Abstract: The present disclosure provides methods, computer program products and apparatuses for text compression and decompression wherein a desired compression ratio may be obtained, and the compressed content per se is still in a searchable text form, thereby providing a possibility for searching without decompression and significantly saving storage space and enhancing search efficiency, and in turn, reducing the total cost ownership TCO and providing a better user experience.

Abstract: A light emitting device includes a substrate, a light emitting unit disposed on the substrate, a metallic electrode unit, a metallic adhesion layer disposed on the first and second electrodes of the electrode unit, and a protective layer disposed on the adhesion layer. The first electrode is disposed on a portion of a first-type semiconductor layer of the light emitting unit. The second electrode is disposed on a second-type semiconductor layer of the light emitting unit disposed on a separated portion of the first-type semiconductor layer. The first and second electrodes are partially exposed by the protective layer and the adhesion layer that is partially exposed by the protective layer. A production method for the light emitting device is also disclosed.

Abstract: A LED flip-chip package substrate includes a ceramic base (e.g., aluminum nitride base), a conductive wire layer disposed on the ceramic base and having pads in pairs, an insulating protective layer (e.g., low-temperature glass glaze layer) disposed on a same side of the ceramic base as the conductive wire layer and exposing the pads, and a metallic reflective layer (e.g., aluminum layer) disposed on a side of the insulating protective layer facing away from the ceramic base and exposing the pads. Moreover, a LED package structure adopting the LED flip-chip package substrate and other LED package structures with similar material layers such as a chip-level packaged LED package structure are provided. By comprehensively utilizing advantages of various materials, the LED flip-chip package substrate with high heat conductivity, high reflectivity, high stability and superior insulation and the LED package structure with high reliability and even high light extraction efficiency are obtained.

Abstract: A fabrication method of a high-voltage light-emitting diode includes the steps of providing a substrate, and forming a light-emitting epitaxial laminated layer on the substrate; patterning the light-emitting epitaxial laminated layer and fabricating a channel that exposes the substrate surface so as to divide the light-emitting epitaxial laminated layer into a plurality of light-emitting diode units, and the light-emitting diode units at least constitute two rows; fabricating an electrode interconnection line crossing the channel, wherein, two adjacent light-emitting diode units are connected by the electrode interconnection line; fabricating an electrode bonding pad over the outmost light-emitting diode unit of the high-voltage light-emitting diode; and fabricating an insulating protective layer opening at the channel where the potential difference of any two adjacent light-emitting diodes is ?3 times of the forward voltage of a single light-emitting diode to avoid breakdown of the light-emitting epitaxial l

Abstract: A molding apparatus is provided, including a mold, a measurement device configured for sensing a state of the mold, and a calibration device electrically connected to the measurement device and configured for determining a state of a sensing function of the measurement device. Therefore, the problem that the measurement device is too old to accurately sense the state of the mold is solved.

Abstract: A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering pads are electrically connected to the first and the second electrodes respectively. Moreover, a first and a second grooves are defined on the first surface of the insulating substrate, the first and the second grooves are spaced from each other and disposed between the first and the second soldering pads. The invention further provides a LED flip chip package structure including the package substrate, a LED flip chip and fluorescent glue. The invention adds the grooves in the spacing between the soldering pads as a buffer space for melted solder flowing during reflow soldering process and therefore can relieve short-circuit phenomenon.

Abstract: A fingerprint image acquisition device includes: a light source, a finger touching surface, a convex lens, an image sensor and a grating. The light source is a surface light source, and the grating is disposed on a light output surface of the light source. The light source is configured to emit a light beam, the grating is configured to change a propagation direction of the light beam to form a detection light beam, the finger touching surface is configured for a user to place a finger thereon to reflect the detection light beam and thereby obtain a reflected light beam, the convex lens is configured to focus the reflected light beam on the image sensor, and the image sensor is configured to generate a fingerprint image based on the focused reflected light beam. Accordingly, the invention can make the structure of the fingerprint image acquisition device be more compact.

Abstract: A fabrication method of a high-voltage light-emitting diode includes the steps of providing a substrate, and forming a light-emitting epitaxial laminated layer on the substrate; patterning the light-emitting epitaxial laminated layer and fabricating a channel that exposes the substrate surface so as to divide the light-emitting epitaxial laminated layer into a plurality of light-emitting diode units, and the light-emitting diode units at least constitute two rows; fabricating an electrode interconnection line crossing the channel, wherein, two adjacent light-emitting diode units are connected by the electrode interconnection line; fabricating an electrode bonding pad over the outmost light-emitting diode unit of the high-voltage light-emitting diode; and fabricating an insulating protective layer opening at the channel where the potential difference of any two adjacent light-emitting diodes is ?3 times of the forward voltage of a single light-emitting diode to avoid breakdown of the light-emitting epitaxial l

Abstract: A LED flip-chip package substrate includes a ceramic base (e.g., aluminum nitride base), a conductive wire layer disposed on the ceramic base and having pads in pairs, an insulating protective layer (e.g., low-temperature glass glaze layer) disposed on a same side of the ceramic base as the conductive wire layer and exposing the pads, and a metallic reflective layer (e.g., aluminum layer) disposed on a side of the insulating protective layer facing away from the ceramic base and exposing the pads. Moreover, a LED package structure adopting the LED flip-chip package substrate and other LED package structures with similar material layers such as a chip-level packaged LED package structure are provided. By comprehensively utilizing advantages of various materials, the LED flip-chip package substrate with high heat conductivity, high reflectivity, high stability and superior insulation and the LED package structure with high reliability and even high light extraction efficiency are obtained.

