Patents by Inventor Yu Yuan
Yu Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250054775Abstract: A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.Type: ApplicationFiled: October 31, 2024Publication date: February 13, 2025Inventors: Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Shuo-Mao Chen
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Publication number: 20250054857Abstract: An integrated circuit (IC) device includes an interlayer dielectric (ILD), first and second tower structures embedded in the ILD, and first and second ring regions including portions of the ILD that correspondingly extend around the first and second tower structures. Each of the first and second tower structures includes a plurality of conductive patterns in a plurality of metal layers, and a plurality of vias between the plurality of metal layers along a thickness direction of the IC device. The plurality of conductive patterns and the plurality of vias are coupled to each other to form the corresponding first or second tower structure. The first ring region extends around the first tower structure, without extending around the second tower structure.Type: ApplicationFiled: October 29, 2024Publication date: February 13, 2025Inventors: Yu-Jung CHANG, Nien-Yu TSAI, Min-Yuan TSAI, Wen-Ju YANG
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Publication number: 20250054786Abstract: A die bonding tool includes a bond head having a moveable component. The moveable component may be moveable between an extended position in which a lower surface of the moveable component protrudes below a lower surface of the bond head and a retracted position in which the lower surface of the moveable component does not protrude below the lower surface of the bond head. The moveable component may be used to control a shape of a semiconductor die secured to the lower surface of the bond head during a process of bonding the semiconductor die to a substrate. Accordingly, void areas and other bonding defects may be avoided and the bond formed between the semiconductor die and the target substrate may be improved.Type: ApplicationFiled: August 7, 2023Publication date: February 13, 2025Inventors: Chih-Yuan Chiu, Chi-Chun Peng, Yu-Hong Du, Hui-Ting Lin, Jen-Hao Liu, Amram Eitan
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Patent number: 12222331Abstract: Provided are a system and a method for impact testing and monitoring of a high-energy flexible net. The system includes a vertical impact testing unit, a slope impact testing unit, an impact simulation unit, and an impact monitoring unit. The vertical impact testing unit includes a vertically positioned gravity wall. The slope impact testing unit includes a wall slope positioned perpendicularly to a second side of the gravity wall. A first side of the gravity wall and a slope surface of the wall slope are securely provided with a flexible net, respectively. The impact simulation unit includes an impact assembly and a lifting assembly. The impact monitoring unit is configured to monitor a deformation result and an internal force change result of the flexible net.Type: GrantFiled: September 26, 2024Date of Patent: February 11, 2025Assignees: RAILWAY ENGINEERING RESEARCH INSTITUTE, CHINA ACADEMY OF RAILWAY SCIENCES CO., LTD., CHINA ACADEMY OF RAILWAY SCIENCES CO., LTD.Inventors: Yufang Zhang, Kun Yuan, Xiaobing Li, Yong Yao, Tao Jia, Lining Du, Tao Wei, Wenchao Zhang, Jian Cui, Bo Liu, Jian Li, Yu Cheng, Shengyong Zeng, Shuangquan Lei, Shiwen Huang, Wenxin Tan, Junjie Zeng, Hao Lan, Jiawei Fan, Ning Xuan, Peng Zhang, Gongming Chen, Pan Chen, Fei Xian, Zehua Dong
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Patent number: 12224212Abstract: A semiconductor structure has a frontside and a backside. The semiconductor structure includes an isolation structure at the backside; one or more transistors at the frontside, wherein the one or more transistors have source/drain epitaxial features; two metal plugs through the isolation structure and contacting two of the source/drain electrodes from the backside; and a dielectric liner filling a space between the two metal plugs, wherein the dielectric liner partially or fully surrounds an air gap between the two metal plugs.Type: GrantFiled: May 25, 2023Date of Patent: February 11, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Yuan Chen, Huan-Chieh Su, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang
