Abstract: A hierarchical battery-management system mainly comprises a monitoring and equalizing module, an intermediary module, and a decision and communication module. The monitoring and equalizing module electrically couples with the battery cells, the intermediary modules electrically couple with the monitoring and equalizing module and the decision and communication module. The decision and communication module electrically couples with a power system or an electronic/electrical apparatus, and a hierarchical management structure constructed by the intermediary module to screen data and to transmit meaningful cell data to meet real time managing requirements of the large battery set.

Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a first substrate having a plurality of first conductive posts on a surface thereof and providing a second substrate having a third surface having a chip disposed thereon and a fourth surface opposite to the third surface; disposing the first substrate on the third surface of the second substrate through the first conductive posts; forming an encapsulant between the first substrate and the second substrate, wherein the encapsulant has a first surface adjacent to the first substrate and a second surface opposite to the first surface; and removing the first substrate, thereby effectively preventing solder bridging from occurring.

Abstract: This disclosure provides systems, methods, and apparatus related to optical microscopy. In one aspect, an apparatus includes a sample holder, a first objective lens, a plurality of optical components, a second objective lens, and a mirror. The apparatus may directly image a cross-section of a sample oblique to or parallel to the optical axis of the first objective lens, without scanning.

Abstract: According to an example, apparatuses for performing multiple concurrent spectral analyzes on a sample under test include an optical system to concurrently direct a plurality of light beams onto analytes at multiple locations on the sample under test, in which the plurality of light beams cause light in either or both of a Raman spectra and a non-Raman spectra to be emitted from the analytes at the multiple locations of the sample under test. The apparatuses also include a detector to concurrently acquire a plurality of spectral measurements of the light emitted from the analytes at the multiple locations of the sample under test. Example methods of performing spectral analysis include use of the apparatuses.

Abstract: The present invention is to provide a method applicable to a network system for automatically inserting an embedded toolbar into a web browser directly by way of a gateway device, wherein a toolbar request instruction written in a dynamic scripting language is inserted into a web page message by the gateway device while the web page message is transmitted from a web server to a terminal device (e.g., a personal computer, personal digital assistant, etc.) through the gateway device, so as to enable the web browser of the terminal device to request an embedded toolbar serve for providing an embedded toolbar message according to the toolbar request instruction and then show an embedded toolbar corresponding to the embedded toolbar message on a web page received from the web server according to the web page message. Thus, a user of the terminal device doesn't have to install the embedded toolbar additionally.

Abstract: The present invention provides compounds, pharmaceutical compositions and methods for the treatment of specific cancers. Such compositions may generally comprise a compound of formula (I): wherein R1-R3 are as defined herein, or pharmaceutically acceptable salts or esters thereof; and a pharmaceutically acceptable carrier.

Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.

Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

Abstract: An analyzer is disclosed herein. The analyzer encompasses a substrate having a surface with a plurality of distinct V-grooves formed therein. An input flow channel is configured to intersect and fluidly communicate with each of the plurality of distinct V-grooves at respective input points, and an output flow channel is configured to intersect and fluidly communicate with each of the plurality of distinct V-grooves at respective output points.

Abstract: Embodiments of the present invention are directed to storage systems for milk bags. A storage system for milk bags receives milk bags and management of the stored milk bags. The milk bags are stored in compartments for easy storage and retrieval.

Abstract: A container for storing semiconductor devices is revealed. The container includes a receiving body, a seal plate, and a cover. At least one fastener and at least one driver are mounted in the receiving body. The seal plate is fastened under the receiving body and against the driver so as to fix the driver on the receiving body. When the driver is rotated, the fastener is driven to move in the receiving body by the driver. At least one fixing part of the fastener is moved toward at least one fastening part of the cover. By the fixing part locked in the fastening part, the cover is fixed on the receiving body. Thus a force opposite to the rotating shaft will not be generated around a periphery of the driver. Therefore stability of the rotating driver is improved and the container is opened and closed smoothly.

Abstract: A method for a communication apparatus to align a frame boundary with a cell. A first time at which a predetermined synchronization signal is supposed to be received is determined after knowing a timing of the cell. The predetermined synchronization signal is a primary synchronization signal or a secondary synchronization signal. A second time at which the predetermined synchronization signal is actually received is determined. A first offset between the first time and the second time is determined. A timing of a local time base utilized by the communication apparatus according to the first offset is adjusted such that a frame boundary of the local time base and a frame boundary of the cell are aligned.