Abstract: An LED module has a controller with a modulator and illumination driver, and first and second LED chains. The first LED chain is connected to the modulator, has a first group of LED cells, and emits a first light under a pulse mode current input from the modulator. The first light has a digital data over a signal carrier. The second LED chain is connected to the illumination driver, has a second group of LED cells, and emits a second light under a constant current input from the illumination driver. There are fewer LED cells in the first group than the second group. The illumination driver is independent from the modulator in controlling emission of the first light. Alternatively, the LED module has a controller, an LED chain connected to the modulator, a first group of LED cells, and a second group of LED cells directly connected to the first group of LED cells.

Abstract: An embodiment of the invention discloses an optoelectronics system. The optoelectronic system includes an optoelectronic element having a top surface, a bottom surface, a plurality of lateral surfaces arranged between the top surface and the bottom surface, and a first electrode arranged on the bottom surface; a wavelength converting material covering a plurality of lateral surfaces; and a reflecting layer, formed on the wavelength converting material which is arranged on the top surface.

Abstract: An LED module has a controller with a modulator and illumination driver, and first and second LED chains. The first LED chain is connected to the modulator, has a first group of LED cells, and emits a first light under a pulse mode current input from the modulator. The first light has a digital data over a signal carrier. The second LED chain is connected to the illumination driver, has a second group of LED cells, and emits a second light under a constant current input from the illumination driver. There are fewer LED cells in the first group than the second group. The illumination driver is independent from the modulator in controlling emission of the first light. Alternatively, the LED module has a controller, an LED chain connected to the modulator, a first group of LED cells, and a second group of LED cells directly connected to the first group of LED cells.

Abstract: An embodiment of the invention discloses an optoelectronics system. The optoelectronic system includes an optoelectronic element having a first width; an adhesive material enclosing the optoelectronic element and having a second width larger than the first width; a phosphor structure formed between the optoelectronic element and the adhesive material; and a transparent substrate formed on the adhesive material.

Abstract: A carry-on luggage includes a housing composed of a right half shell and a left half shell, each half shell including a base layer made from a thermosetting polymeric material (TS) by molding and a protective layer made from a thermoplastic polymeric material (TP) and molded on the outer surface of the base layer. Thus, the housing of the carry-on luggage has excellent impact resistance and toughness.

Abstract: A fingerprint image acquisition device includes: a light source, a finger touching surface, a convex lens, an image sensor and a grating. The light source is a surface light source, and the grating is disposed on a light output surface of the light source. The light source is configured to emit a light beam, the grating is configured to change a propagation direction of the light beam to form a detection light beam, the finger touching surface is configured for a user to place a finger thereon to reflect the detection light beam and thereby obtain a reflected light beam, the convex lens is configured to focus the reflected light beam on the image sensor, and the image sensor is configured to generate a fingerprint image based on the focused reflected light beam. Accordingly, the invention can make the structure of the fingerprint image acquisition device be more compact.

Abstract: A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering pads are electrically connected to the first and the second electrodes respectively. Moreover, a first and a second grooves are defined on the first surface of the insulating substrate, the first and the second grooves are spaced from each other and disposed between the first and the second soldering pads. The invention further provides a LED flip chip package structure including the package substrate, a LED flip chip and fluorescent glue. The invention adds the grooves in the spacing between the soldering pads as a buffer space for melted solder flowing during reflow soldering process and therefore can relieve short-circuit phenomenon.

Abstract: The present disclosure provides methods, computer program products and apparatuses for text compression and decompression wherein a desired compression ratio may be obtained, and the compressed content per se is still in a searchable text form, thereby providing a possibility for searching without decompression and significantly saving storage space and enhancing search efficiency, and in turn, reducing the total cost ownership TCO and providing a better user experience.

Abstract: An embodiment of the invention discloses an optoelectronics system. The optoelectronic system includes an optoelectronic element having a first width; an adhesive material enclosing the optoelectronic element and having a second width larger than the first width; a phosphor structure formed between the optoelectronic element and the adhesive material; and a transparent substrate formed on the adhesive material.

Abstract: A wheel hub includes a wheel rim and a support. The wheel rim has an inner rim surface, an outer rim surface and a connection concave. The wheel rim is composed of a metallic layer and a carbon fiber layer. The outer rim surface has an outer wall to be the metallic layer. The wheel hub is composed of the metallic layer and the carbon fiber layer. Compared to the conventional wheel hub made of a single metallic material or a carbon fiber material, the wheel hub made of metal and carbon fiber of the present invention is light in weight, endurable, and cost-effective. The outer wall of the outer rim surface of the conventional wheel hub is easily to be damaged by an external force when in use, which result in a break of the carbon fiber to lose the strength of the carbon fiber.

Abstract: An integrated lighting apparatus comprises a first control device including a semiconductor substrate, an integrated circuit block formed above a first portion of the semiconductor substrate, and a plurality of power pads formed above the integrated circuit block; a first light emitting device formed above a second portion of the semiconductor substrate; and a through plug passing through the semiconductor substrate for electrically connecting the first control device and the first light emitting device.