Abstract: In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail. The ground plane is between the first trace rail and a die area, and the first perpendicular trace extends perpendicularly from the first trace rail. The first trace rail and the first perpendicular trace are components of a second power loop.

Abstract: A semiconductor device with a cavity structure comprises: a carrier substrate; a first die having an active surface and the pads thereon; a back surface of the first die is disposed on the carrier substrate; a second die having a top surface and a back surface and a cavity structure therein; the top surface of a second die is flipped to dispose on the first die, and the cavity structure is an inverse U-type to dispose between the active surface of the first die and the top surface of the second die; the wires is electrically connected the pads with the first connecting points; a package body encapsulated the first die, the second die, the wires, and the portion of the top surface of the carrier substrate; and the connecting components is disposed on the back surface of the carrier substrate and is electrically connected the second connecting points.

Abstract: A semiconductor device with a cavity structure comprises: a carrier substrate; a first die having an active surface and the pads thereon; a back surface of the first die is disposed on the carrier substrate; a second die having a top surface and a back surface and a cavity structure therein; the top surface of a second die is flipped to dispose on the first die, and the cavity structure is an inverse U-type to dispose between the active surface of the first die and the top surface of the second die; the wires is electrically connected the pads with the first connecting points; a package body encapsulated the first die, the second die, the wires, and the portion of the top surface of the carrier substrate; and the connecting components is disposed on the back surface of the carrier substrate and is electrically connected the second connecting points.

Abstract: A programmable metallization device, comprises a first electrode; a memory layer electrically coupled to the first electrode and adapted for electrolytic formation and destruction of a conducting bridge therethrough; an ion-supplying layer containing a source of ions of a first metal element capable of diffusion into and out of the memory layer; a conductive ion buffer layer between the ion-supplying layer and the memory layer, and which allows diffusion therethrough of said ions; and a second electrode electrically coupled to the ion-supplying layer. Circuitry is coupled to the device to apply bias voltages to the first and second electrodes to induce creation and destruction of conducting bridges including the first metal element in the memory layer. The ion buffer layer can improve retention of the conducting bridge by reducing the likelihood that the first metallic element will be absorbed into the ion supplying layer.

Abstract: A method for packaging semiconductor device is provided, which comprises: providing a carrier substrate having a top surface and a back surface, a circuit arrangement on the top surface of the carrier substrate, and a through hole is disposed near the center of the carrier substrate and is formed passed through the carrier substrate; providing a chip having an active surface and a back surface, a plurality of pads is disposed on the periphery of the active surface and a plurality of connecting elements is disposed thereon; the active surface of chip is flipped and bonded on the circuit arrangement on the top surface of the carrier substrate, and the plurality of connecting elements is not covering the through hole; filling the underfilling material to encapsulate between the plurality of connecting elements and the top surface of the carrier substrate and to fill with the through hole; and performing a suction process to remove the air within the underfilling material between the plurality of connecting eleme

Abstract: The present invention provides a semiconductor package structure, which includes a substrate having a top surface and a back surface, a plurality of first connecting points on the top surface and a plurality of second connecting points on the back surface; a chip having an active surface and back surface, a plurality of pads on the active surface, and the chip is attached on the top surface of the substrate; a plurality of wires is electrically connected the plurality of pads on the active surface of the chip with the plurality of first connecting points on the top surface of substrate; a first encapsulant is filled to cover portion of the plurality of wires, the chip, and the portion of top surface of the substrate; a second encapsulate is filled to cover the first encapsulant, the plurality of wires and is formed on portion of the top surface of the substrate, in which the Yang's module of the second encapsulant is different with that of the first encapsulant; and a plurality of connecting components is dis

Abstract: A tactile display writer unit includes a probe having a contact tip, and at least a first actuator and a second actuator coupled to the probe, whereby activation of the actuators results in a displacement of the probe tip in one or more of a z-direction and in a lateral direction having a vector in an x-y plane. Also, a display writer includes a plurality of such units supported in an x-y array. The writer units may have a third actuator coupled to the probe. Also, a tactile vision system includes such a display writer, an image processor, and an image sensor. The processor transforms RGB image information from the image sensor into hue-based information having two or more attributes; and the actuators in the tactile display writer are activated by the information attributes.

Abstract: A seawater desalination device includes a seawater reservoir having a bottom wall and adapted for holding seawater, an evaporator adapted for evaporating the seawater held in the seawater reservoir into water vapor, osmosis membrane modules installed in the seawater reservoir and spaced above the bottom wall of the seawater reservoir, each osmosis membrane having membranes for the passing of the water vapor evaporated by the evaporator and a water vapor accumulation chamber surrounded by the membranes and a suction pipe connected to the water vapor accumulation chamber, and a pump unit having a pipe connected to the suction pipe of each osmosis membrane module and adapted for drawing water vapor out of the water vapor accumulation chamber of each osmosis membrane module.

Abstract: In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail. The ground plane is between the first trace rail and a die area, and the first perpendicular trace extends perpendicularly from the first trace rail. The first trace rail and the first perpendicular trace are components of a second power loop.

