Patents by Inventor Yuan Lu

Yuan Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11960845
    Abstract: Embodiments relate to decoding communications with token sky maps. At least one electronic communication including emoticons having a non-original meaning is received. A candidate meaning is determined for the emoticons having the non-original meaning in the at least one electronic communication based at least in part on token neighborhood distribution structures. The candidate meaning for the emoticons having the non-original meaning is caused to be displayed on at least one device.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: April 16, 2024
    Assignee: International Business Machines Corporation
    Inventors: Ziqiumin Wang, Qing Lu, Wei Jun Zheng, Xiao Feng Ji, Yuan Jin
  • Patent number: 11961912
    Abstract: The present application provides a semiconductor device and the method of making the same. The method includes recessing a fin extending from a substrate, forming a base epitaxial feature on the recessed fin, forming a bar-like epitaxial feature on the base epitaxial feature, and forming a conformal epitaxial feature on the bar-like epitaxial feature. The forming of the bar-like epitaxial feature includes in-situ doping the bar-like epitaxial feature with an n-type dopant at a first doping concentration. The forming of the conformal epitaxial feature includes in-situ doping the conformal epitaxial feature with a second doping concentration greater than the first doping concentration.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-An Lin, Wei-Yuan Lu, Feng-Cheng Yang, Tzu-Ching Lin, Li-Li Su
  • Publication number: 20240119862
    Abstract: A method, computer system, and a computer program product for syllable-based pronunciation help are provided. An input text in a first language may be received. A selection of a target language that is different from the first language may be received. From the target language, syllables with a pronunciation most closely matching a pronunciation of the input text in the first language are obtained. The obtaining is based on a comparison of one or more spectrograms for the input text with one or more spectrograms for text of the target language. The obtained syllables in the target language are presented.
    Type: Application
    Filed: September 28, 2022
    Publication date: April 11, 2024
    Inventors: Wei Jun Zheng, Xiao Xia Mao, QING LU, Yuan Jin, Xiao Feng Ji
  • Patent number: 11955416
    Abstract: A semiconductor structure is provided. The semiconductor structure comprises a substrate, a via, a liner layer, a barrier layer, and a conductor. The via penetrates through the substrate. The liner layer is formed on a sidewall of the via. The barrier layer is formed on the liner layer. The barrier layer comprises a conductive 2D material. The conductor fills a remaining space of the via.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: April 9, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Cheng-Hsien Lu, Yun-Yuan Wang, Dai-Ying Lee
  • Patent number: 11954296
    Abstract: A flexible capacitive tactile sensor is provided. The flexible capacitive tactile sensor may include a first flexible electrode layer, a second flexible electrode layer, and an ion gel thin film dielectric layer disposed between the first flexible electrode layer and the second flexible electrode layer. A first electrode array is disposed on the first flexible electrode layer. The first electrode array may include m series-connected electrodes parallel to a second direction. A second electrode array is disposed on the second flexible electrode layer. The second electrode array may include n series-connected electrodes parallel to a first direction. The first electrode array and the second electrode array may be disposed opposite to each other, and the first direction may be different from the second direction. The first electrode array, the second electrode array, and the ion gel thin film dielectric layer may form m×n electric double layer capacitors.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: April 9, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Yuan Dai, Peng Lu, Zhengyou Zhang, Chuanfei Guo
  • Patent number: 11947993
    Abstract: A computer-implemented method includes creating a first file control block in a primary runtime environment with a first addressing mode and a second file control block in a secondary runtime environment with a second addressing mode, where both the first file control block and the second file control block describe a status of a first file of a caller program in the primary runtime environment. The parameters of the first file of the caller program in the primary runtime environment are passed to a target callee program in the secondary runtime environment. An anchor is added in the first file control block as a link to the second file control block. The first file control block are the second file control block synchronized with updates to the first file in the primary runtime environment and the passed parameters of the first file in the secondary runtime environment.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 2, 2024
    Assignee: International Business Machines Corporation
    Inventors: Ming Ran Liu, Jing Lu, Naijie Li, Xiao Yan Tang, Yuan Zhai, Kershaw S. Mehta
  • Publication number: 20240107804
    Abstract: A display substrate and a display device are provided. The display substrate includes a display region including light emitting units; the light emitting units are arranged into light emitting unit rows, and the light emitting units in one of the light emitting unit rows are arranged along a first direction; the light emitting units include first light emitting units. In at least part of the display region: distances, in the first direction, between a light emitting region of one first light emitting unit and light emitting regions of two of the first light emitting units adjacent to the one first light emitting units are different, and/or distances, in a second direction, between a light emitting region of one first light emitting units and the light emitting regions of two of the first light emitting units adjacent to the one first light emitting units are different.
