Abstract: A data transmitting method of a display device, which applies to a transmitting device and the display device. The transmitting device includes a first transmitting module. The display device includes a processing module, a second transmitting module, a storage module, and a display module. The data transmission method includes steps of: select a file on the transmitting device; compress the file to form a compressed file; send the compressed file to the display device via the first transmitting module; receive the compressed file by the second transmitting module of the display device; decompress the compressed file by the processing module to obtain the file; write the file into the storage module by the processing module and correspondingly displaying on the display module based on the file. In this way, a time for transmitting the file could be effectively reduced.

Abstract: One embodiment provides an offset calibration circuitry configured to compensate an offset voltage of a resistive bridge sensor. The offset calibration circuitry includes a first current digital to analog converter (IDAC) coupled to a first successive approximation register (SAR), a second IDAC coupled to a second SAR and an SAR controller circuitry. The first IDAC is configured to couple to a negative voltage port of a resistive bridge sensor. The first SAR is configured to store a circuitry first digital value. The second IDAC is configured to couple to a positive voltage port of the resistive bridge sensor. The second SAR is configured to store a second digital value. The SAR controller circuitry is configured to adjust each bit of the first SAR and each bit of the second SAR based, at least in part, on an output of a comparator. The comparator is configured to compare a voltage on the negative voltage port or a voltage on the positive voltage port to a common mode voltage.

Abstract: A lens positioning device including a lens carrier, a housing, three pairs of memory alloy wires and three displacement detecting units is provided. The three pairs of memory alloy wires are used to control the displacement of the lens carrier in three directions, respectively. Each of the displacement detecting units includes a magnetic element and a magnetic field sensing element. The magnetic field sensing element is arranged corresponding to the magnetic element to sense change of the magnetic field of the magnetic element along each of the three directions when the lens carrier moves. One magnetic element of any one of the three displacement detecting units is arranged at a position that can induce the corresponding magnetic field sensing element and does not interfere with the magnetic field sensing elements of the other two of the three displacement detecting units.

Abstract: A chain lock includes a top part pivotably connected to a bottom part. An engaging member is located in the bottom part. A lock cylinder, a rotary member and a rod are connected to each other. A torsion spring is biased between the lock cylinder and the rotary member. The torsion spring, the lock cylinder, the rotary member and the rod are located in a movable member to which a compression spring is mounted. Both of the movable member and the compression spring are received in the top part. A chain is secured in a first radial slot of the top part by the movable member, and the other end is inserted in the second radial slot of the bottom part. The chain lock is locked without using the key, and the key is required to unlock the chain lock.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Abstract: A wireless communication system and an apparatus and method for determining a network transmission mechanism are provided. The apparatus stores several transmission policies. Each transmission policy corresponds to a predetermined strength distribution and includes a first predetermined transmission mechanism and a second predetermined transmission mechanism. The apparatus determines a real strength distribution among several terminal apparatuses according to their signal strength, determines a selected policy based on the real strength distribution and the predetermined strength distributions, and determines a user transmission mechanism for each terminal apparatus. Each user transmission mechanism includes the first predetermined transmission mechanism and/or the second predetermined transmission mechanism of the selected policy. The network transmission mechanism includes the user transmission mechanisms.

Abstract: The electronic device with power-off partition includes a signal transmitting module, two repeater modules, and a working module. Each of the repeater modules includes a first power domain, a second power domain, and a transceiver circuit. A transmission path between the first power domain and the second power domain is maintained at a logic state when the second power domain is in power off mode. The transceiver circuit of one of the two repeater modules encodes a standby signal obtained from the signal transmitting module and transmits an encoded standby signal. The transceiver circuit of the other of the repeater modules decodes the encoded standby signal and transmits a decoded standby signal. The working module transmits, according to the decoded standby signal, a power-off signal to the transceiver circuits of the two repeater modules, so that the second power domains enter the power-off mode in response to the power-off signal.

