Abstract: Disclosed are calibration techniques that can be implemented by a device that conducts biological tests. In certain embodiments, the device for testing a biological specimen includes a receiving mechanism to receive a carrier, a camera module arranged to capture imagery of the carrier, and a processor. Some examples of the processor can detect a calibration mode trigger. In calibration mode, the processor can divide the captured imagery into segments and selectively perform one or more calibration procedures for each segment. Then, the processor records a calibration result for each segment.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

Abstract: An electrophoretic display device includes a first component substrate, a second component substrate, a display medium layer, and an isolation structure. The first component substrate includes a first carrier and a plurality of pixel electrodes. The pixel electrodes are arranged in an array on the first carrier. The second component substrate includes a second carrier and at least one common electrode. The at least one common electrode is overlapped with the pixel electrodes. The display medium layer and the isolation structure are located between the first carrier and the second carrier. The display medium layer includes a plurality of charged particles. The isolation structure includes a barrier structure and an isolation electrode. The isolation electrode is formed on a bottom surface of the barrier structure and adjacent to the display medium layer.

Abstract: A hydrocarbon resin polymer is provided. The hydrocarbon resin polymer includes: 0.15-15 mol % of repeating units (A), which are derived from bridged ring monomer compounds; 15-90 mol % of repeating units (B), which are derived from monovinyl aromatic compounds; and 8-80 mol % of repeating units (C), which are derived from divinyl aromatic compounds.

Abstract: A light emitting diode (LED) driver circuit is configured to drive plural LEDs which are respectively coupled to m scan-lines and n data-lines, wherein m and n are both integers greater than or equal to one. During a driving stage, each of the LEDs is controlled to emit light according to the electrical characteristics on the corresponding scan-line and on the corresponding data-line where the LED is coupled to. The LED driver circuit includes: a power saving control circuit which includes a storage capacitor; a pre-discharging circuit configured to pre-discharge the charges on the m scan-lines to the storage capacitor during a pre-discharging stage; and a pre-charging circuit configured to pre-charge the n data-lines by the charges stored in the storage capacitor during a pre-charging stage.

Abstract: An electrophoretic display device includes a first component substrate, a second component substrate, a display medium layer, and an isolation structure. The first component substrate includes a first carrier and a plurality of pixel electrodes. The pixel electrodes are arranged in an array on the first carrier. The second component substrate includes a second carrier and at least one common electrode. The at least one common electrode is overlapped with the pixel electrodes. The display medium layer and the isolation structure are located between the first carrier and the second carrier. The display medium layer includes a plurality of charged particles. The isolation structure includes a barrier structure and an isolation electrode. The isolation electrode is formed on a bottom surface of the barrier structure and adjacent to the display medium layer.

Abstract: A lock core structure composed of a lock core seat, a lock core shell, a push plate, lock plates, washers, a positioning plate, a latch lever, a brake bolt plate pushed by a compression spring, a positioning baffle, and a retaining ring. An accommodating chamber of the seat is provided with an accommodating groove, a ring groove, a shaft hole and a groove, an inner bottom surface of the shell is provided with a slide groove for disposing the push plate, the brake bolt plate is provided in the accommodating groove, and provided with a pivot shaft disposed in the shaft hole, the positioning baffle is provided in the chamber and provided with a first baffle corresponding to an embedding groove of the seat, and a second baffle corresponding to the accommodating groove and the groove, and the retaining ring is embedded in the ring groove.

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.

Abstract: The present invention provides a structure composed of lock core and key, which lock pieces may only shift in parallel, so as to avoid the lock pieces from rotating and to prevent the key sockets on the lock pieces from misaligning with one another due to random rotation of the lock pieces, which ensures easy and smooth key insertion and operation.

Abstract: An integrated circuit self-repair method and an integrated circuit thereof are provided. The integrated circuit self-repair method includes: transmitting, by a main register, a predetermined logic state to at least three registers, and setting the at least three registers to the predetermined logic state; outputting, according to the predetermined logic state in the at least three registers, the predetermined logic state to drive a controlled circuit to perform a function; and when a minority of the at least three registers are changed to an opposite logic state due to an emergency occurring at an input power source, outputting the predetermined logic state according to the predetermined logic state of the remaining registers, and transmitting the predetermined logic state back to the register that is in the opposite logic state, to correct the opposite logic state to the predetermined logic state.