Abstract: Disclosed are methods of identifying microRNA motifs or microRNA precursors for a target gene or a set of target genes. Also disclosed are related computer-readable media.

Abstract: Disclosed are methods of identifying microRNA motifs or microRNA precursors for a target gene or a set of target genes. Also disclosed are related computer-readable media.

Abstract: A light-emitting diode (LED) lamp and a polygonal heat-dissipation structure thereof are provided. The LED lamp includes a polygonal heat-dissipation unit and a lighting module. The polygonal heat-dissipation unit has a polygonal hollow column and fins. The fins and the lighting module are thermally disposed on an inner surface and an outer surface of the polygonal hollow column, respectively. Thus, heat generated by the lighting module is dissipated by the fins rapidly. As the fins are thermally disposed on the inner surface of the polygon hollow column instead of being exposed, the volume of the LED lamp can be minimized, and the look of the LED lamp also can be prettified.

Abstract: A multi-chip package including a carrier, at least one first chip, and a second chip is provided. The first chip is electrically connected to the carrier and disposed on the carrier. The second chip is electrically connected to the first chip and the carrier. A part of the second chip is disposed on the first chip and another part of the second chip is disposed on the carrier. A method of fabricating the multi-chip package is also provided.

Abstract: Disclosed are methods of identifying microRNA motifs or microRNA precursors for a target gene or a set of target genes. Also disclosed are related computer-readable media.

Abstract: Disclosed are methods of identifying microRNA motifs or microRNA precursors for a target gene or a set of target genes.

Abstract: An optical device for demultiplexing an optical signal comprises a grating that receives an optical signal comprising a plurality of wavelength channels, and generates a plurality of spatially separated light beams. Each light beam is associated with a particular wavelength channel. The optical device further comprises an optical element that at least partially compensates a temperature based frequency shift associated with the spatially separated light beams. The optical device further comprises a plurality of lenses and a plurality of fibers. The plurality of lenses are arranged such that a spacing between at least a pair of lenses is determined to at least partially compensate a non-linearity introduced by the grating. Each fiber is associated with a corresponding lens and receives a corresponding light beam. At least one fiber is placed a distance that is less than a focal length associated with its corresponding lens.

Abstract: A wavelength division multiplexing/demultiplexing device is presented utilizing a polarization-based filter to separate odd and even wavelengths, or upper and lower channels of an input optical signal. The wavelength filter first converts the input signal to a predetermined polarization. A series of birefringent waveplates provide a polarization-dependent optical transmission function such that the polarized beam is decomposed into a first beam component carrying the first spectral band at a first polarization and a second beam component carrying the second spectral band at a second, orthogonal polarization. A beam displacer spatially separates the beam components into a pair of orthogonally-polarized beams. A quarter-wave plate converts these orthogonally-polarized beams into a pair of circularly-polarized beams, which are reflected by a mirror back along parallel optical paths through the quarter-wave plate, beam displacer, and waveplates.

Abstract: An optical device for demultiplexing an optical signal comprises a grating that receives an optical signal comprising a plurality of wavelength channels, and generates a plurality of spatially separated light beams. Each light beam is associated with a particular wavelength channel. The optical device further comprises an optical element that at least partially compensates a temperature based frequency shift associated with the spatially separated light beams. The optical device further comprises a plurality of lenses and a plurality of fibers. The plurality of lenses are arranged such that a spacing between at least a pair of lenses is determined to at least partially compensate a non-linearity introduced by the grating. Each fiber is associated with a corresponding lens and receives a corresponding light beam. At least one fiber is placed a distance that is less than a focal length associated with its corresponding lens.

Abstract: A wavelength division multiplexing/demultiplexing device is presented utilizing a polarization-based filter to separate odd and even wavelengths, or upper and lower channels of an input optical signal. The wavelength filter first converts the input signal to a predetermined polarization. A series of birefringent waveplates provide a polarization-dependent optical transmission function such that the polarized beam is decomposed into a first beam component carrying the first spectral band at a first polarization and a second beam component carrying the second spectral band at a second, orthogonal polarization. A beam displacer spatially separates the beam components into a pair of orthogonally-polarized beams. A quarter-wave plate converts these orthogonally-polarized beams into a pair of circularly-polarized beams, which are reflected by a mirror back along parallel optical paths through the quarter-wave plate, beam displacer, and waveplates.

Abstract: The present invention is related to a method for manufacturing lead frames and a lead frame material including an intermediate layer and a top layer. The intermediate layer is composed of a layer of nickel-cobalt alloy having 5 to 30 wt. % of cobalt and a thickness of 3 to 20 microinches and a layer of nickel or nickel alloy having a thickness of 10 to 80 microinches. The intermediate layer can inhibit the diffusion of the base metal to the surface of the leads. The top layer consisting of gold or gold alloy, which is composed of gold and at least one metal selected from the group consisting of palladium, silver, tin and copper and has at least 60 weight percent gold, has a thickness of 0.1 to 5 microinches.