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Publication number: 20250042068Abstract: A method for processing a curved plastic panel is to first form a hard coating layer, an optical function layer, and a printing layer on a flat plastic substrate, and then cut it into a predetermined shape, and then use a hot pressing and curving device to perform a hot pressing and curving process to the flat plastic substrate in order to make it becoming a curved plastic substrate. The hot pressing and curving device can simultaneously perform hot pressing during the heating process, and has the functions of real-time monitoring of the local temperature and the local curvature forming state, and then feedback to the local heating and curvature forming mechanism for adjustments. The monitoring of temperature and curvature can be divided into multiple stages, which can be monitored stage by stage and adjusted for heating or curvature forming to improve production yield.Type: ApplicationFiled: October 20, 2024Publication date: February 6, 2025Applicant: ENFLEX CORPORATIONInventors: Hsin Yuan CHEN, Chih Teng KU, Jui Lin HSU, Chun Kai WANG, Yu Ling CHIEN
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Publication number: 20250038856Abstract: A communication device includes a first laser driver, a second laser driver, a light emitting and receiving component, and a processor. The light emitting and receiving component is connected to a passive optical network to send and/or receive an optical signal. The light emitting and receiving component converts the optical signal into a first electrical signal and outputs the first electrical signal to one of the first laser driver and the second laser driver. One of the first laser driver and the second laser driver converts the first electrical signal into a second electrical signal, and outputs the second electrical signal to the processor. The processor disables another one of the first laser driver and the second laser driver.Type: ApplicationFiled: April 30, 2024Publication date: January 30, 2025Applicant: Gemtek Technology Co., Ltd.Inventors: Chang-Yuan Hsieh, Yu-Sheng Lin
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Publication number: 20250034323Abstract: A polymer is a biodegradable polymer, and a constituent monomer of the polymer includes a 2-hydroxyethyl methacrylate, a lactide and a caprolactone. When an average molecular weight of the polymer is Mw, a degradation rate of the polymer on a 7th day is Dr7, and a time for the polymer to reach a 1% degradation rate is TDr1p, the specific conditions related to Mw and Dr7 or TDr1p, respectively, can be satisfied.Type: ApplicationFiled: June 27, 2024Publication date: January 30, 2025Inventors: Wei-Yuan CHEN, Po-Tsun CHEN, Rih-Sian CHEN, Yi-Rou LU, Yu Jie HONG, Chun-Hung TENG
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Publication number: 20250040213Abstract: A semiconductor structure includes a source/drain feature in the semiconductor layer. The semiconductor structure includes a dielectric layer over the source/drain feature. The semiconductor structure includes a silicide layer over the source/drain feature. The semiconductor structure includes a barrier layer over the silicide layer. The semiconductor structure includes a seed layer over the barrier layer. The semiconductor structure includes a metal layer between a sidewall of the seed layer and a sidewall of the dielectric layer, a sidewall of each of the silicide layer, the barrier layer, and the metal layer directly contacting the sidewall of the dielectric layer. The semiconductor structure includes a source/drain contact over the seed layer.Type: ApplicationFiled: July 27, 2023Publication date: January 30, 2025Applicant: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Yi-Hsiang Chao, Peng-Hao Hsu, Yu-Shiuan Wang, Chi-Yuan Chen, Yu-Hsiang Liao, Chun-Hsien Huang, Hung-Chang Hsu, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
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Publication number: 20250037432Abstract: A method, computer system, and program product facilitate identification of error image labels in training data. The method comprises: evenly dividing a training dataset into N subsets, where the training dataset includes M data items each comprising a pair of image and its original image label; training a prediction model to label images by respectively using each of the N subsets as training data to generate N respective trained prediction models; respectively using each of the N trained prediction models trained by using one of the N subsets as training data to label the images in other N?1 subsets of the N subsets to generate N?1 prediction labels for each of the M images in the training dataset. For each image in the M data items, whether the original image label of the image is a potential error image label is based on the N?1 prediction labels of the image.Type: ApplicationFiled: July 25, 2023Publication date: January 30, 2025Inventors: Deng Xin Luo, Xiang Yu Yang, Yong Wang, Ye Wang, Zhong Fang Yuan, Wen Wang
