Patents by Inventor Yu Yuan

Yu Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11677730
    Abstract: A device includes a microcontroller, memory including secure memory to store a private key, a set of registers, and an authentication engine. The set of registers includes a write mailbox register and a read mailbox register, and message data is to be written to the write mailbox register by a host system. The message data includes at least a portion of a challenge request, and the challenge request includes a challenge by the host system to authenticity of the device. The authentication engine generates a response to the challenge, where the response includes data to identify attributes of the device and a signature generated using the private key. The authentication engine causes at least a portion of the response to be written to the read mailbox register to be read by the host system.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: June 13, 2023
    Assignee: Intel Corporation
    Inventors: Yu-Yuan Chen, Wojciech S. Powiertowski, Srikanth Varadarajan, David J. Harriman
  • Patent number: 11658947
    Abstract: A protected link between a first computing device and a second computing device is set up, wherein communication over the protected link is to comply with a communication protocol that allows packets to be reordered during transit. A plurality of packets are generated according to a packet format that ensures the plurality of packets will not be reordered during transmission over the protected link, the plurality of packets comprising a first packet and a second packet. Data of the plurality of packets are encrypted for transmission over the protected link, wherein data of the first packet is encrypted based on the cryptographic key and a first value of a counter and data of the second packet is encrypted based on the cryptographic key and a second value of the counter.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: May 23, 2023
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Raghunandan Makaram, Ioannis T. Schoinas, Kapil Sood, Yu-Yuan Chen, Vedvyas Shanbhogue, Siddhartha Chhabra, Reshma Lal, Reouven Elbaz
  • Publication number: 20230144000
    Abstract: An electronic package is provided. The electronic package includes a carrier, a first electronic component, a bonding element, and a barrier. The carrier has a conductive layer. The first electronic component is disposed adjacent to the carrier and has a first terminal and a second terminal. The bonding element is configured to electrically connect the conductive layer to the first terminal. The barrier is configured to avoid electrically bypassing an electrical path in the first electronic component and between the first terminal and the second terminal.
    Type: Application
    Filed: November 9, 2021
    Publication date: May 11, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jun-Wei CHEN, Yu-Yuan YEH, Hsu-Nan FANG
  • Patent number: 11643436
    Abstract: The present invention discloses a polypeptide compound, a pharmaceutical composition, and a preparation method and use thereof. The structural formula of the polypeptide compound is shown in general formula (I): Such polypeptide compounds as ?-opioid receptor agonists have the advantages of better activity and the potential to become clinical candidate compounds.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: May 9, 2023
    Assignee: CHENGDU SINTANOVO BIOTECHNOLOGY CO., LTD.
    Inventors: Jian Gao, Xiaoping Fu, Guoqing Zhong, Haibo Zhou, Hai Hu, Xi Hu, Yu Yuan, Yuanbo Li, Sijun Li
  • Publication number: 20230098788
    Abstract: A metal mesh structure includes at least one first wire extending along a first direction and at least one second wire extending along a second direction different from the first direction. The at least one first wire includes a first portion, a second portion and a first bending portion connected between the first portion and the second portion. The first bending portion crosses the at least one second wire to form a node. An extending line of the first portion along the first direction passes through the node and is overlapped with the second portion. A first included angle is included between the first direction and the second direction, and a second included angle is included between the first bending portion and the at least one second wire, wherein the first included angle is different from the second included angle, and the second included angle is 90 degrees.
    Type: Application
    Filed: March 21, 2022
    Publication date: March 30, 2023
    Applicant: HENGHAO TECHNOLOGY CO., LTD.
    Inventors: Yu-Tung Chen, Shan-Chen Huang, Yu-Yuan Yeh
  • Publication number: 20230103047
    Abstract: This invention relates to a a one-step process for making a polymer composite suspension for coating plastic films characterized in that a first polymer is synthesized in-situ optionally in the presence of other polymers and in the presence of clay. Preferably the polymer composite suspension comprises a) 1.0 to 11.0 wt % of clay or silane modified clay, b) 0.1 to 10.0 wt % of poly (acrylic acid), which is a copolymer of acrylic acid (AA) with at least one other monomer selected from 2-ethylhexyl acrylate (ERA), ?-carboxyethyl acrylate (?-CEA), methacrylamidoethyl ethylene urea (WAM II) and ethoxylated behenyl methacrylate (?-EHA), c) 1.0 to 15.0 wt % of other polymers, preferably poly (vinyl alcohol) and d) 70 to 97 wt % of water or mixture of water with 2-propanol. The coating films made from the suspensions show good barrier capabilities against water vapor and oxygen can be used to make barrier layers on or within plastic films for packaging applications.
    Type: Application
    Filed: December 6, 2022
    Publication date: March 30, 2023
    Inventors: Xu LI, Yu Yuan CHIENG, Siew Yee WONG, Xikui ZHANG
  • Publication number: 20230086042
    Abstract: A method of facilitating a growth assessment for a cell line includes generating an image of a well that contains a medium that was inoculated with at least one cell of the cell line. The method also includes generating a down-sampled segmentation map comprising pixels that indicate an inferred presence or absence of a cell colony in corresponding portions of the well image. Generating the down-sampled segmentation map includes inputting the well image to a fully convolutional neural network having a plurality of convolutional layers. The method also includes (i) determining, by inputting colony size information (including the down-sampled segmentation map and/or a pixel count derived therefrom) to a cell growth assessment algorithm, a growth classification or score for the cell line, and causing a display of the growth classification or score, and/or (II) causing a display of the colony size information to facilitate a manual cell growth assessment.
