Patents by Inventor Yu Yuan
Yu Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250146525Abstract: A folding joint for frames and worktables composed of a control portion and a joint portion is provided. The control portion includes a base provided with a moveable slot and a shaft inserted through the moveable slot. Two ends of the shaft are connected with a moveable seat and a hook correspondingly. The hook is for control of a lock cylinder of the joint portion. The lock cylinder is mounted in an outer tube, inserted through an upper rotary arm, and mounted in a lower rotary arm to be locked. The upper and lower rotary arms are pivotally joined. Thus the hook is driven to make the lock cylinder release from the lower rotary arm and unlock when the moveable seat of the control portion is pulled and moved. Thereby the joint portion is moved freely and folded. The folding joint is convenient to operate and easy to control.Type: ApplicationFiled: November 2, 2023Publication date: May 8, 2025Inventor: YU-YUAN LIN
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Publication number: 20250105509Abstract: An antenna system includes: a first group of MIMO antennas including a first dual-band antenna arranged at first corner of the base, a second dual-band antenna arranged on a first side of the base, a first single band antenna arranged at a second corner of the base, a second single band antenna parallel to the base; a second group of MIMO antennas including a third single band antenna vertically arranged in a third corner of the base, a fourth single band antenna arranged at a fourth corner of the base, a fifth single band antenna in planar structure, a sixth single band antenna arranged between the first single band antenna and the third single band antenna; a first isolation component arranged between the second dual-band antenna and the fifth single band antenna; a second isolation component arranged between the second single band antenna and the sixth single band antenna.Type: ApplicationFiled: April 19, 2024Publication date: March 27, 2025Inventors: YU-YUAN GUO, CHUN-CHIEH CHANG
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Publication number: 20250087899Abstract: An antenna system, installed on a base, includes: a first group of MIMO antennas, including multiple first MIMO antennas, and each first MIMO antenna is provide with a grounding structure and a fence like structure perpendicular to the base; a second group of MIMO antennas, comprising multiple second MIMO antennas, and each second MIMO antenna is a planar structure, arranged on a substrate, and the substrate is fixed to the base through a support column and the substrate is parallel to the base; a third group of MIMO antennas, comprising multiple third MIMO antennas, and each third MIMO antenna includes a dielectric structure and a wire structure perpendicular to the base, and the wire structure excites the dielectric structure; an AUX antenna, provided with a T-shaped slot parallel to the base.Type: ApplicationFiled: April 25, 2024Publication date: March 13, 2025Inventors: JIN Hao, Yu-Yuan Guo, Kai-Hao Chen, Liang-Hsien Hung
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Publication number: 20250071949Abstract: An electrical connector assembly includes an electrical connector having a card slot and plural terminals extending into the card slot; and a heat dissipation module having a fixing plate at one end thereof, the fixing plate having a notch; wherein the electrical connector has a supporting surface for supporting the fixing plate and a fixing member for mating with the notch, the fixing member includes a spherical or hemispherical head portion for guiding the fixing plate at multiple angles.Type: ApplicationFiled: August 19, 2024Publication date: February 27, 2025Inventors: MING-XIANG CHEN, KUO-CHUN HSU, WEN-NAN HSU, YU-YUAN SHEN, TSANG-HO YANG
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Patent number: 12134667Abstract: This invention relates to a a one-step process for making a polymer composite suspension for coating plastic films characterized in that a first polymer is synthesized in-situ optionally in the presence of other polymers and in the presence of clay. Preferably the polymer composite suspension comprises a) 1.0 to 11.0 wt % of clay or silane modified clay, b) 0.1 to 10.0 wt % of poly (acrylic acid), which is a copolymer of acrylic acid (AA) with at least one other monomer selected from 2-ethylhexyl acrylate (EHA), ?-carboxyethyl acrylate (?-CEA), methacrylamidoethyl ethylene urea (WAM II) and ethoxylated behenyl methacrylate (?-EM), c) 1.0 to 15.0 wt % of other polymers, preferably poly (vinyl alcohol) and d) 70 to 97 wt % of water or mixture of water with 2-propanol. The coating films made from the suspensions show good barrier capabilities against water vapor and oxygen can be used to make barrier layers on or within plastic films for packaging applications.Type: GrantFiled: December 6, 2022Date of Patent: November 5, 2024Assignee: Agency for Science, Technology and ResearchInventors: Xu Li, Yu Yuan Chieng, Siew Yee Wong, Xikui Zhang
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Patent number: 12079341Abstract: In one embodiment, an apparatus comprises a processor to: receive a request to configure a secure execution environment for a first workload; configure a first set of secure execution enclaves for execution of the first workload, wherein the first set of secure execution enclaves is configured on a first set of processing resources, wherein the first set of processing resources comprises one or more central processing units and one or more accelerators; configure a first set of secure datapaths for communication among the first set of secure execution enclaves during execution of the first workload, wherein the first set of secure datapaths is configured over a first set of interconnect resources; configure the secure execution environment for the first workload, wherein the secure execution environment comprises the first set of secure execution enclaves and the first set of secure datapaths.Type: GrantFiled: June 22, 2021Date of Patent: September 3, 2024Assignee: Intel CorporationInventors: Kapil Sood, Ioannis T. Schoinas, Yu-Yuan Chen, Raghunandan Makaram, David J. Harriman, Baiju Patel, Ronald Perez, Matthew E. Hoekstra, Reshma Lal