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Publication number: 20250040093Abstract: The disclosure relates to an immersion cooling system and a tank structure thereof. The tank structure comprises a tank and a vapor chamber. The tank comprises a tank body, a door panel type condenser and a baffle. The door panel type condenser disposes on the top plane of the tank body and seals the tank body, and cool the electric vapor flowing to the top plane. One end of the baffle disposes on the top plane, and the other end of the baffle faces the liquid surface of the coolant in the tank body. The baffle divides a vapor space into a first vapor space and a second vapor space away from the door panel type condenser. The vapor chamber is connected to the tank body and used to cool the electric vapor flowing to the vapor chamber through the second vapor space.Type: ApplicationFiled: July 26, 2024Publication date: January 30, 2025Inventors: Kuei-Yuan HUANG, Yu-Long LU
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Patent number: 12211876Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a semiconductor substrate having sidewalls that form one or more trenches. The one or more trenches are disposed along opposing sides of a photodiode and vertically extend from an upper surface of the semiconductor substrate to within the semiconductor substrate. A doped region is arranged along the upper surface of the semiconductor substrate and along opposing sides of the photodiode. A first dielectric lines the sidewalls of the semiconductor substrate and the upper surface of the semiconductor substrate. A second dielectric lines sidewalls and an upper surface of the first dielectric. The doped region has a width laterally between a side of the photodiode and a side of the first dielectric. The width of the doped region varies at different heights along the side of the photodiode.Type: GrantFiled: June 16, 2023Date of Patent: January 28, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting, Tzu-Jui Wang, Yen-Ting Chiang, Yu-Jen Wang, Yuichiro Yamashita
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Patent number: 12210208Abstract: A driving mechanism is provided for moving an optical element, including a fixed module, a movable module holding the optical element, a driving assembly for driving the movable module to move relative to the fixed module, a position-sensing element, and a 3D circuit. The fixed module has a base, and the position-sensing element is disposed on the base to detect the movement of the movable module relative to the fixed module. The 3D circuit is embedded in the base and electrically connected to the position-sensing element.Type: GrantFiled: June 21, 2019Date of Patent: January 28, 2025Assignee: TDK TAIWAN CORP.Inventors: Shao-Chung Chang, Fu-Yuan Wu, Yu-Huai Liao, Shou-Jen Liu, Kun-Shih Lin, Chien-Lun Huang, Shih-Wei Hung
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Patent number: 12212826Abstract: The present disclosure provides a camera device including a first frame, a second frame, a camera component, and a driving component. The first frame includes a first arc surface on an inner surface of the first frame and recessing inward to form a circular arc shape. The second frame is movably disposed in the first frame and includes a second arc surface on an outer surface of the second frame and protruding outward to form a circular arc shape. The camera component is fixedly disposed in the second frame. The driving component is disposed on the first frame and the second frame, and the driving component is configured to drive the second frame to rotate with the first direction, the second direction, and the third direction as the axes.Type: GrantFiled: November 3, 2022Date of Patent: January 28, 2025Assignee: LANTO ELECTRONIC LIMITEDInventors: Tao-Chun Chen, Fu-Yuan Wu, Yu-Cheng Lin
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Patent number: 12211960Abstract: A micro LED display device includes an epitaxial structure layer, a connection layer, a light conversion layer and a transparent layer. The epitaxial structure layer includes a plurality of micro LEDs disposed apart from each other. The connection layer is disposed at one side of the epitaxial structure layer away from the micro LEDs. The light conversion layer is fixed on the epitaxial structure layer through the connection layer and includes a plurality of light conversion portions. Each of the light conversion portions corresponds to one of the micro LEDs. The transparent layer is disposed at one side of the light conversion layer away from the epitaxial structure layer. The ratio of the thickness of the transparent layer to the width of each light conversion portion is between 0.1 and 40. A manufacturing method of the micro LED display device is also provided.Type: GrantFiled: November 3, 2021Date of Patent: January 28, 2025Assignee: PLAYNITRIDE DISPLAY CO., LTD.Inventors: Yen-Yeh Chen, Yu-Jui Tseng, Sheng-Yuan Sun, Loganathan Murugan, Po-Wei Chiu
