Abstract: An electric connector suited for an electronic device is provided. The electric connector includes a body, a plurality of terminals, and an electrical connecting member. The body is suited to be disposed in the electronic device and has at least one receiving area located on at least one of a top portion and a bottom portion of an exterior of the body. The terminals are disposed in the body, and an external electric connector is suited to be butted to the body along a first axis to be electrically connected to the terminals. One end of the electrical connecting member is located at the receiving area to be electrically connected to the terminals, and another end of the electrical connecting member extends out of the receiving area along a second axis to be electrically connected to the electronic device. The first axis is different from the second axis.

Abstract: The present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In some embodiments, a structure includes a first dielectric layer over a substrate, a first conductive feature through the first dielectric layer, the first conductive feature comprising a first metal, a second dielectric layer over the first dielectric layer, and a second conductive feature through the second dielectric layer having a lower convex surface extending into the first conductive feature, wherein the lower convex surface of the second conductive feature has a tip end extending laterally under a bottom boundary of the second dielectric layer.

Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.

Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.

Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.

Abstract: An apparatus includes a first source and a common drain and on opposite sides of a first gate surrounded by a first gate spacer, a second source and the common drain on opposite sides of a second gate surrounded by a second gate spacer, a first protection layer formed along a sidewall of the first gate spacer, wherein a top surface of the first protection layer has a first slope, a second protection layer formed along a sidewall of the second gate spacer, wherein a top surface of the second protection layer has a second slope, a lower drain contact between the first gate and the second gate and an upper drain contact over the lower drain contact and between the first gate and the second gate, wherein at least a portion of the upper drain contact is in contact with the first slope and the second slope.

Abstract: An electronic device is provided, including a first module and a second module. The first module includes a housing, a fixing member, a connector, and a flexible member. The housing has a first hole. The fixing member is fixed on the housing and has a second hole corresponding to the first hole. The connector extends through the first and second holes. The flexible member is disposed in the second hole and surrounds the connector. The second module includes a connecting base, wherein the connector is detachably connected to the connecting base.

Abstract: A method includes forming a first transistor and a second transistor over a substrate, wherein the first transistor and the second transistor share a drain/source region formed between a first gate of the first transistor and a second gate of the second transistor, forming a first opening in an interlayer dielectric layer and between the first gate and the second gate, depositing an etch stop layer in the first opening and on a top surface of the interlayer dielectric layer, depositing a dielectric layer over the etch stop layer, applying a first etching process to the dielectric layer until the etch stop layer is exposed, performing a second etching process on the etch stop layer until an exposed portion of the etch stop layer and portions of the dielectric layer have been removed.

Abstract: An electronic device includes a display and a docking station. The display includes a first connector, and the docking station has a second connector. The first connector includes a first tongue portion and pins at least including a pair of transmitting differential signal pins and ground pins. An orthogonal projection of at least one ground pin on an upper surface of the first tongue portion is located between the transmitting differential signal pins. The transmitting differential signal pins are used to transmit data adopting USB3.1, thunderbolt 2, or thunderbolt 3 transmission specification. The second connector includes a second tongue portion and through holes at least including a pair of transmitting differential signal through holes and ground through holes. The transmitting differential signal pins and the ground pins are connected to the transmitting differential signal through holes and the ground through holes respectively.

Abstract: A transfer module is adapted to be disposed in a base of an electronic device. The base includes a keyboard member and a motherboard including a connector. The transfer module includes a transfer connector and a flexible circuit board. The transfer connector is located between the keyboard member and the motherboard. The flexible circuit board is located between the transfer connector and the motherboard. The flexible circuit board has a first side and a second side opposite to each other, and the keyboard member has a connecting side. The first side of the flexible circuit board is electrically connected to the connector of the motherboard. The second side of the flexible circuit board and the connecting side of the keyboard member are interposed in the transfer connector. The keyboard member is electrically connected to the motherboard through the transfer connector and the flexible circuit board.

Abstract: A method includes forming a first transistor and a second transistor over a substrate, wherein the first transistor and the second transistor share a drain/source region formed between a first gate of the first transistor and a second gate of the second transistor, forming a first opening in an interlayer dielectric layer and between the first gate and the second gate, depositing an etch stop layer in the first opening and on a top surface of the interlayer dielectric layer, depositing a dielectric layer over the etch stop layer, applying a first etching process to the dielectric layer until the etch stop layer is exposed, performing a second etching process on the etch stop layer until an exposed portion of the etch stop layer and portions of the dielectric layer have been removed.

Abstract: An electronic device includes a display device and a base unit including a casing, a circuit board and a system connector. The system connector includes a system input terminal, a system positive terminal, a system negative terminal, system positive lines, system negative lines and a system detection line. The system input terminal is disposed corresponding to an opening of the casing, and the system positive terminal and the system negative terminal are electrically connected to the circuit board. The system positive lines are connected between the system input terminal and the system positive terminal, and the system negative lines and the system detection line are connected between the system input terminal and the system negative terminal. The system input terminal, the system positive terminal and the system negative terminal are non-overlapping in their orthographic projections on the casing.