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Publication number: 20240282798Abstract: A backside illuminated image sensor structure including a pixel structure is provided. The pixel structure includes a substrate, a light sensing device, and at least one light pipe structure. The substrate includes a first surface and a second surface opposite to each other. The second surface has at least one recess. The light sensing device is located in the substrate. The light sensing device is adjacent to the first surface. The light pipe structure is located in the substrate. The light pipe structure is located directly above the light sensing device.Type: ApplicationFiled: June 9, 2023Publication date: August 22, 2024Applicant: Powerchip Semiconductor Manufacturing CorporationInventors: Yu Ling Huang, Yu-Yuan Lai
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Patent number: 12050350Abstract: A semiconductor package structure and a method of manufacturing the same are provided. A semiconductor package structure includes a first electronic component and a light emitter. The photonic component includes a substrate and a first port. The light emitter is disposed over the substrate of the photonic component. The light emitter is configured to emit light through the first port. A coupling loss between the first port of the photonic component and the light emitter is less than 3 dB.Type: GrantFiled: June 30, 2021Date of Patent: July 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chang-Feng You, Yu-Yuan Yeh, Jun-Wei Chen
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Publication number: 20240222204Abstract: Provided is a semiconductor device including a substrate, a semiconductor layer, a source electrode, a first metal layer, a backside via hole, and a backside metal layer. The substrate has a frontside and a backside opposite to each other. The semiconductor layer is disposed on the frontside of the substrate. The source electrode is disposed on the semiconductor layer. The first metal layer is disposed on the source electrode. The backside via hole extends from the backside of the substrate to a bottom surface of the first metal layer. The backside via hole is laterally separated from the source electrode by a non-zero distance. The backside metal layer is disposed on the backside of the substrate and extending to cover a surface of the backside via hole.Type: ApplicationFiled: February 2, 2023Publication date: July 4, 2024Applicant: United Microelectronics Corp.Inventors: Yu-Yuan Huang, Kai-Kuang Ho, Yi-Feng Hsu
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Patent number: 12025281Abstract: A see-through flame imitation device comprises a casing, a control device, a light emitting device, a flickering device, a flame imitation board, and at least one projection board. The casing includes a receiving chamber and two transparent panels respectively mounted on two sides of the receiving chamber. The light emitting device includes a lamp base disposed in the receiving chamber and light emitting members disposed on the lamp base and electrically connected to the control device. The flickering device is disposed in the receiving chamber to reflect light rays emitted from the light emitting members. The flame imitation board is disposed below the receiving chamber and includes through-holes permitting passage of the light rays reflected by the flickering device. The at least one projection board is disposed in the receiving chamber and includes a translucent projection section at a lower portion thereof and a see-through section above the projection section.Type: GrantFiled: January 3, 2024Date of Patent: July 2, 2024Assignee: Uni-Splendor CorporationInventor: Yu-Yuan Lin
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Patent number: 12012442Abstract: Disclosed herein is an activatable fusion protein that includes, in an N- to C-terminal direction, an albumin, a matrix metalloproteinase-cleavable linker, and an immunoadhesin which includes a cytotoxic T lymphocyte-associated antigen-4 (CTLA4) having an N-terminal extracellular domain and an IgG Fc region, wherein the albumin is released from the activatable fusion protein in the presence of a matrix metalloproteinase that cleaves the cleavable linker, so that the N-terminal extracellular domain of the CTLA4 binds to CD80 or CD86. Also disclosed herein is use of the activatable fusion protein for suppressing a T cell-dependent immune response.Type: GrantFiled: April 19, 2021Date of Patent: June 18, 2024Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITYInventors: Shey-Cherng Tzou, Yu-Yuan Hsiao, Fu-Yao Jiang, Yan-Zhu Zhang, Chien-Yu Chou
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Publication number: 20240146501Abstract: A method of monitoring a clock signal of a server is provided. The server includes a phase-locked loop (PLL), a baseboard management controller (BMC), and a light emitting unit. The method includes steps of: A) the server executing a time synchronization service to obtain a synchronization mode that the PLL is operating in, where the synchronization mode is one of a free-run mode, a locked mode, and a holdover mode; B) the server updating the synchronization mode to the BMC when executing the time synchronization service; and C) the BMC storing the synchronization mode and controlling the light emitting unit to display in one of a plurality of displaying manners that corresponds to the synchronization mode.Type: ApplicationFiled: July 10, 2023Publication date: May 2, 2024Inventors: Yu-Yuan Chen, Po-Wei Chang, Chi-Hua Li
