Abstract: A high-efficiency mold temperature control system includes a dielectric heating module, a cooling module, and a flow control module. The dielectric heating module includes a heating circuit, a dielectric heater, a high-frequency power supply, a high-temperature heat medium storage tank, and a heat circulation pump. The cooling module includes a cooling circuit, a heat exchanger, a low-temperature heat medium storage tank, and a cold circulation pump. The flow control module includes multiple thermal switch valves and multiple cooling switch valves to control a high-temperature heat medium to the heating circuit or control a low-temperature heat medium to the cooling circuit. Through the design of the dielectric heating module, the high-temperature heat medium can be rapidly heated and the overall heating efficiency can be enhanced, thereby rapidly heating or cooling a mold and controlling the rapid heating and cooling of the mold.

Abstract: A piston pushing tool is provided, wherein the piston pushing tool includes: two arm members being connected to each other, and being relatively movable to be close to each other or to be far away from each other; and two push members configured to be inserted between two objects and connected to the two arm members respectively, the two push members being movable with the two arm members to push the two objects, at least one of the two objects being a piston.

Abstract: A tracking system and a device integrating an existing positional tracking system and a docking mechanism include a tracking system hardware module, a docking mechanism, and a positional tracking software module and are adapted to capture a user's finger movement and send in real time and synchronously the user's finger movement to a computer. The docking mechanism is compatible with an existing third-party positional tracking system such that the device can operate in conjunction with existing, commercially-available positional tracking systems, for example, HTC VIVE Tracker, and Oculus Quest, and thus is applicable to an existing game engine.

Abstract: A method of verifying an integrated circuit stack includes adding a first dummy layer to a first contact pad of a circuit, wherein a location of the first dummy layer is determined based on a location of a second contact pad of a connecting substrate. The method further includes converting the first dummy layer location to the connecting substrate. The method further includes adjusting the first dummy layer location in the circuit in response to a determination that the first dummy layer location is misaligned with the second contact pad. The method further includes performing a first layout versus schematic (LVS) check of the connecting substrate including the first dummy layer in response to a determination that the first dummy layer is aligned with the second contact pad.

Abstract: A high-speed connector includes an insulating housing, a first terminal assembly received in the insulating housing, a second terminal assembly received in the insulating housing, a third terminal assembly received in the insulating housing, and a fourth terminal assembly received in the insulating housing. The second terminal assembly is opposite to the first terminal assembly along an up-down direction. The third terminal assembly is disposed between the first terminal assembly and the second terminal assembly. The fourth terminal assembly is corresponding to the third terminal assembly. The fourth terminal assembly is disposed between the second terminal assembly and the third terminal assembly.

Abstract: A circuit, for a touch panel, comprises a plurality of touch signal processing circuits, coupled to a plurality of sensors of the touch panel to receive a plurality of touch signals, wherein when a first sensor within the plurality of sensors is touched, the first sensor generates a first touch signal of the plurality of touch signals; and a controller, coupled to the plurality of touch signal processing circuits, configured to adjust the first touch signal according to the plurality of touch signals except the first touch signal.

Abstract: A lamp assembly includes a lamp, a medium and an assembling piece. The medium is configured to connect the lamp to a carrier. The assembling piece is disposed between the lamp and the medium, and is configured to connect the lamp to the medium, wherein the assembling piece includes a first part and a second part. The first part is configured to non-threadedly connect the lamp with the medium. The second part is configured to release the lamp from the medium.

Abstract: A frequency offset (FO) estimation method includes: sampling a frequency-modulated repetition-coded segment of a packet to generate a plurality of samples; obtaining a frequency deviation (FD) value for each of a plurality of target samples selected from the plurality of samples; and estimating an FO value through accumulating complete FD values of the plurality of target samples.

Abstract: A method, a network device, and a non-transitory computer-readable storage medium are described in relation to a low latency, low loss, and scalable throughput (LI4S)-triggered prioritized connection service. The LI4S-triggered prioritized connection service may enable an evolved packet data gateway (ePDG) to provision prioritized and non-prioritized tunnels with end devices via untrusted wireless local area networks. The prioritized tunnel may support LI4S or another quality of service in which the ePDG may provide prioritized data forwarding. The end device may transmit a request that includes priority data.