    Type: Application
    Filed: May 31, 2021
    Publication date: March 28, 2024
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Mingwen WANG, Yao HUANG, Xingliang XIAO, Zhong LU, Yuan CHEN, Yamei ZHOU, Yu SONG, Wei HU, Fuqiang LIN
  • Publication number: 20240096068
    Abstract: At least one computer processor can replace visual words of an unsupervised machine learning classification model with visual objects of an image. At least two co-occurring single visual objects adjacent to each other in pixels of the image can be combined to obtain a compound visual object. The unsupervised machine learning classification model can be augmented to model the image as a mixture of subjects, where each subject is represented through placements of the visual objects in a mixture of concentric spheres centering on a mixture of intersections on a mixture of horizontal layers. At least one processor can learn latent relationships between the placements of the visual objects in a three-dimensional space depicted in the image and image semantics. Learning the latent relationships trains the unsupervised machine learning classification model to perform image subject classification through the placements of the visual objects in a new image.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Ying Li, Fang Lu, Yuan Yuan Gong, Wen Ting Li, Shi Hui Gui, Xiao Feng Ji
  • Publication number: 20240096800
    Abstract: A semiconductor device includes first and second active regions extending in parallel in a substrate, a plurality of conductive patterns, each conductive pattern of the plurality of conductive patterns extending on the substrate across each of the first and second active regions, and a plurality of metal lines, each metal line of the plurality of metal lines overlying and extending across each of the first and second active regions. Each conductive pattern of the plurality of conductive patterns is electrically connected in parallel with each metal line of the plurality of metal lines.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: Fei Fan DUAN, Fong-yuan CHANG, Chi-Yu LU, Po-Hsiang HUANG, Chih-Liang CHEN
  • Patent number: 11935894
    Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fong-yuan Chang, Chun-Chen Chen, Po-Hsiang Huang, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao, Sheng-Hsiung Chen, Chin-Chou Liu
  • Publication number: 20240088027
    Abstract: An integrated circuit includes an inductor that includes a first set of conductors in at least a first metal layer, and a guard ring enclosing the inductor. The guard ring includes a first conductor extending in a first direction, a second conductor extending in a second direction, and a first set of staggered conductors coupled to a first end of the first conductor and a first end of the second conductor. The first set of staggered conductors includes a second set of conductors in a second metal layer, a third set of conductors in a third metal layer and a first set of vias coupling the second set of conductors with the third set of conductors. The third metal layer is above the second metal layer. All metal lines in the second metal layer that are part of the guard ring extend in the first direction.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Chiao-Han LEE, Chi-Hsien LIN, Ho-Hsiang CHEN, Hsien-Yuan LIAO, Tzu-Jin YEH, Ying-Ta LU
  • Publication number: 20240084455
    Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.
    Type: Application
    Filed: February 8, 2023
    Publication date: March 14, 2024
    Inventors: Che Wei YANG, Chih Cheng SHIH, Kuo Liang LU, Yu JIANG, Sheng-Chan LI, Kuo-Ming WU, Sheng-Chau CHEN, Chung-Yi YU, Cheng-Yuan TSAI
  • Publication number: 20240088030
    Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.
    Type: Application
    Filed: January 23, 2023
    Publication date: March 14, 2024
    Inventors: Chin-Liang CHEN, Chi-Yu LU, Ching-Wei TSAI, Chun-Yuan CHEN, Li-Chun TIEN
  • Publication number: 20240089873
    Abstract: Disclosed is a user equipment for satellite communication, comprising one or more processing circuits configured to execute the following operations: evaluating a transmission power requirement for a user equipment to communicate with a satellite; and assisting, via an auxiliary device, the user equipment in executing at least part of the communication with the satellite when the transmission power constraint of the user equipment fails to meet the transmission power requirement, wherein the processing circuits are further configured to acquire, via the satellite, a communication mode to be switched to, and the processing circuits transmit, to the satellite, a notification indicating that a current communication mode needs to be switched, with the notification comprising information indicating the need to switch to a communication mode that meets the transmission power requirement.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Sony Group Corporation
    Inventors: Yuan ZHANG, Penshun LU, Wenbo ZHANG, Hiromasa UCHIYAMA
  • Publication number: 20240071865
    Abstract: Packaged semiconductor devices including high-thermal conductivity molding compounds and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution structure; a first die over and electrically coupled to the first redistribution structure; a first through via over and electrically coupled to the first redistribution structure; an insulation layer extending along the first redistribution structure, the first die, and the first through via; and an encapsulant over the insulation layer, the encapsulant surrounding portions of the first through via and the first die, the encapsulant including conductive fillers at a concentration ranging from 70% to about 95% by volume.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 29, 2024
    Inventors: Xinyu Bao, Lee-Chung Lu, Jyh Chwen Frank Lee, Fong-Yuan Chang, Sam Vaziri, Po-Hsiang Huang
  • Publication number: 20240073100
    Abstract: Disclosed are an isolation method for a high-performance computer system, and a high-performance computer system. The isolation method comprises node-level isolation performed. The node-level isolation comprises: configuring a routing table for each computing node, and configuring, in the routing table, valid routing information for computing node pairs; when any one source computing node needs to communicate with a target computing node, determining, by lookup, whether valid routing information exists between the source computing node and the target computing node according to the configured routing table; if so, allowing the source computing node to communicate with the target computing node; otherwise, forbidding the source computing node from communicating with the target computing node.