Abstract: An instrument sterilization monitoring system and an instrument sterilization monitoring method are provided. The instrument sterilization monitoring system includes a server, a sterilization device, and a mobile device. An image capturing module of the mobile device is used to capture image information of a first sterilization device indication device in the sterilization device, image information of a first sterilization device indication label, image information of a second instrument indication device, and image information of a second instrument indication label which are disposed outside an instrument package. The image information is uploaded to the server. The server determines, according to the image information, whether or not the instrument package meets a sterilization standard.

Abstract: An integrated circuit self-repair method and an integrated circuit thereof are provided. The integrated circuit self-repair method includes: transmitting, by a main register, a predetermined logic state to at least three registers, and setting the at least three registers to the predetermined logic state; outputting, according to the predetermined logic state in the at least three registers, the predetermined logic state to drive a controlled circuit to perform a function; and when a minority of the at least three registers are changed to an opposite logic state due to an emergency occurring at an input power source, outputting the predetermined logic state according to the predetermined logic state of the remaining registers, and transmitting the predetermined logic state back to the register that is in the opposite logic state, to correct the opposite logic state to the predetermined logic state.

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.

Abstract: A chain lock includes a top part pivotably connected to a bottom part. An engaging member is located in the bottom part. A lock cylinder, a rotary member and a rod are connected to each other. A torsion spring is biased between the lock cylinder and the rotary member. The torsion spring, the lock cylinder, the rotary member and the rod are located in a movable member to which a compression spring is mounted. Both of the movable member and the compression spring are received in the top part. A chain is secured in a first radial slot of the top part by the movable member, and the other end is inserted in the second radial slot of the bottom prat. The chain lock is locked without using the key, and the key is required to unlock the chain lock.

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

Abstract: A semiconductor package structure includes a wiring structure, a semiconductor module, a protection layer and a plurality of outer conductive vias. The wiring structure includes at least one dielectric layer and at least one redistribution layer. The semiconductor module is electrically connected to the wiring structure. The semiconductor module has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The protection layer covers the lateral surface of the semiconductor module and a surface of the wiring structure. The outer conductive vias surround the lateral surface of the semiconductor module, electrically connect to the wiring structure, and extend through a dielectric layer of the wiring structure and the protection layer.

Abstract: A chain lock includes a main body, a rotatable part, a cylinder, a plug provided with a tailpiece, and a chain. The main body defines therethrough a first channel and a second channel. The rotatable part defines therethrough a third channel. The rotatable part is rotatably mounted to the main body. The cylinder is slidably fitted into the first channel of the main body and biased by a compression spring. The plug together with the tailpiece is rotatably mounted in the cylinder. The chain includes a series of rings, one ring of which is located in the second channel of the main body and inserted through by the cylinder. In use, a second ring of the chain can be located in the third channel of the rotatable part to be inserted by the cylinder, and the plug can be rotated by a key to have the cylinder fixed in place.

Abstract: A video processing method for a video processing circuit includes receiving a first video source corresponding to a first pixel rate and a second video source corresponding to a second pixel rate, wherein a processing data rate of a video processing path is greater than or equal to a sum of the first pixel rate and the second pixel rate. The method further includes using the processing data rate to sequentially perform an image processing to a first image of the first video source and a second image of the second video source corresponding to the same display time, to generate a first processed image and a second processed image.

Abstract: A key assembly includes a shank and a handle portion. The handle portion includes a free end and connection end from which the shank extends. The shank includes multiple grooves. A tubular portion is connected to connection end of the handle portion and a portion of the shank is accommodated in the tubular portion. The length from the distal end of the tubular portion to the distal end of the shank is the same as the depth from the key hole to the inner bottom of the lock cylinder. When the shank of the key assembly is inserted into the lock cylinder and reaches the inner bottom of the lock cylinder, the distal end of the tubular portion contacts the lock.

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.

Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.