Patents by Inventor Yuan Wang

Yuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SWITCHING RESISTANCE MEMORY DEVICES WITH INTERFACIAL CHANNELS
    Publication number: 20160225823
    Abstract: A switching resistance memory device with an interfacial channel includes a stack made of a layer of a first material and a layer of a second material. The layers form an interface, with the interface comprising the interfacial channel along which charged species can travel. A first electrode contacts a first edge of the stack, and a second electrode contacts a second edge of the stack.
    Type: Application
    Filed: September 16, 2013
    Publication date: August 4, 2016
    Inventors: Shih-Yuan Wang, Jianhua Yang, R. Stanley Williams
  • Memristor Structures
    Publication number: 20160218285
    Abstract: A memristor structure may be provided that includes a first electrode, a second electrode, and a buffer layer disposed on the first electrode. The memristor structure may include a switching layer interposed between the second electrode and the buffer layer to form, when a voltage is applied, a filament or path that extends from the second electrode to the buffer layer and to form a Schottky-like contact or a heterojunction between the filament and the buffer layer.
    Type: Application
    Filed: September 5, 2013
    Publication date: July 28, 2016
    Inventors: Shih-Yuan Wang, Jianhua Yang, Minxian Max Zhang, Alexandre M. Bratkovski, R. Stanley Williams
  • APPLICATION BACKUP AND RESTORE
    Publication number: 20160202923
    Abstract: The present invention discloses a method and apparatus. The method comprises: a method for backing up an application, the application running across multiple virtual machines, the method comprising: in response to a need of backing up the application, executing a first set of scripts that are used for, prior to the backup, coordinating the multiple virtual machines to enter into a preparation state; in response to the first set of scripts being executed completely, triggering a backup operation of at least one backup agent that manages the multiple virtual machines, the backup operation comprising the backup agent locating data related to the application on the respective virtual machines managed thereby; in response to completion of the backup operation, executing a second set of scripts that are used for restoring running of the multiple virtual machines.
    Type: Application
    Filed: April 11, 2014
    Publication date: July 14, 2016
    Inventors: Xiao Xi Liu, Yuan Wang, Jing Min Xu, Jian Ming Zhang
  • Scattering spectroscopy nano sensor
    Patent number: 9389186
    Abstract: A scattering spectroscopy nanosensor includes a nanoscale-patterned sensing substrate to produce an optical scattering response signal indicative of a presence of an analyte when interrogated by an optical stimulus. The scattering spectroscopy nanosensor further includes a protective covering to cover and protect the nanoscale-patterned sensing substrate. The protective covering is to be selectably removed by exposure to an optical beam incident on the protective covering. The protective covering is to prevent the analyte from interacting with the nanoscale-patterned sensing substrate prior to being removed.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: July 12, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gary Gibson, Zhiyong Li, Alexandre M. Bratkovski, Shih-Yuan Wang, Huei Pei Kuo, Steven J Barcelo, Zhang-Lin Zhou
  • HIGH-IMPACT-TOUGHNESS STEEL RAIL AND PRODUCTION METHOD THEREOF
    Publication number: 20160194730
    Abstract: The invention relates to a high-impact-toughness steel rail and a production method thereof, and belongs to the field of steel rail material production. The present invention is to provide a high-impact-toughness steel rail. The high-impact-toughness steel rail provided in the present invention is a pearlite steel rail with 0.05˜0.09 ?m of inter-lamellar spacing and 30˜35 J of ballistic work at normal temperature; the chemical components of the steel rail in weight percentage are: C: 0.71-0.82 wt %, Si: 0.25-0.45 wt %, Mn: 0.75-1.05 wt %, V: 0.03-0.15 wt %, P: ?0.030 wt %, S: ?0.035 wt %, Al: ?0.020 wt %, and Fe and inevitable impurities of the remaining content. The U-type impact toughness of rail head of the steel rail manufactured with the method disclosed in the present invention can be 30 J or more, and the tensile strength is about 1,300 MPa or higher.
    Type: Application
    Filed: January 7, 2016
    Publication date: July 7, 2016
    Applicants: PanGang Group Panzhihua Iron & Steel Research Institute Co., Ltd., Pangang Group Panzhihua Steel & Vanadium Co., Ltd.
    Inventors: Jun YUAN, Ming ZOU, Hua GUO, Dadong LI, Yong DENG, Zhenyu HAN, Yuan WANG, Chongmu CHEN
  • ELECTRICAL DEVICES WITH ENHANCED ELECTROCHEMICAL ACTIVITY AND MANUFACTURING METHODS THEREOF
    Publication number: 20160195489
    Abstract: In some aspects, a device is provided having a member with a region of enhanced electrochemical activity. In one aspect, a sensor of enhanced electrochemical activity is provided for detecting an analyte concentration level in a bio-fluid sample. The sensor may include a sensor member of a semiconductor material wherein the sensor member has a surface region of enhanced electrochemical activity. In other aspects, the member may be made of semiconducting foam having a surface region of enhanced electrochemical activity. In some embodiments, the region may be thermally-induced. Manufacturing methods and apparatus are also provided, as are numerous other aspects.