    Type: Application
    Filed: March 4, 2021
    Publication date: March 23, 2023
    Inventors: Yu Yuan, Tony Y. Wang, Kim H. Le, Christopher Tan, Jasmine Tat, Thorsten Dzidowski
  • Patent number: 11604552
    Abstract: A metal mesh structure includes at least one first wire extending along a first direction and at least one second wire extending along a second direction different from the first direction. The at least one first wire includes a first portion, a second portion and a first bending portion connected between the first portion and the second portion. The first bending portion crosses the at least one second wire to form a node. An extending line of the first portion along the first direction passes through the node and is overlapped with the second portion. A first included angle is included between the first direction and the second direction, and a second included angle is included between the first bending portion and the at least one second wire, wherein the first included angle is different from the second included angle, and the second included angle is 90 degrees.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: March 14, 2023
    Assignee: HENGHAO TECHNOLOGY CO., LTD.
    Inventors: Yu-Tung Chen, Shan-Chen Huang, Yu-Yuan Yeh
  • Publication number: 20230003956
    Abstract: A semiconductor package structure and a method of manufacturing the same are provided. A semiconductor package structure includes a first electronic component and a light emitter. The photonic component includes a substrate and a first port. The light emitter is disposed over the substrate of the photonic component. The light emitter is configured to emit light through the first port. A coupling loss between the first port of the photonic component and the light emitter is less than 3 dB.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang-Feng YOU, Yu-Yuan YEH, Jun-Wei CHEN
  • Patent number: 11542347
    Abstract: This invention relates to a one-step process for making a polymer composite suspension for coating plastic films characterized in that a first polymer is synthesized in-situ optionally in the presence of other polymers and in the presence of clay. Preferably the polymer composite suspension comprises a) 1.0 to 11.0 wt % of clay or silane modified clay, b) 0.1 to 10.0 wt % of poly (acrylic acid), which is a copolymer of acrylic acid (AA) with at least one other monomer selected from 2-ethylhexyl acrylate (EHA), ?-carboxyethyl acrylate (?-CEA), methacrylamidoethyl ethylene urea (WAM II) and ethoxylated behenyl methacrylate (?-FM), c) 1.0 to 15.0 wt % of other polymers, preferably poly (vinyl alcohol) and d) 70 to 97 wt % of water or mixture of water with 2-propanol. The coating films made from the suspensions show good barrier capabilities against water vapor and oxygen can be used to make barrier layers on or within plastic films for packaging applications.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: January 3, 2023
    Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Xu Li, Yu Yuan Chieng, Siew Yee Wong, Xikui Zhang
  • Publication number: 20220355688
    Abstract: A smart street lamp charging system includes at least one street lamp module, at least one first charging device and a second charging device. The at least one street lamp module includes a light pole. The at least one first charging device is mounted to the light pole of the at least one street lamp module. The at least one first charging device includes a wireless transmitting module. The second charging device is mounted at a body of an electric vehicle. The second charging device includes a wireless receiving module. The wireless receiving module is able to receive energies from the wireless transmitting module to proceed with a wireless charging.
    Type: Application
    Filed: April 7, 2022
    Publication date: November 10, 2022
    Inventors: Kuo Yang Wu, Yu Yuan Wu, Hsi Chun Lee
  • Patent number: 11495510
    Abstract: A semiconductor device package structure includes a substrate. The substrate has a circuit structure formed in a die region. The die region is defined by a plurality of scribe lines configured on the substrate. A seal ring is disposed in the substrate and located at a periphery region of the die region, and surrounds at least a portion of the circuit structure. A trench ring is disposed in the substrate between the seal ring and the scribe lines. A packaging passivation cap layer covers over the circuit structure and the seal ring, and covers at least the trench ring.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: November 8, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Yuan Huang, Tsung-Kai Yu, Chen-Hsiao Wang, Kai-Kuang Ho, Kuang-Hui Tang
  • Publication number: 20220350912
    Abstract: First data is stored. A request for the first data is received from a communication device over a link established with a communication device. An access control engine comprising circuitry is to control access to the first data to the communication device based on an authentication state of the communication device and a protection state of the link.
    Type: Application
    Filed: May 16, 2022
    Publication date: November 3, 2022
    Applicant: Intel Corporation
    Inventors: David J. Harriman, Ioannis T. Schoinas, Kapil Sood, Raghunandan Makaram, Yu-Yuan Chen
  • Publication number: 20220289785
    Abstract: Disclosed herein is a modular composition comprising 1) an oligonucleotide; 2) one or more tetraGalNAc ligands of Formula (I), which may be the same or different; optionally, 3) one or more linkers, which may be the same or different; 4) one or more peptides independently selected from Table 3, which may be the same or different; and optionally, 5) one or more targeting ligands, solubilizing agents, pharmacokinetics enhancing agents, lipids, and/or masking agents.
