Patents by Inventor Yu Ping

Yu Ping has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130141
    Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Ya-Huei Tsai, Rai-Min Huang, Yu-Ping Wang, Hung-Yueh Chen
  • Publication number: 20240128635
    Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.
    Type: Application
    Filed: December 24, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh
  • Publication number: 20240117342
    Abstract: An construction method of an embryonic chromosome signal library is provided. The construction method comprises obtaining an embryo and performing whole-genome amplification and next-generation sequencing to obtain a first chromosome signal; mapping the first chromosome signal to a chromosome reference signal to obtain a second chromosome signal; dividing the second chromosome signal within a predetermined interval range to obtain a third chromosome signal; and performing a regression correction on the sequencing read count (RC) of the third chromosome signal to obtain an embryonic chromosome signal library. Furthermore, a detection method and system of embryonic chromosomes are also provided. Thereby, the information comparison of the embryo chromosome signal library is used to determine whether the pre-implantation embryo is abnormal or not to achieve pre-implantation chromosome screening of pre-implantation embryos.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 11, 2024
    Inventors: LI-JEN SU, SHAO-PING WENG, YU-YU YEN, LI-CHING WU, HUI-YIN CHIU, JUI-HUNG KAO
  • Patent number: 11957064
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11956973
    Abstract: A method for fabricating a semiconductor device includes the steps of: forming a magnetic tunneling junction (MTJ) on a substrate; forming a first spin orbit torque (SOT) layer on the MTJ; forming a passivation layer around the MTJ; forming a second SOT layer on the first SOT layer and the passivation layer; and patterning the second SOT layer and the passivation layer.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hung-Chan Lin, Yu-Ping Wang
  • Publication number: 20240112323
    Abstract: A method for detecting defects on a wafer including the steps of obtaining a reference image of a chip pattern formed on a reference wafer, using a computer algorithm to analyze the reference image to produce a division map for the chip pattern; setting respective thresholds for divisions of the division map, obtaining a comparison data between a test image of the chip pattern formed on a test wafer and the reference image, using the division map and the thresholds to examine the comparison data to identify a defect in the test image.
    Type: Application
    Filed: November 17, 2022
    Publication date: April 4, 2024
    Applicant: United Semiconductor (Xiamen) Co., Ltd.
    Inventors: Yu Peng Hong, QINGRONG CHEN, Kai Ping Huang, Chin-Chun Huang, WEN YI TAN
  • Patent number: 11950513
    Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a first metal interconnection and a second metal interconnection in the first IMD layer; forming a channel layer on the first metal interconnection and the second metal interconnection; forming a magnetic tunneling junction (MTJ) stack on the channel layer; and removing the MTJ stack to form a MTJ.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: April 2, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Wei Chen, Po-Kai Hsu, Yu-Ping Wang, Hung-Yueh Chen
  • Publication number: 20240107895
    Abstract: A semiconductor device includes a substrate having an array region defined thereon, a ring of magnetic tunneling junction (MTJ) region surrounding the array region, a gap between the array region and the ring of MTJ region, and metal interconnect patterns overlapping part of the ring of MTJ region. Preferably, the array region includes a magnetic random access memory (MRAM) region and a logic region and the ring of MTJ region further includes a first MTJ region and a second MTJ region extending along a first direction and a third MTJ region and a fourth MTJ region extending along a second direction.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 28, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chung-Liang Chu, Jian-Cheng Chen, Yu-Ping Wang, Yu-Ruei Chen
  • Publication number: 20240104830
    Abstract: A computer-implemented method, system and computer program product for improving accuracy of a vision model. Images of an object with a first set of perspectives are received from a dataset used to train the vision model. A three-dimensional model of the object is then generated using the images of the object from the dataset. Using the three-dimensional model of the object, images of the object with a second set of perspectives are obtained. For example, the second set of perspectives may include different perspectives than the perspectives of the object from the images contained in the dataset. The dataset used to train the vision model may then be augmented with such images of the object with a second set of perspectives. In this manner, the dataset used to train the vision model includes a greater number of perspectives of the object thereby improving the accuracy of the vision model.
