Abstract: The embodiments of the present disclosure provide a crystal preparation device and a crystal preparation method. The crystal preparation device comprises a growth chamber configured to place a raw material; a heating component configured to heat the growth chamber; a pulling component configured for pulling growth; and a guide component in a transmission connection with the pulling component. The crystal preparation method comprises providing a raw material in the growth chamber; descending the pulling component bonded with a seed crystal to a vicinity of the raw material, the pulling component being in transmission connection with the guide component and at least a portion of the pulling component being located in the guide component; heating the growth chamber to form a raw material melt; and growing a crystal based on the seed crystal and the raw material melt through a transmission movement of the pulling component and the guide component.

Abstract: Described herein is a technique for establishing an overall company-level confidence score based on analyzing data from various data sources. The overall score is derived using a machine learned model that takes as input a set of sub-scores, with each sub-score representing a measure of how frequently a domain name occurs within the same data record as a company name. The model used to combine the several sub-scores is trained using training data that includes a variety of sub-scores for company and domain names that have already been verified to be associated with one another.

Abstract: A memory device is disclosed. The memory device may include a memory string and a peripheral circuit. The memory string may include a drain select gate (DSG) transistor, a plurality of memory cells, and a source select gate (SSG) transistor. The peripheral circuit may be coupled to the memory string and configured to, during a program operation on a select memory cell of the plurality of memory cells: after detecting an interrupt signal, perform a clean process that includes turning on at least one of the DSG transistor or the SSG transistor.

Abstract: A method for data processing include: when payment is triggered by an e-commerce application program, calling a first SDK to obtain a first host program list from a network-wide payment platform, where the first host program list includes host program identifiers of at least part of host programs supported by the network-wide payment platform; when a target host program is determined from the first host program list by calling the first SDK, calling the target host program; and calling, by means of the target host program, a second SDK to interact with the network-wide payment platform, so that the network-wide payment platform interacts with the host program platform to complete payment by a target card, the target card being a resource card bound to the target host program.

Abstract: This application provides a communication method and apparatus, to resolve a problem of a limited processing capability of a satellite and improve communication efficiency. The communication method and apparatus are applicable to a communication system. The method includes a first device obtaining first information and sending the first information to a first satellite. The first information is generated by a first protocol entity of the first device, and the first protocol entity of the first device corresponds to a first protocol entity of a second device. The first satellite is a satellite that is in a plurality of satellites and that provides a network service for the second device, and the plurality of satellites correspond to one logical cell.

Abstract: This application discloses a communication method and apparatus. The method includes: A first cell may send a first SSB, where the first SSB is an SSB used for initial access. The first cell may further send a second SSB, where the second SSB is an SSB used for cell handover or cell reselection. According to the method, the first cell may separately send the first SSB used for initial access and the second SSB used for cell handover or cell reselection. In this way, when a terminal device needs to access the first cell, the first cell may send the first SSB; or when the terminal device needs to hand over or reselect to the first cell, the first cell may send the second SSB, so that the SSB can be sent based on a requirement.

Abstract: A brake caliper housing includes a left shell having a left connecting surface, and a right shell having a right connecting surface. The left connecting surface has at least one positioning hole, and the right connecting surface protrudes with at least one positioning pin inserted into the at least one positioning hole, such that the left connecting surface is abutted against and aligned with the right connecting surface. The right connecting surface is fixedly connected with the left connecting surface by a friction stir welding. As a result, during the friction stir welding, the left and right shells can be precisely aligned and joined together.

Abstract: Disclosed is a method in which plural sets of data representing a plurality of separate observations of lane boundaries within the road section are obtained. An initial candidate group of sets of data is identified based on corresponding data points within the sets of data fitting into the same tile or in n-level neighbouring tiles of a spatial indexing system. A cluster of sets of data that relate to the same, first lane boundary is determined from the identified initial candidate group of sets of data by calculating respective distances between corresponding data points for different sets of data and comparing the calculated distances to a distance threshold. A geometry of the first lane boundary is determined using the cluster of sets of data that have been determined to relate to the same, first lane boundary.

Abstract: A temperature sampling assembly includes a sampling circuit board, a temperature sensing chip, and a heat conducting base. The sampling circuit board includes a sampling part. The temperature sensing chip is mounted at the sampling part and is electrically connected to the sampling circuit board. The heat conducting base includes a first side and a second side opposite each other in a thickness direction. The first side is fixedly adhered to the sampling part through a fixing adhesive. The second side is configured to be connected to a to-be-sampled component.

Abstract: A semiconductor device includes a first fin protruding upwardly from a substrate, a second fin protruding upwardly from the substrate, a first gate structure having a first portion that at least partially wraps around an upper portion of the first fin and a second portion that at least partially wraps around an upper portion of the second fin, a second gate structure having a portion that at least partially wraps around the upper portion of the first fin, and a dielectric feature having a first portion between the first and second portions of the first gate structure. In a lengthwise direction of the first fin, the dielectric feature has a second portion extending to a sidewall of the second gate structure.

