Patents by Inventor Yu Yuan
Yu Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240076463Abstract: Disclosed is a method of reducing the lambda aging of a polyurethane foam, a polyisocyanurate foam or a mixture thereof comprising producing the foam from a foamable composition comprising an isocyanate and a polyol premix composition comprising a polyol or mixture of polyols, a blowing agent selected from the group consisting of 1,3,3,3-tetrafluoropropene (1234ze), 1,1,1,4,4,4-hexafluorobut-2-ene (1336mzzm) and/or 1-chloro-3,3,3-trifluoropropene (1233zd) and a flame retardant wherein the flame retardant comprises 25 phpp or less of a phosphate based flame retardant.Type: ApplicationFiled: June 13, 2017Publication date: March 7, 2024Inventors: HUIJUN-PARK YUAN, BIN YU, YIU KEUNG LING, DAVID J. WILLIAMS
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Publication number: 20240071225Abstract: A risk control system for traffic devices includes a light emitting device, a processing element and a user prompting element. The processing element is electrically connected with the light emitting device, and outputs a prompt signal. The user prompting element is electrically connected with the processing element, and receives the prompt signal.Type: ApplicationFiled: July 28, 2023Publication date: February 29, 2024Inventors: Yu-Chien KAO, Chueh-Yuan NIEN, Yi-Cheng TSAI
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Patent number: 11913981Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.Type: GrantFiled: December 21, 2020Date of Patent: February 27, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Mean-Jue Tung, Ming-Da Yang, Shi-Yuan Tong, Yu-Ting Huang, Chun-Pin Wu
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Patent number: 11907389Abstract: First data is stored. A request for the first data is received from a communication device over a link established with a communication device. An access control engine comprising circuitry is to control access to the first data to the communication device based on an authentication state of the communication device and a protection state of the link.Type: GrantFiled: May 16, 2022Date of Patent: February 20, 2024Assignee: Intel CorporationInventors: David J. Harriman, Ioannis T. Schoinas, Kapil Sood, Raghunandan Makaram, Yu-Yuan Chen
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Publication number: 20240045968Abstract: In one embodiment, an apparatus comprises a processor to: receive a request to configure a secure execution environment for a first workload; configure a first set of secure execution enclaves for execution of the first workload, wherein the first set of secure execution enclaves is configured on a first set of processing resources, wherein the first set of processing resources comprises one or more central processing units and one or more accelerators; configure a first set of secure datapaths for communication among the first set of secure execution enclaves during execution of the first workload, wherein the first set of secure datapaths is configured over a first set of interconnect resources; configure the secure execution environment for the first workload, wherein the secure execution environment comprises the first set of secure execution enclaves and the first set of secure datapaths.Type: ApplicationFiled: October 23, 2023Publication date: February 8, 2024Applicant: Intel CorporationInventors: Kapil Sood, Ioannis T. Schoinas, Yu-Yuan Chen, Raghunandan Makaram, David J. Harriman, Baiju Patel, Ronald Perez, Matthew E. Hoekstra, Reshma Lal
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Patent number: 11887302Abstract: A method for detecting cytopathic effect (CPE) in a well sample includes generating a well image depicting a well containing cells and a medium (and possibly viruses), and pre-processing the well image at least by partitioning the well image into sub-images each corresponding to a different portion of the well. The method also includes, for each of some or all of the sub-images, determining, by analyzing the sub-image using a convolutional neural network, a respective score indicative of a likelihood that any cells in the portion of the well corresponding to the sub-image exhibit CPE. The method further includes determining a CPE status of the cells contained in the well based on the respective scores for the sub-images, and generating output data indicating the CPE status.Type: GrantFiled: November 26, 2019Date of Patent: January 30, 2024Assignee: AMGEN INC.Inventors: Yu Yuan, Tony Y. Wang, Jordan P. Simons
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Patent number: 11791434Abstract: An electronic package is provided. The electronic package includes a carrier, a first electronic component, a bonding element, and a barrier. The carrier has a conductive layer. The first electronic component is disposed adjacent to the carrier and has a first terminal and a second terminal. The bonding element is configured to electrically connect the conductive layer to the first terminal. The barrier is configured to avoid electrically bypassing an electrical path in the first electronic component and between the first terminal and the second terminal.Type: GrantFiled: November 9, 2021Date of Patent: October 17, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jun-Wei Chen, Yu-Yuan Yeh, Hsu-Nan Fang
