Patents by Inventor Yu Wang

Yu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12216869
    Abstract: Provided are a display panel and a display device. An isolation dam is provided in a peripheral area of the display panel. The display panel includes: a display functional layer comprising a plurality of display signal traces; and a touch-control functional layer comprising a plurality of touch-control signal traces. On the binding side, there are a first boundary and a second boundary, and a first trace area located between the first boundary and the second boundary, the first boundary is closer to the display area than the second boundary. In the first trace area, the touch-control signal trace is arranged along a first direction and are led out from the binding circuit and connected to the touch-control pattern via the isolation dam and the first trace area in sequence, the display signal trace is arranged along a second direction and intersects with the touch signal trace.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: February 4, 2025
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yi Qu, Zhiwen Chu, Yang Zhou, Lu Bai, Junxiu Dai, Xinxin Wang, Yi Zhang, Shun Zhang, Xin Chen, Yu Wang, Ping Wen, Yuanqi Zhang, Wei Wang
  • Patent number: 12218184
    Abstract: A semiconductor structure includes a capacitor structure and a contact structure. The capacitor structure includes an electrode layer, a protective dielectric layer, and a capacitor dielectric layer. The protective dielectric layer covers a top surface of the electrode layer. The capacitor dielectric layer is on the protective oxide layer. The contact structure penetrates the protective oxide layer and electrically connects to the electrode layer.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jui-Lin Chu, Szu-Yu Wang, Ching I Li
  • Publication number: 20250033091
    Abstract: A brush wetting and cleaning system or tool including a brush wetting and cleaning housing. A wetting nozzle in fluid communication with a cavity in the brush wetting and cleaning housing. The wetting nozzle is configured to, in operation, wet a brush of a brush head inserted into the cavity of the brush wetting and cleaning housing. A spray nozzle in fluid communication with the cavity in the brush wetting and cleaning housing. The spray nozzle is configured to, in operation, clean the brush of the brush head inserted into the cavity of the brush wetting and cleaning housing. In a method of utilizing the brush wetting and cleaning system or tool, the brush of the brush head is wetted and cleaned between cleaning successive wafers or workpieces.
    Type: Application
    Filed: July 28, 2023
    Publication date: January 30, 2025
    Inventors: Shao-Yen KU, Ying-Chuan SU, Hao Yu WANG, Huan-Yung LIN
  • Publication number: 20250038148
    Abstract: A method includes forming a metal post over a first redistribution structure; attaching a first device die to the first redistribution structure, the first device die comprising a through via embedded in a semiconductor substrate; encapsulating the metal post and the first device die in an encapsulant, a first top surface of the encapsulant being level with a second top surface of the semiconductor substrate; recessing the second top surface to expose the through via; forming a dielectric isolation layer around the through via; forming a dielectric layer over the dielectric isolation layer; etching the dielectric layer to form a first opening and a second opening in the dielectric layer; forming a first metal via in the first opening and a second metal via in the second opening; and forming a second redistribution structure over the dielectric layer.
    Type: Application
    Filed: January 3, 2024
    Publication date: January 30, 2025
    Inventors: Wei-Chih Chen, Jhih-Yu Wang, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo
  • Publication number: 20250038073
    Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ke-Han SHEN, Chih-Yuan CHEN, Jiung WU, Hung-Yi Kuo, Chung-Ju LEE, Tung-He CHOU, Ji CUI, Kuo-Chung YEE, Chen-Hua YU, Cheng-Chieh HSIEH, Yu-Jen LIEN, Yian-Liang KUO, Shih-Hao TSENG, Jen Yu WANG, Tzu-Chieh Chou
  • Publication number: 20250033702
    Abstract: A trailer carriage includes two longitudinal beams and at least two cross beams between the two longitudinal beams. The longitudinal beam includes a side wall, an upper connecting wall and a lower connecting wall. The cross beam includes an upper connecting plate, a lower connecting plate below the upper connecting plate, and an end plate between the upper connecting plate and the lower connecting plate. The upper connecting plate abuts against a bottom of the upper connecting wall, the lower connecting plate abuts against a top of the lower connecting wall, the end plate abuts against an inner side of the side wall. The upper connecting plate is connected with the upper connecting wall via a first huck bolt, the lower connecting plate is connected with the lower connecting wall via a second huck bolt, the end plate is connected with the side wall via a third huck bolt.
    Type: Application
    Filed: August 4, 2022
    Publication date: January 30, 2025
    Inventors: Zhiqiang Wu, Yu Wang, Heng Zhang
  • Publication number: 20250033703
    Abstract: A locking mechanism of a trailer carriage includes a transmission shaft, two bolts, an airbag, and a swing arm. The transmission shaft is pivoted to the carriage and extends in a length direction of the carriage; the two bolts are movably connected to two sides of the carriage in a penetrating manner, the bolt is movable in a width direction of the carriage between a first position where the bolt is accommodated in the carriage and a second position where the bolt protrudes from a side edge of the carriage; and one end of the swing arm is connected to the transmission shaft and a connecting seat is formed at the other end of the swing arm, and one end of the airbag is connected to the carriage and the other end of the airbag is connected to the connecting seat.