    Type: Application
    Filed: July 28, 2021
    Publication date: September 15, 2022
    Inventors: David TELLERS, Steven L. COLLETTI, Vadim DUDKIN, Jeffrey AARONSON, Aaron MOMOSE, Thomas Joseph TUCKER, Yu YUAN, Kathleen B. CALATI, Lu TIAN, Rubina G. PARMAR, Anthony W. SHAW, Weimin WANG, Rachel Anne STORR, Marina BUSUEK, Robert A. KOWTONIUK
  • Patent number: 11444263
    Abstract: A flexible display panel. The flexible display panel includes: a flexible substrate; a display element arranged on the flexible substrate; and a packaging layer covering the display element, the packaging layer including an inorganic thin film and an organic thin film that are stacked alternately, in which two protrusion structures that are engaged with each other are arranged between at least two adjacent thin films of the packaging layer.
    Type: Grant
    Filed: October 12, 2019
    Date of Patent: September 13, 2022
    Assignees: Ordos Yuansheng Optoelectronics Co., Ltd., Beijing BOE Technology Development Co., Ltd.
    Inventors: Xiaodong Meng, Lingling Ma, Zihua Li, Zhibo Wen, Hengbo Liu, Yu Yuan, Lu Cai, Dong Xu, Guofang Xu, Xinpeng Gao, Qiang Wang, Ruiqing Zhang, Qiang Guo, Wenqiang Jin, Xudong Wang
  • Publication number: 20220251169
    Abstract: Disclosed herein is an activatable fusion protein that includes, in an N- to C-terminal direction, an albumin, a matrix metalloproteinase-cleavable linker, and an immunoadhesin which includes a cytotoxic T lymphocyte-associated antigen-4 (CTLA4) having an N-terminal extracellular domain and an IgG Fc region, wherein the albumin is released from the activatable fusion protein in the presence of a matrix metalloproteinase that cleaves the cleavable linker, so that the N-terminal extracellular domain of the CTLA4 binds to CD80 or CD86. Also disclosed herein is use of the activatable fusion protein for suppressing a T cell-dependent immune response.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 11, 2022
    Inventors: Shey-Cherng TZOU, Yu-Yuan HSIAO, Fu-Yao JIANG, Yan-Zhu ZHANG, Chien-Yu CHOU
  • Publication number: 20220204452
    Abstract: Antimalarial compounds of the formula: in which n is 1 or 2; X is C or N; R1 is a moiety comprising a secondary amine and a tertiary amine joined by a C2 to C4 alkyl chain; and R2 is CF3, F, or H, or an analog, combination, derivative, prodrug, stereoisomer, or pharmaceutically acceptable salt thereof. Pharmaceutical compounds including the antimalarial compounds. Methods of treating or preventing malaria comprising administering an effective amount of the antimalarial compounds.
    Type: Application
    Filed: April 3, 2020
    Publication date: June 30, 2022
    Inventors: Debopam CHAKRABARTI, YU YUAN, Guang HUANG, Claribel Murillo SOLANO
  • Patent number: 11361093
    Abstract: First data is stored. A request for the first data is received from a communication device over a link established with a communication device. An access control engine comprising circuitry is to control access to the first data to the communication device based on an authentication state of the communication device and a protection state of the link.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: June 14, 2022
    Assignee: Intel Corporation
    Inventors: David J. Harriman, Ioannis T. Schoinas, Kapil Sood, Raghunandan Makaram, Yu-Yuan Chen
  • Patent number: 11333922
    Abstract: A display panel, a method for fabricating the same, and a display device are provided. The display panel includes: a first substrate, and a plurality of pixels in an array on the first substrate, where each pixel includes a plurality of sub-pixels in different colors, and interference filters one-to-one corresponding to the sub-pixels are arranged on light emitting sides of the sub-pixels, and configured to transmit light in narrow bands in the same colors as the corresponding sub-pixels. The interference filters corresponding to the colors of light emitted from the sub-pixels are arranged on the light emitting sides of the sub-pixels so that the light in the narrow bands in the corresponding colors are transmitted, thus improving the saturation of the colors of the emitted light, extending the display color gamut of the display panel, and optimizing the display effect.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: May 17, 2022
    Assignees: Ordos Yuansheng Optoelectronics Co., Ltd., BOE Technology Group Co., Ltd.
    Inventor: Yu Yuan
  • Publication number: 20220134604
    Abstract: A method for recycling plastic such as plastic toys includes grinding the plastic into plastic pieces, sorting the plastic pieces based on type of plastic, sorting the plastic pieces based on colour, after sorting of the plastic pieces, shredding the sorted plastic pieces into plastic flakes, and processing the plastic flakes into a recycled good by means of rotational moulding. During the rotational moulding, a micronized plastic is added.
    Type: Application
    Filed: March 18, 2020
    Publication date: May 5, 2022
    Applicant: VANBRIEL YUAN BVBA
    Inventors: Joris VANBRIEL, Peng Yu YUAN