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Publication number: 20230292952Abstract: A food processor is revealed. A food processing unit is disposed between two support units of a machine body and connected to the support units by a lifting unit. The food processing unit is dropped down into the machine body while the food processor is not in use. Thus a volume of the food processor is significantly reduced and both packing and transportation costs are further saved efficiently. The lifting unit is provided with a guiding slot formed on the support unit while the food processing unit includes a guiding block inserted through the guiding slot correspondingly. The lifting unit further includes an operation bar locked and connected with the guiding block. Thereby the food processing unit is moved and positioned vertically by such simple and easy design and the production cost of the food processor is further reduced.Type: ApplicationFiled: March 16, 2022Publication date: September 21, 2023Inventor: YU-YUAN LIN
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Patent number: 11677730Abstract: A device includes a microcontroller, memory including secure memory to store a private key, a set of registers, and an authentication engine. The set of registers includes a write mailbox register and a read mailbox register, and message data is to be written to the write mailbox register by a host system. The message data includes at least a portion of a challenge request, and the challenge request includes a challenge by the host system to authenticity of the device. The authentication engine generates a response to the challenge, where the response includes data to identify attributes of the device and a signature generated using the private key. The authentication engine causes at least a portion of the response to be written to the read mailbox register to be read by the host system.Type: GrantFiled: June 29, 2018Date of Patent: June 13, 2023Assignee: Intel CorporationInventors: Yu-Yuan Chen, Wojciech S. Powiertowski, Srikanth Varadarajan, David J. Harriman
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Patent number: 11658947Abstract: A protected link between a first computing device and a second computing device is set up, wherein communication over the protected link is to comply with a communication protocol that allows packets to be reordered during transit. A plurality of packets are generated according to a packet format that ensures the plurality of packets will not be reordered during transmission over the protected link, the plurality of packets comprising a first packet and a second packet. Data of the plurality of packets are encrypted for transmission over the protected link, wherein data of the first packet is encrypted based on the cryptographic key and a first value of a counter and data of the second packet is encrypted based on the cryptographic key and a second value of the counter.Type: GrantFiled: July 7, 2021Date of Patent: May 23, 2023Assignee: Intel CorporationInventors: David J. Harriman, Raghunandan Makaram, Ioannis T. Schoinas, Kapil Sood, Yu-Yuan Chen, Vedvyas Shanbhogue, Siddhartha Chhabra, Reshma Lal, Reouven Elbaz
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Publication number: 20230144000Abstract: An electronic package is provided. The electronic package includes a carrier, a first electronic component, a bonding element, and a barrier. The carrier has a conductive layer. The first electronic component is disposed adjacent to the carrier and has a first terminal and a second terminal. The bonding element is configured to electrically connect the conductive layer to the first terminal. The barrier is configured to avoid electrically bypassing an electrical path in the first electronic component and between the first terminal and the second terminal.Type: ApplicationFiled: November 9, 2021Publication date: May 11, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jun-Wei CHEN, Yu-Yuan YEH, Hsu-Nan FANG
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Patent number: 11643436Abstract: The present invention discloses a polypeptide compound, a pharmaceutical composition, and a preparation method and use thereof. The structural formula of the polypeptide compound is shown in general formula (I): Such polypeptide compounds as ?-opioid receptor agonists have the advantages of better activity and the potential to become clinical candidate compounds.Type: GrantFiled: November 9, 2020Date of Patent: May 9, 2023Assignee: CHENGDU SINTANOVO BIOTECHNOLOGY CO., LTD.Inventors: Jian Gao, Xiaoping Fu, Guoqing Zhong, Haibo Zhou, Hai Hu, Xi Hu, Yu Yuan, Yuanbo Li, Sijun Li
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Publication number: 20230103047Abstract: This invention relates to a a one-step process for making a polymer composite suspension for coating plastic films characterized in that a first polymer is synthesized in-situ optionally in the presence of other polymers and in the presence of clay. Preferably the polymer composite suspension comprises a) 1.0 to 11.0 wt % of clay or silane modified clay, b) 0.1 to 10.0 wt % of poly (acrylic acid), which is a copolymer of acrylic acid (AA) with at least one other monomer selected from 2-ethylhexyl acrylate (ERA), ?-carboxyethyl acrylate (?-CEA), methacrylamidoethyl ethylene urea (WAM II) and ethoxylated behenyl methacrylate (?-EHA), c) 1.0 to 15.0 wt % of other polymers, preferably poly (vinyl alcohol) and d) 70 to 97 wt % of water or mixture of water with 2-propanol. The coating films made from the suspensions show good barrier capabilities against water vapor and oxygen can be used to make barrier layers on or within plastic films for packaging applications.Type: ApplicationFiled: December 6, 2022Publication date: March 30, 2023Inventors: Xu LI, Yu Yuan CHIENG, Siew Yee WONG, Xikui ZHANG