Abstract: In a method for inspecting pattern defects, a plurality of patterns are formed over an underlying layer. The plurality of patterns are electrically isolated from each other. A part of the plurality of patterns are scanned with an electron beam to charge the plurality of patterns. An intensity of secondary electrons emitted from the scanned part of the plurality of patterns is obtained. One or more of the plurality of patterns that show an intensity of the secondary electrons different from others of the plurality of patterns are searched.

Abstract: A non-contact body temperature measuring device includes a temperature measuring unit, a Doppler radar, a processing unit, and a display unit. The temperature measuring unit measures a temperature of a human body in a non-contact manner. The Doppler radar emits radar waves to the human body and receives reflected radar waves. The processing unit, which is electrically connected to the temperature measuring unit and the Doppler radar, determines measurement spots on the human body based on the reflected radar waves, controls the temperature measuring unit to measure temperatures of the measurement spots, and generates a body temperature measuring value based on the temperatures of the measurement spots. The display unit is electrically connected to the processing unit for displaying the body temperature measuring value.

Abstract: An electrical connector includes an insulating body, a plurality of conductive terminals, a plurality of grounding terminals and two shielding elements. The plurality of the conductive terminals are mounted in the insulating body. The plurality of the grounding terminals are mounted in the insulating body. The plurality of the grounding terminals are located adjacent to two outer sides of the plurality of the conductive terminals. The two shielding elements are disposed at a front end of an upper surface and a front end of a lower surface of the insulating body. Each shielding element has a base frame. Two sides of a rear edge of the base frame are connected with two contact portions. The contact portions of the two shielding elements contact with the plurality of the grounding terminals.

Abstract: An automatic pipe clean system for massage bath equipment includes a bathtub, a water-filling pipe, a water-draining pipe, a suction pipe, a pump pipe, a pump connected between the suction pipe and the pump pipe, an automatic water-filling pipe, a water-filling valve and a controller. The controller is configured to: in a cleaning stage: turn on the pump to allow the water to pass and clean the suction pipe and the pump pipe; and in a drying stage: turn on the pump to allow the water to drain out from the suction pipe and the pump pipe; and turn off the pump.

Abstract: A connection pairing method is used to establish a wireless transmission connection between a first electronic device and a second electronic device. Each electronic device is capable of operating in a wireless network mode and/or a network hotspot mode. The connection pairing method includes disabling the network hotspot mode of the first electronic device, connecting the first electronic device to the hotspot of the second electronic device, and transmitting the hotspot connection information of the first electronic device to the second electronic device; upon receiving the hotspot connection information of the first electronic device, setting the second electronic device to wireless network mode and enabling the network hotspot mode of the first electronic device; and establishing a hotspot connection between the second electronic device and the first electronic device based on the hotspot connection information.

Abstract: A pixel package includes an electrode structure, a plurality of light-emitting units arranged on the electrode structure, and a light transmitting layer. The electrode structure has an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer. The electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer. In a top view of the pixel package, the first upper sheet is overlapped with and larger than the first lower sheet.

Abstract: A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.

Abstract: An NMOS structure includes a semiconductor substrate, a dielectric structure, a source doped region, a drain doped region, a channel region, a gate structure and two isolation P-type wells. The dielectric structure is formed in the semiconductor substrate to define an active region, in which the source/drain doped region and the channel region are formed. The channel region includes two opposite first sides and two opposite second sides. The source/drain doped region is respectively formed between the two second sides and the dielectric structure. The gate structure is formed on the semiconductor substrate. The gate structure covers a part of the dielectric structure beside the first sides. The two isolation P-type wells are formed in a part of the dielectric structure not covered by the gate structure. The isolation P-type wells respectively surround a periphery of the source/drain doped region and end at the respective second side.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer adjacent to the gate structure, wherein the first spacer comprises silicon carbon nitride (SiCN); forming a second spacer adjacent to the first spacer, wherein the second spacer comprises silicon oxycarbonitride (SiOCN); and forming a source/drain region adjacent to two sides of the second spacer.