    Type: Application
    Filed: March 15, 2016
    Publication date: July 7, 2016
    Inventors: Steven C. Charlton, Serban Peteu, Steve Sun, Yuan Wang
  • Automatic water sprinkler regulator
    Patent number: 9380750
    Abstract: An automatic water sprinkler regulator is provided to control sprinkler coverage and times for water cycles. The regulator comprises control interface, series of control buttons, water inlet part, water outlet part, control processor. An improvement made in the present invention focuses on rendering a control interface with multiple approaches to control times for water cycles to make for a controller interface that can be set for irrigating by way of a series of control buttons.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: July 5, 2016
    Assignee: YUAN-MEI CORP.
    Inventor: King Yuan Wang
  • Measurement device with electroencephalography and electrocardiography functionalities
    Patent number: 9380957
    Abstract: A measurement device with electroencephalography (EEG) and electrocardiography (ECG) functionalities includes a shell and a turning structure. The shell includes a first contact and a second contact located at a first side of the shell; and a third contact. The turning structure, disposed on the shell, is utilized for adjusting the third contact to be located at the first side when the measurement device is in an EEG mode, and adjusting the third contact to be located at a second side of the shell when the measurement device is in an ECG mode, wherein the second side is substantially opposite to the first side.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: July 5, 2016
    Assignee: Wistron Corporation
    Inventors: Chi-Chan Chiang, Chia-Yuan Wang, Chia-Liang Lai, Ting-Wen Liu, Chun-Chih Lai
  • UPLINK DATA ROUTING DURING MULTIPLE CARRIER POWER IMBALANCE
    Publication number: 20160173226
    Abstract: In an aspect, this disclosure provides for determining a power imbalance between a first radio frequency (RF) carrier and a second RF carrier of a dedicated physical control channel for uplink transmission, determining whether the power imbalance is greater than a power imbalance threshold, and blocking data transmission on one of the first RF carrier or the second RF carrier when the power imbalance is greater than the power imbalance threshold.
    Type: Application
    Filed: July 9, 2015
    Publication date: June 16, 2016
    Inventors: Zae Yong CHOI, Omesh Kumar HANDA, Rami Hmeidan ALNATSHEH, Chaitanya SHAH, Yuan WANG, Luna Sapna D'SOUZA
  • Optoelectronic semiconductor device
    Patent number: 9362456
    Abstract: An optoelectronic semiconductor device includes a substrate, a semiconductor system having an active layer formed on the substrate and an electrode structure formed on the semiconductor system, wherein the layout of the electrode structure having at least a first conductivity type contact zone or a first conductivity type bonding pad, a second conductivity type bonding pad, a first conductivity type extension electrode, and a second conductivity type extension electrode wherein the first conductivity type extension electrode and the second conductivity type extension electrode have three-dimensional crossover, and partial of the first conductivity type extension electrode and the first conductivity type contact zone or the first conductivity type bonding pad are on the opposite sides of the active layer.
    Type: Grant
    Filed: September 24, 2012
    Date of Patent: June 7, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Wei-Yo Chen, Yen-Wen Chen, Chien-Yuan Wang, Min-Hsun Hsieh, Tzer-Perng Chen
  • Mirco-electro-mechanical system module and manufacturing method thereof
    Patent number: 9362257
    Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: June 7, 2016
    Assignee: RICHTEK TECHNOLOGY CORPORATION R.O.C.
    Inventors: Chiung-Cheng Lo, Yu-Fu Kang, Ning-Yuan Wang, Chiung-Wen Lin
  • Nozzle Adjustment Member for Sprinkler
    Publication number: 20160151792
    Abstract: A nozzle adjustment member for a sprinkler is revealed. A plurality of nozzle tubes aligned in at least one row is positioned on a wall of a hollow pipe. A top end of the nozzle tube is projecting to an outside of the hollow pipe. At least one pivot support is disposed on the outside of the hollow pipe. Each pivot support is pivoted with an adjustment piece having a plurality of guiding openings. The guiding openings are positioned over the plurality of nozzle tubes correspondingly. A nozzle cover is connected with the outside of the hollow pipe for covering the adjustment piece. A plurality of long through holes for mounting the corresponding nozzle tubes is arranged at the nozzle cover. Around a pivot hole, the adjustment piece swings so as to drive the plurality of nozzle tubes moving at an angle and different water distribution patterns are provided.
    Type: Application
    Filed: February 4, 2016
    Publication date: June 2, 2016
    Inventor: King-Yuan Wang
  • Nozzle Adjustment Member
    Publication number: 20160151793
    Abstract: A sprinkler adjustment member includes a plurality of nozzle tubes aligned in a sprinkler base. An adjustment piece is assembled with the sprinkler base. The adjustment piece controls and guide the plurality of nozzle tubes correspondingly and the adjustment piece swings so as to drive the plurality of nozzle tubes moving at an angle and different water distribution patterns are provided. The sprinkler base is pivotally disposed on a receiving member and for adjustment angle with a pendulum movement. A place base is connected with the receiving member and the receiving member is capable of pivoting on the place base, such that the sprinkler moves and tilts at multi-angles and multi-directions for providing various sprinkling patterns.