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Publication number: 20230098788Abstract: A metal mesh structure includes at least one first wire extending along a first direction and at least one second wire extending along a second direction different from the first direction. The at least one first wire includes a first portion, a second portion and a first bending portion connected between the first portion and the second portion. The first bending portion crosses the at least one second wire to form a node. An extending line of the first portion along the first direction passes through the node and is overlapped with the second portion. A first included angle is included between the first direction and the second direction, and a second included angle is included between the first bending portion and the at least one second wire, wherein the first included angle is different from the second included angle, and the second included angle is 90 degrees.Type: ApplicationFiled: March 21, 2022Publication date: March 30, 2023Applicant: HENGHAO TECHNOLOGY CO., LTD.Inventors: Yu-Tung Chen, Shan-Chen Huang, Yu-Yuan Yeh
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Publication number: 20230086042Abstract: A method of facilitating a growth assessment for a cell line includes generating an image of a well that contains a medium that was inoculated with at least one cell of the cell line. The method also includes generating a down-sampled segmentation map comprising pixels that indicate an inferred presence or absence of a cell colony in corresponding portions of the well image. Generating the down-sampled segmentation map includes inputting the well image to a fully convolutional neural network having a plurality of convolutional layers. The method also includes (i) determining, by inputting colony size information (including the down-sampled segmentation map and/or a pixel count derived therefrom) to a cell growth assessment algorithm, a growth classification or score for the cell line, and causing a display of the growth classification or score, and/or (II) causing a display of the colony size information to facilitate a manual cell growth assessment.Type: ApplicationFiled: March 4, 2021Publication date: March 23, 2023Inventors: Yu Yuan, Tony Y. Wang, Kim H. Le, Christopher Tan, Jasmine Tat, Thorsten Dzidowski
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Patent number: 11604552Abstract: A metal mesh structure includes at least one first wire extending along a first direction and at least one second wire extending along a second direction different from the first direction. The at least one first wire includes a first portion, a second portion and a first bending portion connected between the first portion and the second portion. The first bending portion crosses the at least one second wire to form a node. An extending line of the first portion along the first direction passes through the node and is overlapped with the second portion. A first included angle is included between the first direction and the second direction, and a second included angle is included between the first bending portion and the at least one second wire, wherein the first included angle is different from the second included angle, and the second included angle is 90 degrees.Type: GrantFiled: March 21, 2022Date of Patent: March 14, 2023Assignee: HENGHAO TECHNOLOGY CO., LTD.Inventors: Yu-Tung Chen, Shan-Chen Huang, Yu-Yuan Yeh
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Publication number: 20230003956Abstract: A semiconductor package structure and a method of manufacturing the same are provided. A semiconductor package structure includes a first electronic component and a light emitter. The photonic component includes a substrate and a first port. The light emitter is disposed over the substrate of the photonic component. The light emitter is configured to emit light through the first port. A coupling loss between the first port of the photonic component and the light emitter is less than 3 dB.Type: ApplicationFiled: June 30, 2021Publication date: January 5, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang-Feng YOU, Yu-Yuan YEH, Jun-Wei CHEN
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Patent number: 11542347Abstract: This invention relates to a one-step process for making a polymer composite suspension for coating plastic films characterized in that a first polymer is synthesized in-situ optionally in the presence of other polymers and in the presence of clay. Preferably the polymer composite suspension comprises a) 1.0 to 11.0 wt % of clay or silane modified clay, b) 0.1 to 10.0 wt % of poly (acrylic acid), which is a copolymer of acrylic acid (AA) with at least one other monomer selected from 2-ethylhexyl acrylate (EHA), ?-carboxyethyl acrylate (?-CEA), methacrylamidoethyl ethylene urea (WAM II) and ethoxylated behenyl methacrylate (?-FM), c) 1.0 to 15.0 wt % of other polymers, preferably poly (vinyl alcohol) and d) 70 to 97 wt % of water or mixture of water with 2-propanol. The coating films made from the suspensions show good barrier capabilities against water vapor and oxygen can be used to make barrier layers on or within plastic films for packaging applications.Type: GrantFiled: June 3, 2020Date of Patent: January 3, 2023Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCHInventors: Xu Li, Yu Yuan Chieng, Siew Yee Wong, Xikui Zhang
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Patent number: D1003473Type: GrantFiled: July 28, 2021Date of Patent: October 31, 2023Assignee: MAXZONE VEHICLE LIGHTING CORP.Inventors: Yu-Yuan Huang, Yung-Chien Lin
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Patent number: D1013224Type: GrantFiled: July 15, 2021Date of Patent: January 30, 2024Assignee: MAXZONE VEHICLE LIGHTING CORP.Inventors: Yu-Yuan Huang, Chun-Ting Chen, Ya-Hsuan Wu