Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.

Abstract: A semiconductor package structure includes a wiring structure, a semiconductor module, a protection layer and a plurality of outer conductive vias. The wiring structure includes at least one dielectric layer and at least one redistribution layer. The semiconductor module is electrically connected to the wiring structure. The semiconductor module has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The protection layer covers the lateral surface of the semiconductor module and a surface of the wiring structure. The outer conductive vias surround the lateral surface of the semiconductor module, electrically connect to the wiring structure, and extend through a dielectric layer of the wiring structure and the protection layer.

Abstract: A chain lock includes a main body, a rotatable part, a cylinder, a plug provided with a tailpiece, and a chain. The main body defines therethrough a first channel and a second channel. The rotatable part defines therethrough a third channel. The rotatable part is rotatably mounted to the main body. The cylinder is slidably fitted into the first channel of the main body and biased by a compression spring. The plug together with the tailpiece is rotatably mounted in the cylinder. The chain includes a series of rings, one ring of which is located in the second channel of the main body and inserted through by the cylinder. In use, a second ring of the chain can be located in the third channel of the rotatable part to be inserted by the cylinder, and the plug can be rotated by a key to have the cylinder fixed in place.

Abstract: A video processing method for a video processing circuit includes receiving a first video source corresponding to a first pixel rate and a second video source corresponding to a second pixel rate, wherein a processing data rate of a video processing path is greater than or equal to a sum of the first pixel rate and the second pixel rate, and using the processing data rate to sequentially perform an image processing to a first image of the first video source and a second image of the second video source corresponding to the same display time, to generate a first processed image and a second processed image.

Abstract: A power conversion apparatus and a short circuit protection circuit and method of capacitor thereof are provided. A rectifier circuit rectifies an AC signal into a DC signal. An electrical energy storage circuit is coupled to the rectifier circuit, and the electrical energy storage circuit includes a plurality of capacitors connected in series. A detection circuit is coupled to the electrical energy storage circuit to detect cross voltages of the capacitors. A control circuit is coupled to the rectifier circuit and the detection circuit. When the cross voltage of any of the plurality of capacitors is greater than a preset voltage, the rectifier circuit is disabled by the control circuit.

Abstract: An artificial intelligence-based leather inspection method and leather product production method includes the step of using sensor means to obtain a leather data of a leather raw material, then the step of inputting the leather data to an artificial intelligence module to determine a defective area and a non-defective area of the leather raw material, the step of establishing an area data after judgment of the defective area and the non-defective area and then using the area data to define the non-defective area into one or multiple reserved areas so that the leather raw material can be cut into leather components corresponding to the respective reserved areas.

Abstract: A lens module including a light path altering element, a first lens assembly, a first sensor and at least one group of electronically controlled deformation element is provided. An image beam incident to the optical path altering element is diverted from a first light transmission path to a second light transmission path. The first lens assembly is disposed between the light path altering element and the first sensor. The at least one group of electronically controlled deformation element is connected to the light path altering element, and deformation of the at least one group of electronically controlled deformation element makes the light path altering element to move.

Abstract: The present disclosure relates to a panel control system and an editing method thereof. The panel control system includes a display panel and a processing device connected to the display panel. The processing device includes a graphical user interface (GUI) program, including an interface element window which includes a plurality of interface elements, and an interface editing window connected to the interface element window. Each of the interface elements includes an element command window, an element parameter window, and an element attribute window. The element command window includes a plurality of original element commands. The plurality of the original element commands are dragged to the element parameter window to form a plurality of element parameter commands. The element attribute window includes a plurality of element attribute commands.

Abstract: The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.

Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.

Abstract: A lens module including a light path altering element, a first lens assembly, a first sensor and at least one group of electronically controlled deformation element is provided. An image beam incident to the optical path altering element is diverted from a first light transmission path to a second light transmission path. The first lens assembly is disposed between the light path altering element and the first sensor. The at least one group of electronically controlled deformation element is connected to the light path altering element, and deformation of the at least one group of electronically controlled deformation element makes the light path altering element to move.

Abstract: A semiconductor device package including a first encapsulation layer, a redistribution layer disposed on the first encapsulation layer, a first die disposed on the redistribution layer, a second encapsulation layer covering the first die and the redistribution layer, and an electrical connection terminal electrically connected to the redistribution layer. The first encapsulation layer has a first surface and a second surface different from the first surface. The first encapsulation layer surrounds a portion of the electrical connection terminal and exposes the electrical connection terminal.

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.

Abstract: A semiconductor device package including a first encapsulation layer, a redistribution layer disposed on the first encapsulation layer, a first die disposed on the redistribution layer, a second encapsulation layer covering the first die and the redistribution layer, and an electrical connection terminal electrically connected to the redistribution layer. The first encapsulation layer has a first surface and a second surface different from the first surface. The first encapsulation layer surrounds a portion of the electrical connection terminal and exposes the electrical connection terminal.

Abstract: A cascade refrigeration system includes first and second cooling devices. The first cooling device includes a first compressor, a condenser, an expansion device, an evaporator having first and second passages independent from and not communicating with each other, and a first conduit interconnecting the first compressor, the condenser, the expansion device and the first passage. The second cooling device includes a second compressor, a heat exchanger, and a second conduit interconnecting the second compressor, the second passage and the heat exchanger. A circulation switching device includes a switching mechanism connected to the first conduit downstream of the condenser and upstream of the expansion device.

Abstract: An evaporator includes a casing and a plurality of circulation units disposed on the casing. Each of the circulation units includes a flow path formed in the casing, an inlet formed in the casing for entry of one of refrigerants into the casing and fluidly communicating with the flow path, and an outlet formed in the casing spaced apart from the inlet for exit of the one of the refrigerants out the casing and fluidly communicating with the flow path. The circulation units are independent from each other and do not fluidly communicate with each other.

Abstract: A power control method including operating a plurality of subsystems of an electronic device according to a software application, measuring power consumption of the subsystems separately, obtaining one or more high power-consuming subsystems for the software application from the subsystems based on the power consumption of the subsystems, and providing a low-power mode with respect to the software application to operate the subsystems with one or more low-power methodologies corresponding to the one or more high power-consuming subsystems.

Abstract: A semiconductor device for ultra-high voltage (UHV) operation disclosed in the present invention includes a substrate having a normally-on channel, a negative capacitance material layer, an electrode, a source and a drain. The negative capacitance material layer is disposed over the substrate and capable of adjusting the threshold voltage of the semiconductor device so as to transform the normally-on channel into a normally-off channel and change the transistor characteristics of the semiconductor device from a depletion mode to an enhance mode. In addition, the semiconductor device also includes a gate dielectric layer made of high-k material between the negative capacitance material layer, a gate layer between the gate dielectric layer and the negative capacitance material layer and an ion implantation layer in the substrate under the gate. Furthermore, the aforementioned technical features or structures can be formed in a semiconductor device having a gate-recessed structure.

Abstract: A liquid crystal display (LCD) device includes: a data source, for generating a N-bit pixel data, N being a positive integer; a digital gamma correction unit, coupled to the data source, for performing digital gamma correction on the pixel data to generate a (N+M)-bit digital gamma correction pixel data, M being a positive integer; an image dithering unit, coupled to the digital gamma correction unit, for performing image dithering on the digital gamma correction pixel data to generate a (N+M?K)-bit dithering compensation pixel data, K being a positive integer; and a converter, coupled to the image dithering unit, for converting the dithering compensation pixel data into an output image. A bit number of the converter is lower than a bit number of the digital gamma correction unit.