    Type: Application
    Filed: September 24, 2022
    Publication date: March 28, 2024
    Inventors: Kun Yan Yin, Xue Ping Liu, Yun Jing Zhao, Fei Wang, Yu Tao Wu, Yue Liu
  • Patent number: 11942390
    Abstract: A device includes a device layer comprising a first transistor; a first interconnect structure on a front-side of the device layer; and a second interconnect structure on a backside of the device layer. The second interconnect structure includes a first dielectric layer on the backside of the device layer; a contact extending through the first dielectric layer to a source/drain region of the first transistor; a conductive line electrically connected to the source/drain region of the first transistor through the contact; and a thermal dissipation path thermally connected to the device layer, the thermal dissipation path extending to a surface of the second interconnect structure opposite the device layer. The thermal dissipation path comprises a dummy via.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Sheh Huang, Yu-Hsiang Chen, Chii-Ping Chen
  • Patent number: 11944016
    Abstract: A magnetoresistive random access memory, including a substrate, a conductive plug in the substrate, wherein the conductive plug has a notched portion on one side of the upper edge of the conductive plug, and a magnetic memory cell with a bottom electrode electrically connecting with the conductive plug, a magnetic tunnel junction on the bottom electrode and a top electrode on the magnetic tunnel junction, wherein the bottom surface of the magnetic memory cell and the top surface of the conductive plug completely align and overlap each other.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: March 26, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hung-Chan Lin, Yu-Ping Wang, Hung-Yueh Chen
  • Publication number: 20240097888
    Abstract: In a file sharing system, a key manager unit realizes a correspondence between the first user identifier and the first public key in response to a registration request of the first user, generates a first key material for encrypting the first file into a first encrypted file, and generates a first credential according to the first user identifier, the first file identifier, the first public key and the first key material after receiving an access-right claim request to the first file from the first user. A file storage unit stores the first encrypted file and the first credential. The first user uses the first user identifier, the first file identifier and the first private key to retrieve the first key material out of the first credential, and uses the first key material to decrypt the first encrypted file into the first file.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 21, 2024
    Inventors: CHIA-JUNG LIANG, CHIHHUNG LIN, CHIH-PING HSIAO, YU-JIE SU, CHIA-HSIN CHENG, TUN-HOU WANG, MENG-CHAO TSAI, YUEH-CHIN LIN
  • Publication number: 20240085753
    Abstract: An electrochromic composition including: a first oxidizable compound; a reducible compound; an electrolyte; and a solvent, wherein the first oxidizable compound is represented by the following formula: wherein X1, and X2 are independently substituted or unsubstituted aliphatic hydrocarbon groups, or substituted or unsubstituted aromatic hydrocarbon groups, wherein the aromatic hydrocarbon groups include: wherein each Rx is independently hydrogen, a C1-C16 alkyl group, a C1-C16 alkoxy group, a C1-C16 haloalkyl group, or halogen.
    Type: Application
    Filed: February 24, 2023
    Publication date: March 14, 2024
    Inventors: Hao-Ping HUANG, Tsung-Hsien LIN, Yu-Nan LEE
  • Patent number: 11929319
    Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
  • Patent number: 11926017
    Abstract: A cleaning process monitoring system, comprising: a cleaning container comprising an inlet for receiving a cleaning solution and an outlet for draining a waste solution; a particle detector coupled to the outlet and configured to measure a plurality of particle parameters associated with the waste solution so as to provide a real-time monitoring of the cleaning process; a pump coupled to the cleaning container and configured to provide suction force to draw solution through the cleaning system; a controller coupled to the pump and the particle detector and configured to receive the plurality of particle parameters from the particle detector and to provide control to the cleaning system; and a host computer coupled to the controller and configured to provide at least one control parameter to the controller.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Charlie Wang, Yu-Ping Tseng, Y. J. Chen, Wai-Ming Yeung, Chien-Shen Chen, Danny Kuo, Yu-Hsuan Hsieh, Hsuan Lo
  • Publication number: 20240081157
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240069677
    Abstract: A floating image generation device is disclosed, which includes a light source, an image generation module, and a floating image generation unit. The image generation module is disposed above the light source and includes a shading unit and an image generation unit. The shading unit is capable of changing light transmissivity state. The image generation unit is disposed above the shading unit. The floating image generation unit is disposed above the image generation unit. The light source emits a light passing through the shading unit, the image generation unit, and the floating image generation unit to generate a first floating image when the shading unit is in a first light transmissivity state. The light source emits a light passing through the shading unit, the image generation unit, and the floating image generation unit to generate a second floating image when the shading unit is in a second light transmissivity state.
    Type: Application
    Filed: October 18, 2023
    Publication date: February 29, 2024
    Inventors: CHIH-PING HSU, RAN-SHIOU YOU, YU JEN LAI, YA HAN KO
  • Publication number: 20240074209
    Abstract: A semiconductor device includes a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, a MTJ on the MRAM region, a metal interconnection on the MTJ, and a blocking layer on the metal interconnection. Preferably, the blocking layer includes a stripe pattern according to a top view and the blocking layer could include metal or a dielectric layer.
    Type: Application
    Filed: November 2, 2023
    Publication date: February 29, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jia-Rong Wu, I-Fan Chang, Rai-Min Huang, Ya-Huei Tsai, Yu-Ping Wang
  • Publication number: 20240074328
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: D1017312
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: March 12, 2024
    Assignee: VERSUNI HOLDING B.V.
    Inventors: Rizki Tarisa, Nicolas Raymond Guy Hubert, Yu Ping Cheng