    Type: Application
    Filed: June 27, 2023
    Publication date: February 29, 2024
    Applicant: NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY
    Inventors: Pingjing LU, Mingche LAI, Zeyu XIONG, Jinbo XU, Junsheng CHANG, Xingyun QI, Zhang LUO, Yuan LI, Yan SUN, Yang OU, Zicong WANG, Jianmin ZHANG
  • Publication number: 20240068043
    Abstract: Provided is a method for diagnosing and monitoring progression of cancer or effectiveness of a therapeutic treatment. The method includes detecting a methylation level of at least one gene in a biological sample containing circulating free DNA. Also provided are primer pairs and probes for diagnosis or prognosis of cancer in a subject in need thereof.
    Type: Application
    Filed: March 1, 2022
    Publication date: February 29, 2024
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Hsing-Chen TSAI, Chong-Jen YU, Hsuan-Hsuan LU, Shu-Yung LIN, Yi-Jhen HUANG, Chen-Yuan DONG
  • Patent number: 11916271
    Abstract: The present disclosure discloses a stable and high-capacity neutral aqueous redox flow lithium battery based on redox-targeting reaction and belongs to the technical field of flow lithium batteries. The present disclosure solves the technical problem that an existing flow battery can only work at low current density. The flow lithium battery of the present disclosure includes a positive electrode storage tank and a negative electrode storage tank; the positive electrode storage tank is filled with a positive electrolyte; and the negative electrode storage tank is filled with a negative electrolyte. The flow lithium battery is characterized in that the positive electrolyte includes a salt containing [Fe(CN)6]4? and/or [Fe(CN)6]3?, and the positive electrode storage tank is further filled with LFP particles and/or FP particles. The flow lithium battery of the present disclosure has wide application prospects in the field of large-scale energy storage.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: February 27, 2024
    Assignees: HARBIN INSTITUTE OF TECHNOLOGY, CHONGQING RESEARCH INSTITUTE OF HARBIN INSTITUTE OF TECHNOLOGY
    Inventors: Xiaohong Wu, Songtao Lu, Wei Qin, Xin Jia, Yuan Yao, Yang Li
  • Publication number: 20240061339
    Abstract: A photoresist apparatus and a method are provided. The photoresist apparatus includes a pre-baking apparatus. The pre-baking apparatus includes: a hot-plate, a first cover over the hot-plate, a second cover over the first cover, a first heating element extending along a topmost surface of the first cover, and a second heating element extending along a topmost surface of the second cover.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 22, 2024
    Inventors: Hung-Jui Kuo, De-Yuan Lu, Chen-Hua Yu, Ming-Tan Lee
  • Publication number: 20240042489
    Abstract: An automatic baggage-packing device for urban terminals based on artificial intelligence is provided. The automatic baggage-packing device includes a baggage transfer rack, baggage transfer rack forms a baggage transfer channel through a transfer stick, baggage transfer rack is equipped with several selectors located above the baggage transfer channel, the selectors are arranged in turn in the extension direction of the baggage transfer channel. The automatic baggage-packing device also includes an automatic loading device set outside of the baggage transfer rack to cooperate with the selectors to load the selected baggage. The invention has the effect of making baggage freight more convenient and quicker in use.
    Type: Application
    Filed: July 10, 2023
    Publication date: February 8, 2024
    Applicants: Beijing Urban Construction Design & Development Group Co., Limited, Heptagon 5A Design (Beijing) Co.,Ltd
    Inventors: Jinyan SHAO, Yuan LU, Yingjie LI, Hewu LU