Abstract: A transmission shaft set including a plurality of transmission shaft structures is disclosed. Each transmission shaft structure includes a metal pin connecting shaft and a base. The metal pin connecting shaft includes an arc part, a fastening block, a plurality of electrically connecting parts and a plurality of electrically connecting metal pins. The plurality of electrically connecting parts are located on the arc part. The plurality of electrically connecting metal pins are located in the fastening block and electrically connected to the plurality of electrically connecting parts. The base is fastened to the metal pin connecting shaft and includes a fastening groove, at least one fastening part and at least one column. The fastening groove is used for fastening the fastening block. The fastening part is located near the fastening groove. The column is located near the fastening groove and the fastening part.

Abstract: An electronic assembly including a first electronic device and a second electronic device is provided. The first electronic device has a first body and a first terminal set disposed in a recess of the first body. The second electronic device has a second body and a second terminal set disposed on the second body in a protruding manner. The first body and the second body are assembled together only by inserting and locking the second terminal set in the recess. Moreover, the first terminal set and the second terminal set are in contact with each other in the recess, such that the first and the second electronic devices are electrically connected to each other via the first terminal set and the second terminal set.

Abstract: An electronic assembly including a first body having at least one recess, a first electronic module disposed within the first body, at least one first terminal set disposed within the recess and electrically connected to the first electronic module, a second body having at least one protruding portion, a second electronic module disposed within the second body and at least one second terminal set disposed in the protruding portion, partially exposed by the surface of the protruding portion and electrically connected to the second electronic module. The first and the second bodies are assembled to each other by the protruding portion inserting into the recess, and the first terminal set contacts the second terminal set, such that the first and the second electronic modules are electrically connected to each other through the first and the second terminal sets.

Abstract: A DC power plug, which is adapted for being coupled to an electronic device, an external device, and an external power source, includes a wire, an external plug, and an adaptor. The wire includes a power pin set configured to be coupled to the external power source. The external plug, which is configured to be coupled to the external device, includes a first external pin set coupled to the power pin set and a second external pin set. The adaptor, which is configured to be coupled to the electronic device, includes a first adapting pin set coupled to the power pin set and a second adapting pin set coupled to the second external pin set.

Abstract: An electronic assembly including a first electronic device and a second electronic device is provided. The first electronic device has a first body and a first terminal set disposed in a recess of the first body. The second electronic device has a second body and a second terminal set disposed on the second body in a protruding manner. The first body and the second body are assembled together only by inserting and locking the second terminal set in the recess. Moreover, the first terminal set and the second terminal set are in contact with each other in the recess, such that the first and the second electronic devices are electrically connected to each other via the first terminal set and the second terminal set.

Abstract: An electronic assembly including a first body having at least one recess, a first electronic module disposed within the first body, at least one first terminal set disposed within the recess and electrically connected to the first electronic module, a second body having at least one protruding portion, a second electronic module disposed within the second body and at least one second terminal set disposed in the protruding portion, partially exposed by the surface of the protruding portion and electrically connected to the second electronic module. The first and the second bodies are assembled to each other by the protruding portion inserting into the recess, and the first terminal set contacts the second terminal set, such that the first and the second electronic modules are electrically connected to each other through the first and the second terminal sets.

Abstract: A transmission shaft set including a plurality of transmission shaft structures is disclosed. Each transmission shaft structure includes a metal pin connecting shaft and a base. The metal pin connecting shaft includes an arc part, a fastening block, a plurality of electrically connecting parts and a plurality of electrically connecting metal pins. The plurality of electrically connecting parts are located on the arc part. The plurality of electrically connecting metal pins are located in the fastening block and electrically connected to the plurality of electrically connecting parts. The base is fastened to the metal pin connecting shaft and includes a fastening groove, at least one fastening part and at least one column. The fastening groove is used for fastening the fastening block. The fastening part is located near the fastening groove. The column is located near the fastening groove and the fastening part.

Abstract: A connector used for connecting to substrates and including bases and a shaft is provided. The bases are disposed on the substrates individually and include terminals embedded the base. The shaft is pivoted to the bases and includes a first element, a second element stacking with the first element and conductive rings. The second element includes first and second conductive circuits. The first conductive circuits are connected to the second conductive circuit, and each first and each second conductive circuit has a first pad and a second pad on the second element. The conductive rings are sleeved to the shaft, and connected to the first pad and the second pad electrically and individually. When the shaft is rotatably assembled to the bases, the first pads and the second pads are contact with the terminals electrically via the conductive rings and the conductive rings are capable of contacting with the terminals.