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Publication number: 20250031494Abstract: A manufacturing method of a micro LED display device is provided. The method includes: providing an epitaxial structure layer, wherein the epitaxial structure layer comprises a plurality of micro light-emitting diodes disposed apart from each other; forming a connection layer at one side of the epitaxial structure layer away from the micro light-emitting diodes; providing a carrier and forming a release layer, a transparent layer and a light conversion layer on the carrier in order, wherein the light conversion layer comprises a plurality of light conversion portions, each of the light conversion portions corresponds to one of the micro light-emitting diodes; attaching the light conversion layer to the connection layer, so that the carrier configured with the release layer, the transparent layer and the light conversion layer is fixed on the epitaxial structure layer through the connection layer; and removing the release layer and the carrier.Type: ApplicationFiled: October 9, 2024Publication date: January 23, 2025Inventors: Yen-Yeh CHEN, Yu-Jui TSENG, Sheng-Yuan SUN, Loganathan MURUGAN, Po-Wei CHIU
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Patent number: 12204450Abstract: A computing system performs shared cache allocation to allocate cache resources to groups of tasks. The computing system monitors the bandwidth at a memory hierarchy device that is at a next level to the cache in a memory hierarchy of the computing system. The computing system estimates a change in dynamic power from a corresponding change in the bandwidth before and after the cache resources are allocated. The allocation of the cache resources are adjusted according to an allocation policy that receives inputs including the estimated change in the dynamic power and a performance indication of task execution.Type: GrantFiled: August 17, 2023Date of Patent: January 21, 2025Assignee: MediaTek Inc.Inventors: Yu-Pin Chen, Jia-Ming Chen, Chien-Yuan Lai, Ya Ting Chang, Cheng-Tse Chen
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Publication number: 20250020848Abstract: A display device includes a reflective display panel, a light guide plate, a light source, and a first optical adhesive layer. The light guide plate is located on the reflective display device. The light guide plate has a top surface, a bottom surface and a light incident surface connecting the top surface and the bottom surface. The light guide plate further includes multiple microstructures located on the top surface and multiple lenticular structures located on the bottom surface. The light source faces the light incident surface of the light guide plate. The first optical adhesive layer is located below the light guide plate and in contact with the lenticular structure. A refractive index of the first optical adhesive layer is lower than a refractive index of the light guide plate.Type: ApplicationFiled: July 1, 2024Publication date: January 16, 2025Inventors: Chun-Chiang LIANG, Chia Feng HO, Jen-Yuan CHI, Yu-Nan PAO
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Patent number: 12134667Abstract: This invention relates to a a one-step process for making a polymer composite suspension for coating plastic films characterized in that a first polymer is synthesized in-situ optionally in the presence of other polymers and in the presence of clay. Preferably the polymer composite suspension comprises a) 1.0 to 11.0 wt % of clay or silane modified clay, b) 0.1 to 10.0 wt % of poly (acrylic acid), which is a copolymer of acrylic acid (AA) with at least one other monomer selected from 2-ethylhexyl acrylate (EHA), ?-carboxyethyl acrylate (?-CEA), methacrylamidoethyl ethylene urea (WAM II) and ethoxylated behenyl methacrylate (?-EM), c) 1.0 to 15.0 wt % of other polymers, preferably poly (vinyl alcohol) and d) 70 to 97 wt % of water or mixture of water with 2-propanol. The coating films made from the suspensions show good barrier capabilities against water vapor and oxygen can be used to make barrier layers on or within plastic films for packaging applications.Type: GrantFiled: December 6, 2022Date of Patent: November 5, 2024Assignee: Agency for Science, Technology and ResearchInventors: Xu Li, Yu Yuan Chieng, Siew Yee Wong, Xikui Zhang
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Patent number: D1041195Type: GrantFiled: February 22, 2023Date of Patent: September 10, 2024Inventor: Yu Yuan