Abstract: A motor control device capable of executing a start mode that takes into consideration both the start performance with respect to a residual load and the life of a drive circuit is provided. A motor control device for executing a start mode in which a rotor is rotated by forced commutation control: stores a current value at the time when a stop command to a synchronous motor is issued; and decides, when a start command to the synchronous motor is issued after the issuance of the stop command, a target current value based on the stored current value in the start mode in response to the start command.

Abstract: MicroRNAs (miRNAs) are a class of non-coding small RNA molecules that regulate gene expression at the post-transcriptional level by interacting with 3? untranslated regions (UTRs) of their target mRNAs. The invention relates to the application of miR-192 and miR-215. Both of these miRNAs impact cellular proliferation through the p53-miRNA circuit, and interact with dihydrofolate reductase (DHFR) and thymidylate synthase (TS). Particularly, upregulation of these miRNAs reduces cellular proliferation. The invention relates to this discovery. For example, inhibiting miR-192 and/or miR-215 sensitizes a neoplasm or a subject with a neoplasm to chemotherapeutic agents. Furthermore, measuring the levels of miR-192 and/or miR-215 provides one with information regarding whether the neoplasm or subject will respond to chemotherapeutic agents. Accordingly, the invention relates to composition and methods relating to the identification, characterization and modulation of the expression of miR-192 and miR-215.

Abstract: A method for processing social network messages includes the following steps. Receive a specified web page request signal through a network from a client device. Acquire identification information of a first user account. Embed the identification information into an address of the specified web page to generate a first sharing linking address corresponding to the first user account. Post a sharing message on the personal-message-posting web page. Record operating information and corresponding operating time for at least one second user account when linking to the first sharing linking address. When the operation is sharing operation, embed identification information corresponding to the at least one second user account into the first sharing linking address, generate a second sharing linking address corresponding to the at least one second user account, and post the sharing message on the personal-message-posting web page of the at least one second user account.

Abstract: The present invention relates to a method of producing a water repelling surface or imparting hydrophobicity onto a surface comprises applying a polymer-based coating composition. The water repelling surface or the hydrophobic surface imparted by the present method has at least 90° of water contact angle. The water repelling surface or the hydrophobic surface imparted by the present method is preferably on a concrete surface. The present method imparts hydrophobicity onto surfaces that are durable without an additional primer layer between the surfaces and the coating composition.

Abstract: An electrochemical test sensor for detecting the concentration of an analyte in a fluid sample. The electrochemical test sensor includes a housing that has a first end and a second opposing end. The housing includes an opening at the first end to receive a fluid test sample. An electrode assembly includes a substrate, a working electrode, a counter electrode and a reagent. The substrate has a first surface and an opposing second surface. The working electrode is disposed on the first surface of the substrate, and the counter electrode is disposed on the second surface of the substrate. The electrode assembly is positioned within the housing to define a reaction channel. The electrochemical test sensor may be used with a removable lancet mechanism or integrated within a lancet mechanism to form one integral unit.

Abstract: A method for fabricating a semiconductor package is disclosed, which includes the steps of: providing a first substrate; disposing a second substrate on the first substrate through a plurality of supporting elements, wherein the second substrate has at least a cleaning hole penetrating therethrough; and performing a cleaning process to clean space between the second substrate and the first substrate through the cleaning hole, thereby preventing a popcorn effect from occurring when the first substrate is heated and hence preventing delamination of the semiconductor package. Further, the cleaning hole facilitates to disperse thermal stresses so as to prevent warping of the first and second substrates during a chip-bonding or encapsulating process, thereby overcoming the conventional drawbacks of cracking of the supporting elements and a short circuit therebetween.

Abstract: Technology is described that supports reduced program disturb of nonvolatile memory. A three/two dimensional NAND array includes a plurality of pages, which are divided into a plurality of page groups. Access is allowed to memory cells within a first page group of a plurality of page groups in an erase block of the three dimensional NAND array, while access is minimized to memory cells within a second page group of the plurality of page groups in the erase block of the three/two dimensional NAND array. Pages in the same page group are physically nonadjacent with each other in the three/two dimensional NAND array.

Abstract: A firmware burning method applied in a target device, which includes a storage unit, a target circuit, and a peripheral controller, connected to the storage circuit via a first communication link, is provided. The method include steps of: providing a test fixture having a first node, a second node, and a switch circuit connected across the first and second nodes, the first and second nodes being respectively coupled to the storage circuit and the target circuit; determining whether firmware of the target circuit satisfies a condition; if not, providing a second communication link between the target circuit and the storage circuit via the first and second nodes by turning on the switch circuit, and switching the peripheral controller to a disabled state; and updating the firmware of the target circuit according to to-be-burned firmware stored in the storage circuit via the second communication link.