    Type: Application
    Filed: August 4, 2022
    Publication date: January 30, 2025
    Inventors: Zhiqiang Wu, Yu Wang, Heng Zhang
  • Patent number: 12211900
    Abstract: A device includes a first semiconductor strip protruding from a substrate, a second semiconductor strip protruding from the substrate, an isolation material surrounding the first semiconductor strip and the second semiconductor strip, a nanosheet structure over the first semiconductor strip, wherein the nanosheet structure is separated from the first semiconductor strip by a first gate structure including a gate electrode material, wherein the first gate structure partially surrounds the nanosheet structure, and a first semiconductor channel region and a semiconductor second channel region over the second semiconductor strip, wherein the first semiconductor channel region is separated from the second semiconductor channel region by a second gate structure including the gate electrode material, wherein the second gate structure extends on a top surface of the second semiconductor strip.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: January 28, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pei-Yu Wang, Pei-Hsun Wang
  • Patent number: 12209993
    Abstract: Disclosed is a full-length vibration excitable component device for measuring the strength of a rock and a cementitious material. The device comprises a steel rod member (1), a vehicle body (2), a vibration motor (3), a frequency measurement element (4), and an integrated lead harness (5); wherein, the steel rod member (1) has a through slot (6) in its interior, the vehicle body (2) is placed in the through slot (6), and the top of the vehicle body (2) is provided with a first mounting slot and a second mounting slot.
    Type: Grant
    Filed: March 5, 2022
    Date of Patent: January 28, 2025
    Assignee: YUNLONG LAKE LABORATORY OF DEEP UNDERGROUND SCIENCE AND ENGINEERING
    Inventors: Lei Song, Hao Shi, Houquan Zhang, Yu Wang, Guozhu Wang, Huayun Zhao, Chuanxin Rong, Wei Long
  • Patent number: 12210729
    Abstract: Aspects of the present disclosure involve a system for filtering conversations. The system generates for display, by a messaging application, a plurality of shortcut options, each of the plurality of shortcut options comprising a respective filtering criterion. In response to receiving input that selects a given shortcut option of the plurality of shortcut options, the system retrieves the filtering criterion associated with the given shortcut option. The system searches a plurality of conversations to identify a subset of conversations that match the filtering criterion. The system generates for display together with the plurality of shortcut options, a plurality of representations of the identified subset of conversations in which one or more messages have been exchanged between a user and one or more friends of the user.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: January 28, 2025
    Assignee: Snap Inc.
    Inventors: Nathan Kenneth Boyd, Daniel Moreno, David Phillip Taitz, Jeremy Baker Voss, Yu Wang
  • Patent number: 12211802
    Abstract: A package structure includes a plurality of semiconductor die, an insulating encapsulant and a redistribution layer. Each of the plurality of semiconductor dies includes a semiconductor substrate, conductive pads disposed on the semiconductor substrate, conductive posts disposed on the conductive pads, and at least one alignment mark located on the semiconductor substrate. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant and electrically connected to the plurality of semiconductor dies.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu
  • Patent number: 12213012
    Abstract: Embodiments of this application disclose cell handover measurement indication methods, a network device, and a terminal, to improve reliability and real-time performance of cell handover. A cell handover measurement indication method includes: A network device calculates a measurement moment of cell handover based on a measurement event and sends a measurement indication. The measurement event is a location relationship between a terminal and the network device, and the measurement indication is used to indicate the terminal to perform cell handover measurement. The measurement indication sent by the network device may be used to notify the measurement moment of cell handover to the terminal.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: January 28, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yu Wang, Hejia Luo, Xian Meng, Yunfei Qiao
  • Patent number: 12210055
    Abstract: In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: January 28, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Harry-Hak-Lay Chuang, Chih-Yang Chang, Ching-Huang Wang, Tien-Wei Chiang, Meng-Chun Shih, Chia Yu Wang
  • Patent number: 12213363
    Abstract: A display panel includes pixel-driving circuits distributed in an array along a first direction and a second direction and including a driving transistor and a capacitor with a first electrode connected to a gate of the driving transistor and a second electrode connected to a power line; a substrate base; a second conductive layer and a fifth conductive layer which is located on a side of the second conductive layer away from the substrate base and includes the power lines connected to at least one conductive wire. The second conductive layer, located on a side of the substrate base, includes second conductive portions corresponding to the pixel-driving circuits and forming the second electrode of a corresponding capacitor, and at least two adjacent second conductive portions form the conductive wire; orthographic projections of the power lines are spaced along the first direction and extend along the second direction.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: January 28, 2025