Abstract: A memory device includes a plurality of planes. A method of programming the memory device includes applying a first program pulse to one or more memory cells of a first plane of the plurality of planes, verifying whether each one of the memory cells reaches a predetermined program state, and in response to a preset number of the memory cells in the first plane failing to reach the predetermined program state after the memory cells being verified for a predetermined number of times, bypassing the first plane when applying a second program pulse after the first program pulse.

Abstract: A memory device includes a memory array comprising a plurality of one-time-programmable (OTP) memory cells. Each of the plurality of OTP memory cells comprises a select transistor, a diode, and a conductor fuse. The diode and the conductor fuse are coupled in series, with the select transistor coupled to a common node between the diode and the conductor fuse.

Abstract: A computing device for supporting an Augmented-Reality (AR) software application is provided. The computing device is operative to select a physical location for placing a current virtual object, where the current virtual object appears to be placed when overlaid onto a video sequence capturing a physical scene in the surroundings of a user, based on an expected physical location which the user assumes in response to displaying the physical scene and the overlaid current virtual object to the user, and an attribute which is spatially dependent and which has an impact on a user experience of the AR software application. Taking the spatially-dependent attribute at the expected physical location of the user into consideration in selecting physical locations for placing virtual objects is advantageous in that virtual objects may be deployed at physical locations so as to provide an improved, or at least satisfactory, user experience to the users.

Abstract: A display substrate and a display device are disclosed. The display substrate includes a first via hole, a second via hole, a third via hole and a fourth via hole, the first anode is connected with a first pixel driving circuit through the first via hole, the second anode is connected with a second pixel driving circuit through the second via hole, the third anode is connected with a third pixel driving circuit through the third via hole, and the fourth anode is connected with a fourth pixel driving circuit through the fourth via hole, a plurality of third via holes corresponding to one light emitting element row are approximately located on a first straight line, and the fourth via hole closest to the first straight line is located at a side of the first straight line.

Abstract: A garden tool includes a main body, a handle assembly, a walking wheel assembly, a power box, and a control box. The handle assembly is connected with the main body and extends backward from one side of the main body for the user to push. The walking wheel assembly is arranged under the main body and is used to carry the main body and drive the main body to walk on a ground. The power box is arranged on the main body and is used to supply power for the garden tool. The control box is arranged on the main body, located beside the power box, and is used to control the garden tool to work. The control box and the power box are both arranged on an upper surface of the main body, and the control box is arranged close to the handle assembly.

Abstract: Embodiments of the present disclosure relate to an adaptive data management system and methods for telecommunications networks. The system includes a method for receiving data packets and intelligently assigning them to service flows based on content type and network conditions. Different compression protocols are applied to the data packets according to their service flow. The system features a dynamic control unit configured to monitor network conditions and adjust data packet handling in real-time. This includes decompressing and re-compressing data packets to suit the current network environment and user equipment capabilities.

Abstract: Systems and methods are provided for separation of a high purity hydrogen stream from methane pyrolysis effluents when using a plurality of adsorbent beds. The methods can allow for increased recovery of hydrogen from the methane pyrolysis effluent while maintaining a target purity for the hydrogen product stream of 98.0 vol % or more.

Abstract: An embodiment semiconductor package structure may include a first redistribution layer and a first semiconductor die attached to the first redistribution layer. The first semiconductor die may include first front-side electrical contacts and first back-side electrical contacts such that the first front-side electrical contacts are electrically connected to the first redistribution layer. The semiconductor package structure may further include a second redistribution layer formed over the first semiconductor die such that the second redistribution layer is electrically connected to the first back-side electrical contacts of the first semiconductor die and to a second semiconductor die attached to the second redistribution layer and positioned vertically over the first semiconductor die. The first semiconductor die may include at least two alignment marks separated by at least 50 microns.

Abstract: The present invention provides a communication system, an electronic device, and a near-field communication circuit in a differential mode, including a first substrate and a second substrate. The first substrate includes a near-field communication integrated chip and a filter connected to the near-field communication integrated chip; and the second substrate includes an impedance adjustment circuit connected to the filter via a coaxial line and a near-field communication antenna circuit connected to the impedance adjustment circuit. Thus, the near-field communication integrated chip on the first substrate can be shared and works with different antenna circuits and impedance adjustment circuits.

Abstract: Provided herein is a method, wherein the method comprises in response to a deployment event associated with a microservice, generating a descriptor corresponding to the microservice, wherein the descriptor comprises properties associated with the microservice, wherein the properties comprise configurations for the microservice, dependencies of the microservice with respect to one or more other microservices, and feature toggles associated with the microservice; generating a token to identify the microservice; generating a unit for the microservice, wherein the unit comprises the properties associated with the microservice and the token for the microservice; and storing, in a registry, the unit in a chronological sequence based on the dependencies of the microservice with respect to one or more other microservices.