    Type: Application
    Filed: February 4, 2016
    Publication date: June 2, 2016
    Inventor: King-Yuan Wang
  • Thermally conductive clay
    Patent number: 9353245
    Abstract: The present invention is a thermally conductive clay including a carrier oil, a dispersant, a styrene polyolefin copolymer and thermally conductive particles.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: May 31, 2016
    Assignee: 3M Innovative Properties Company
    Inventors: Pei Tien, Chao-Yuan Wang, Mei-Chin Liao, Wei-Yu Chen
  • Semiconductor package and fabrication method thereof
    Patent number: 9356008
    Abstract: A semiconductor package is provided, which includes: a first semiconductor device having a first top surface and a first bottom surface opposite to the first top surface; a plurality of conductive balls formed on the first top surface of the first semiconductor device; a second semiconductor device having a second top surface and a second bottom surface opposite to the second top surface; and a plurality of conductive posts formed on the second bottom surface of the second semiconductor device and correspondingly bonded to the conductive balls for electrically connecting the first semiconductor device and the second semiconductor device, wherein the conductive posts have a height less than 300 um. Therefore, the present invention can easily control the height of the semiconductor package and is applicable to semiconductor packages having fine-pitch conductive balls.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: May 31, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Cheng-Chia Chiang, Hsin-Ta Lin, Fu-Tang Huang, Yu-Po Wang, Lung-Yuan Wang, Chu-Chi Hsu, Chia-Kai Shih
  • ROBOTIC FINGER STRUCTURE
    Publication number: 20160136822
    Abstract: A robotic finger structure is a section of a robotically controlled extension including a fingertip and a tactile sensor, the fingertip has a finger pulp, and the tactile sensor is integrated with the surface of the finger pulp. The tactile sensor configured to form a detecting area to accept and indicate any pressure on a plane perpendicular between the tactile sensor and an object; therefore the tactile sensor can feed back the force of pressure accurately, and control overall gripping force of the robotic finger.
    Type: Application
    Filed: November 18, 2015
    Publication date: May 19, 2016
    Inventors: MING-CHIEH CHANG, TE-HUA LEE, CHUN-YUAN WANG
  • Package on package structure and fabrication method thereof
    Patent number: 9343387
    Abstract: A package on package (PoP) structure is provided, which includes: a packaging substrate having a plurality of conductive bumps, wherein each of the conductive bumps has a metal ball and a solder material covering the metal ball; and an electronic element having a plurality of conductive posts, wherein the electronic element is stacked on the packaging substrate by correspondingly bonding the conductive posts to the conductive bumps, and each of the conductive posts and the corresponding conductive bump form a conductive element. The present invention facilitates the stacking process through butt joint of the conductive posts and the metal balls of the conductive bumps.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: May 17, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chu-Chi Hsu, Lung-Yuan Wang, Cheng-Chia Chiang, Chia-Kai Shih, Shu-Huei Huang
  • Semiconductor package and fabrication method thereof
    Patent number: 9343421
    Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a first substrate having a plurality of first conductive posts on a surface thereof and providing a second substrate having a third surface having a chip disposed thereon and a fourth surface opposite to the third surface; disposing the first substrate on the third surface of the second substrate through the first conductive posts; forming an encapsulant between the first substrate and the second substrate, wherein the encapsulant has a first surface adjacent to the first substrate and a second surface opposite to the first surface; and removing the first substrate, thereby effectively preventing solder bridging from occurring.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: May 17, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Lung-Yuan Wang, Cheng-Chia Chiang, Chu-Chi Hsu, Chia-Kai Shih, Shu-Huei Huang
  • MICROSTRUCTURE ENHANCED ABSORPTION PHOTOSENSITIVE DEVICES
    Publication number: 20160126381
    Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures arc described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.
    Type: Application
    Filed: May 22, 2014
    Publication date: May 5, 2016
    Inventors: Shih-Yuan WANG, Shih-Ping WANG
  • METHOD OF PREPARATION OF ANTIVIRAL COMPOUNDS AND USEFUL INTERMEDIATES THEREOF
    Publication number: 20160122381
    Abstract: The invention is directed to processes for synthesizing bicyclic nucleoside antiviral compounds and for synthesizing the intermediates used in the process. The invention is also directed to novel intermediate compounds useful in the process. The antiviral compounds are useful in the treatment of herpes zoster (i.e., varicella zoster virus, VZV, shingles) and for the prevention of post herpetic neuralgia (PHN) resulting from this viral infection.
    Type: Application
    Filed: January 8, 2016
    Publication date: May 5, 2016
    Inventors: Yanling Wang, Yuan Wang, Xungui He, Chuanjun Liu, Jirang Zhu, Jie Li, Qingzhong Cheng, Mingyong Yuan