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Binyan Wang, Yao Huang, Cong Liu, Yu Wang, Benlian Wang
  • Patent number: 12211406
    Abstract: A display panel is provided. The display panel includes display elements in a display area; a touch electrode layer at least partially in the display area, wherein the display elements and the touch electrode layer are absent in a window region that is at least partially surrounded by the display area and a crack detection circuit. The crack detection circuit includes an integrated circuit; and a first conduction loop electrically connected to the integrated circuit. The first conduction loop includes a window region crack detection line substantially surrounding the window region; and at least a portion of the first conduction loop includes a first metal line in a first layer and a second metal line in a second layer, the first metal line connected to the second metal line through a via extending through a touch insulating layer.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: January 28, 2025
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Shun Zhang, Yuanqi Zhang, Ping Wen, Fan He, Yi Zhang, Yu Wang, Yang Zeng
  • Publication number: 20250029008
    Abstract: Disclosed are systems and methods for generating realistic defective data samples. An example system for generating realistic defective data samples includes a scenario generator unit configured to generate defect scenario data. The example system includes a prompt generator unit configured to generate prompts based on the defect scenario data. The example system includes a simulator unit configured to generate simulation data based on the defect scenario data and digital twins data. The example system includes a digital twins data bank unit configured to store digital representations of real-world entities and a generative machine learning unit configured to generate a realistic defective data sample based on the simulation data and the prompts.
    Type: Application
    Filed: July 19, 2024
    Publication date: January 23, 2025
    Inventors: Mohammad Javad Shafiee, Alexander Sheung Lai Wong, Francis Li, Saad Rasheed Abbasi, Seyed Mahmoud Famouri, Xiao Yu Wang
  • Publication number: 20250029357
    Abstract: In various examples, contrast values corresponding to pixels of one or more images generated using one or more sensors of a vehicle may be computed to detect and identify objects that trigger glare mitigating operations. Pixel luminance values are determined and used to compute a contrast value based on comparing the pixel luminance values to a reference luminance value that is based on a set of the pixels and the corresponding luminance values. A contrast threshold may be applied to the computed contrast values to identify glare in the image data to trigger glare mitigating operations so that the vehicle may modify the configuration of one or more illumination sources so as to reduce glare experienced by occupants and/or sensors of the vehicle.
    Type: Application
    Filed: September 30, 2024
    Publication date: January 23, 2025
    Inventors: Igor Tryndin, Abhishek Bajpayee, Yu Wang, Hae-Jong Seo
  • Publication number: 20250030970
    Abstract: A wireless earphone assembly including a charging box and a wireless earphone is disclosed. The charging box includes a first casing and a second casing slidingly connected to the first casing, where the first casing has a first recess, a cavity connected to the first recess, and sound emitting holes connected to the first recess, and the cavity is sleeved on the second casing. The second casing has sound receiving holes opposite to the sound emitting holes and a channel disposed corresponding to the first recess, and the sound receiving holes are connected to the channel. The wireless earphone includes a sound emitting part and a sound receiving part opposite to the sound emitting part, and the sound emitting part is accommodated in the first recess.
    Type: Application
    Filed: September 7, 2023
    Publication date: January 23, 2025
    Applicant: Acer Incorporated
    Inventors: Dong-Yu Wang, Chun-Hung Wen
  • Publication number: 20250027100
    Abstract: Provided is use of MfERF026 regulation in growth, development, and stress tolerance of Medicago sativa, which belongs to the technical field of plant genetic engineering. Provided is use of a regulatory agent for MfERF026, which is an ethylene responsive factor (ERF) in Medicago falcata, in promoting growth and development and improving drought tolerance and cold tolerance of M. sativa. The inhibited expression of MfERF026, the ERF in M. falcata may enhance the drought tolerance and cold tolerance of the M. sativa. Moreover, the inhibited expression of MfERF026, the ERF in M. falcata, may regulate the growth and development of M. sativa, thereby accelerating the growth rate of M. sativa to increase the number of leaves. The inhibited expression of MfERF026 provides a novel theoretical basis and a candidate gene for cultivating novel leguminous forage varieties with high resistance, yield, and protein content.
    Type: Application
    Filed: April 30, 2024
    Publication date: January 23, 2025
    Inventors: Yiding NIU, Jiabin FU, Jinfeng HAO, Yu WANG
  • Patent number: D1059315
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: January 28, 2025
    Assignee: GaNrich Semiconductor Corporation
    Inventors: Jia-Tay Kuo, Chen-Yu Wang, Sheng-Bo Wang, Chiao Fu, Yao-Zhong Liu