condenser is located within the tank. The condenser is adapted to transform vapor into liquid. The cross-flow fan is near the condenser. The cross-flow fan produces an airflow. The internal wall system is located adjacent to the cross-flow fan to assist in directing the airflow from the cross-flow fan. The top cover is located generally opposite to the base. The sloping wall is located between the top cover and the sidewall. The sloping wall provides a closed airflow loop for the airflow produced by the cross-flow fan.

Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.

Abstract: A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.

Abstract: A connector assembly includes a first and a second component. Each of the components including a connector body, a valve, a handle, a handle lock, and a connector lock. The handles open and close respective valves. Each of the handles has locked and unlocked positions. The handle locks prevent or inhibit the respective handles from being moved between open and closed positions. The handle locks in unlocked positions enable the respective handles to be moved between open and closed positions. The first and second components are configured to be releasably assembled with each other. The connector locks in their respective closed positions assist in preventing or inhibiting the disassembling of the first and second components.

Abstract: A coolant distribution unit providing reliant circulation of coolant in a liquid cooling system for a heat-generating component such as a computer server is disclosed. The coolant distribution unit includes a manifold unit having a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold unit. The first pump circulates coolant from the inlet to the outlet. A second pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The second pump may be disconnected from the manifold unit, while the first pump continues to circulate coolant through the manifold unit.

Abstract: A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.

Abstract: A nucleate boiling apparatus is disclosed that includes a base configured to fit onto a heat-producing object to provide immersion cooling to the object in a liquid-cooled computing environment. The apparatus further includes first and second pluralities of pipes extending from opposite sides of the base. Each of the first and second pluralities of pipes including a respective transition region and a respective flat region. The first and second pluralities of pipes in the transition regions extend away and up from the base, and the first and second pluralities of pipes in the flat regions extend away from the base in a fanned-out arrangement. The flat region of the second plurality of pipes is at a greater distance from the base than the flat region of the first plurality of pipes.

Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.

Abstract: A liquid cooling system includes a liquid coolant conduit in proximity to heat-generating electrical components within an enclosed space. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating components. The heat-generating components includes at least one first heat-generating electrical component and at least one second heat-generating electrical component. The first heat-generating component produces greater heat than the second heat-generating component. The enclosed space includes an inlet and an outlet. The conduit includes a nozzle fluidly connected to the inlet. The nozzle is located within the enclosed space. The nozzle forms first and second aperture sets. The first aperture set directs the liquid coolant to the first heat-generating component. The second aperture set directs the liquid coolant to the second heat-generating component.

Abstract: An immersion liquid cooling tank assembly includes a generally elliptical tank, at least one condenser including a plurality of condenser tubes, at least one cooling fan adjacent to the condenser, a manifold system coupled to the at least one condenser to assist in distributing liquid flow to and from the plurality of condenser tubes, and a top cover disposed over the generally elliptical tank. The top cover includes an air baffle.

Abstract: A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.

Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.

Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.

Abstract: A coolant distribution unit providing reliant circulation of coolant in a liquid cooling system for a heat-generating component such as a computer server is disclosed. The coolant distribution unit includes a manifold unit having a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold unit. The first pump circulates coolant from the inlet to the outlet. A second pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The second pump may be disconnected from the manifold unit, while the first pump continues to circulate coolant through the manifold unit.

Abstract: An immersion liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, and at least one top cover. The tank includes a base and a plurality of side walls. The base and the plurality of sidewalls are connected. The condenser includes a plurality of condenser tubes. The manifold system is coupled to the condenser to assist in distributing liquid flow to and from the plurality of condenser tubes. The at least one top cover is located generally opposite to the base.

Abstract: Fan modules and motors are disclosed. The fan motor includes a bearing holder having a first bearing holder end and a second bearing holder end. The bearing holder has a first section with a first diameter that is smaller than diameters of the first bearing holder end and the second bearing holder end. The motor further includes a first bearing retained by the bearing holder at the first bearing holder end, and a second bearing retained by the bearing holder at the second bearing holder end. The motor further includes a shaft retained by the first bearing and the second bearing, and a stator surrounding the first section of the bearing holder.

Abstract: A system having a rack, an input manifold, an output manifold, and a drain manifold is installed. The rack is configured to support a computing device. The input manifold, the output manifold, and the drain manifold are each configured to be fluidly coupled to the housing. When the computing device is in a first position relative to the rack, the input manifold and the output manifold are fluidly coupled to the housing and the drain manifold is disconnected from the housing. When the computing device is in a second position relative to the rack, the input manifold and the output manifold are disconnected from the housing and the drain manifold is fluidly coupled to the housing. When the computing device is in a third position relative to the rack, the input manifold, the output manifold, and the drain manifold are disconnected from the housing.