Abstract: An anti-theft structure composed of a lock core composed of a lock core seat, a lock core shell, a push plate provided in a slide groove of the lock core shell, lock plates and washers alternately superimposedly provided in the lock core shell, a limiting plate and a positioning plate disposed on the lock core shell and placed in the lock core seat together with the shell, a latch lever, a brake bolt plate provided in an accommodating groove of the lock core seat, a compression spring provided in a groove of the lock core seat and pushing against the brake bolt plate, a positioning baffle provided in an accommodating chamber of the lock core seat and located at a bottom of the lock core shell, and a retaining ring embedded in a ring groove of the lock core seat; and a key provided with a ring groove.

Abstract: An instrument identification method and an instrument identification system are provided. The instrument identification method includes detecting a number of a plurality of instruments, and determining whether or not the number of the plurality of instruments is equal to a predetermined number of instruments; detecting instrument image information of one of the plurality of instruments; and determining an instrument code, an instrument type, and appearance integrity of the one of the plurality of instruments according to the instrument image information of a part of each of the plurality of instruments.

Abstract: The electronic device with power-off partition includes a signal transmitting module, two repeater modules, and a working module. Each of the repeater modules includes a first power domain, a second power domain, and a transceiver circuit. A transmission path between the first power domain and the second power domain is maintained at a logic state when the second power domain is in power off mode. The transceiver circuit of one of the two repeater modules encodes a standby signal obtained from the signal transmitting module and transmits an encoded standby signal. The transceiver circuit of the other of the repeater modules decodes the encoded standby signal and transmits a decoded standby signal. The working module transmits, according to the decoded standby signal, a power-off signal to the transceiver circuits of the two repeater modules, so that the second power domains enter the power-off mode in response to the power-off signal.

Abstract: A bicycle lock has a horseshoe lock with a base; and a steel cable. The base has a lock seat, a shell disposes on the base, the shell has a cover to hood on the lock seat, a lock core disposes on the lock seat, a swivel seat assembles on the lock core, a torsion spring disposes between the lock core and the swivel seat, a lock column disposes in an accommodating groove of the shell, a stretch spring disposes in the accommodating groove and sleeves on the lock column and the shell, a butt member disposes in the accommodating groove, a first compression spring disposes in the accommodating groove and sleeves on the shell and in the butt member, a second compression spring disposes in an accommodating groove of the lock seat. The steel cable has a lock rod to insert into the shell and the lock seat.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Abstract: A folding lock comprises a folding plate assembly, a lock seat, a fixing sleeve, a lock core seat, a lock core, a connecting swivel, a lock column, and a fixing collar. A fixed folding plate of the assembly is provided with a connecting seat, the lock seat is disposed on the connecting seat and provided with an insertion hole, an inlay protrudes from the insertion hole, the fixing sleeve inserts into the connecting seat and disposes in the lock seat, the lock core disposes in the lock core seat, the connecting swivel is assembled on the lock core seat, a torsion spring disposes between the lock core seat and the connecting swivel, the lock column is assembled on the connecting swivel, a compression spring is sleeved on the connecting swivel and the lock column, and the fixing collar is disposed in the fixing sleeve.

Abstract: A display apparatus including a first substrate, a first electrode, a second substrate, a first microlens layer, a second microlens layer, a second electrode, a blocking wall structure, an electrophoresis medium, and multiple particles. The first electrode is disposed on the first substrate. The first microlens layer, having multiple first microlenses, is disposed on the second substrate. The second microlens layer, having multiple second microlenses, is disposed on the first microlens layer. The second electrode is disposed on the second microlens layer. The blocking wall structure is at least disposed between the first electrode and the second electrode and has an accommodating space corresponding to the first electrode. The electrophoresis medium is disposed in the accommodating space. The first microlens layer and the second microlens layer are disposed between the second substrate and at least a portion of the electrophoresis medium. The particles are mixed within the electrophoresis medium.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.