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Patent number: 11907389Abstract: First data is stored. A request for the first data is received from a communication device over a link established with a communication device. An access control engine comprising circuitry is to control access to the first data to the communication device based on an authentication state of the communication device and a protection state of the link.Type: GrantFiled: May 16, 2022Date of Patent: February 20, 2024Assignee: Intel CorporationInventors: David J. Harriman, Ioannis T. Schoinas, Kapil Sood, Raghunandan Makaram, Yu-Yuan Chen
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Publication number: 20240045968Abstract: In one embodiment, an apparatus comprises a processor to: receive a request to configure a secure execution environment for a first workload; configure a first set of secure execution enclaves for execution of the first workload, wherein the first set of secure execution enclaves is configured on a first set of processing resources, wherein the first set of processing resources comprises one or more central processing units and one or more accelerators; configure a first set of secure datapaths for communication among the first set of secure execution enclaves during execution of the first workload, wherein the first set of secure datapaths is configured over a first set of interconnect resources; configure the secure execution environment for the first workload, wherein the secure execution environment comprises the first set of secure execution enclaves and the first set of secure datapaths.Type: ApplicationFiled: October 23, 2023Publication date: February 8, 2024Applicant: Intel CorporationInventors: Kapil Sood, Ioannis T. Schoinas, Yu-Yuan Chen, Raghunandan Makaram, David J. Harriman, Baiju Patel, Ronald Perez, Matthew E. Hoekstra, Reshma Lal
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Patent number: 11887302Abstract: A method for detecting cytopathic effect (CPE) in a well sample includes generating a well image depicting a well containing cells and a medium (and possibly viruses), and pre-processing the well image at least by partitioning the well image into sub-images each corresponding to a different portion of the well. The method also includes, for each of some or all of the sub-images, determining, by analyzing the sub-image using a convolutional neural network, a respective score indicative of a likelihood that any cells in the portion of the well corresponding to the sub-image exhibit CPE. The method further includes determining a CPE status of the cells contained in the well based on the respective scores for the sub-images, and generating output data indicating the CPE status.Type: GrantFiled: November 26, 2019Date of Patent: January 30, 2024Assignee: AMGEN INC.Inventors: Yu Yuan, Tony Y. Wang, Jordan P. Simons
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Patent number: 11791434Abstract: An electronic package is provided. The electronic package includes a carrier, a first electronic component, a bonding element, and a barrier. The carrier has a conductive layer. The first electronic component is disposed adjacent to the carrier and has a first terminal and a second terminal. The bonding element is configured to electrically connect the conductive layer to the first terminal. The barrier is configured to avoid electrically bypassing an electrical path in the first electronic component and between the first terminal and the second terminal.Type: GrantFiled: November 9, 2021Date of Patent: October 17, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jun-Wei Chen, Yu-Yuan Yeh, Hsu-Nan Fang
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Publication number: 20230292952Abstract: A food processor is revealed. A food processing unit is disposed between two support units of a machine body and connected to the support units by a lifting unit. The food processing unit is dropped down into the machine body while the food processor is not in use. Thus a volume of the food processor is significantly reduced and both packing and transportation costs are further saved efficiently. The lifting unit is provided with a guiding slot formed on the support unit while the food processing unit includes a guiding block inserted through the guiding slot correspondingly. The lifting unit further includes an operation bar locked and connected with the guiding block. Thereby the food processing unit is moved and positioned vertically by such simple and easy design and the production cost of the food processor is further reduced.Type: ApplicationFiled: March 16, 2022Publication date: September 21, 2023Inventor: YU-YUAN LIN
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Patent number: D1003473Type: GrantFiled: July 28, 2021Date of Patent: October 31, 2023Assignee: MAXZONE VEHICLE LIGHTING CORP.Inventors: Yu-Yuan Huang, Yung-Chien Lin
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Patent number: D1013224Type: GrantFiled: July 15, 2021Date of Patent: January 30, 2024Assignee: MAXZONE VEHICLE LIGHTING CORP.Inventors: Yu-Yuan Huang, Chun-Ting Chen, Ya-Hsuan Wu
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Patent number: D1041195Type: GrantFiled: February 22, 2023Date of Patent: September 10, 2024Inventor: Yu Yuan