Abstract: The present disclosure discloses a communication apparatus. A first signal path is electrically coupled to the signal co-processing circuit. A switch electrically couples a second signal path to the signal co-processing circuit under a merged communication state. A first signal amplifying circuit is electrically coupled between the signal co-processing circuit and a first antenna. A first signal transceiver circuit performs communication in a first frequency band with the first antenna through the first signal path, the signal co-processing circuit, the first signal amplifying circuit and the first antenna. A second signal transceiver circuit performs communication in a second frequency band with the first antenna through the second signal path, the signal co-processing circuit, the first signal amplifying circuit and the first antenna.

Abstract: A continuous microwave curing system, includes a heating cavity with a microwave power source and an inlet opening and an outlet opening on opposite sides; a first microwave suppression cavity, connected to the inlet opening of the heating cavity; a second microwave suppression cavity, connected to the outlet opening of the heating cavity; a conveyor belt, used to transport a laminated structure that needs to be heated by microwave power; wherein the laminated structure includes at least one adhesive and two layers of objects, the adhesive is placed between the two layers of objects. A continuous microwave curing process includes placing an adhesive between two layers of objects to form a laminated structure and using a conveyor belt to send the laminated structure into a heating cavity for heating with microwave power for a period of time, so that the temperature of the adhesive reaches above 60 degrees.

Abstract: An example connector assembly includes a guide shielding cage with a cage body and an upper heat sink bracket. The cage body includes upper window. A lower wall of the upper heat sink bracket is formed with a window corresponding to the upper window. The connector assembly also includes an upper heat sink module including a heat dissipating member. The heat dissipating member is capable of moving between a releasing position which is higher and an acting position which is lower relative to the upper insertion space. The cage body further includes fixing pieces positioned at two sides of the top wall and extend upwardly. The lower wall of the upper heat sink bracket engages with the fixing pieces of the cage body, and the upper heat sink bracket further comprises a latching piece which extends from the lower wall and latches into the top wall of the cage body.

Abstract: A semiconductor structure includes a semiconductor substrate and an interconnect structure on the semiconductor structure. The interconnect structure includes a first layer, a second layer over the first layer, a third layer over the second layer, and a fourth layer over the third layer. A first through via extends through the semiconductor substrate, the first layer, and the second layer. A second through via extends through the third layer and the fourth layer. A bottom surface of the second through via contacts a top surface of the first through via.

Abstract: An electronic device includes a casing, an exterior button, a sliding assembly and an internal button. The casing includes an outer surface and an opening at the outer surface. The exterior button has a first side and a second side opposite to each other, the first side is pivotally connected to the casing so that the exterior button is rotatably disposed at the casing. The sliding assembly is movably disposed on the casing, and includes a sliding body, a toggle and a pusher, the sliding body is located in the casing, the toggle is fixed to the sliding body and exposed to the casing, and the pusher is linked with the sliding body in a first direction, and is movably disposed at the sliding body in a second direction. The inner button is located in the casing, and the sliding assembly is located between the outer button and the inner button.

Abstract: Provided is a wall-mounted air conditioner, comprising a housing and a heat exchanger. An air duct is provided in the housing; the air duct comprises an air inlet and an air outlet; the air duct comprises an air inflow section and an air outflow section that are connected to each other; at least a portion of the air inlet is located on the front side of the housing; and the heat exchanger is disposed in the air duct. The air inflow section horizontally or obliquely extends forward from the air outflow section to form a first mounting space behind the air inflow section; and/or the portion of the air outflow section adjacent to the air outlet extends downward and forward from the remaining portion of the air outflow section to form a second mounting space behind the air outflow section.

Abstract: A data processing device includes a chassis and at least one electronic component. The chassis includes a casing and a tray disposed in the casing. The tray includes a tray body and an operating member pivotally connected to the tray body. The tray body has an accommodating space. When the operating member is located at a closed position, the operating member and the casing are locked, and the at least one electronic component is able to be accommodated in the accommodating space. When the at least one electronic component is removed from the accommodating space, the operating member is able to rotate from the closed position to an opened position located in the accommodating space to be unlocked from the casing, so as to allow the tray to be removed from the casing.

Abstract: A connector assembly is disclosed to include a shielding cage and a receptacle connector. The shielding cage forms at least one insertion space and a front end port communicatively coupled to the insertion space, the insertion space is defined by a top wall, a bottom wall and two side walls which cooperate with each other. The receptacle connector is provided to a rear segment of the shielding cage and includes a receptacle housing. The shielding cage further includes at least one stopping piece and at least one support stopping block which extend into the insertion space, the support stopping block is interposed between the stopping piece and the receptacle housing and supports the stopping piece. In another manner, the shielding cage may include a withdrawing stop portion and a rear stopping piece, the withdrawing stop portion is used to limit the receptacle housing to displace rearwardly, the rear stopping piece is used to stop the receptacle housing from behind the receptacle housing.

Abstract: Evaluating the performance of an X-ray tube by: recording arcing events that occurred during the use of the X-ray tube; classifying the arcing events by severity; generating, on the basis of the classified arcing events, a first growth pattern for occurrences of arcing events; and determining a level of bubbles in the X-ray tube by finding, on the basis of the first growth pattern, a matching second growth pattern associated with a known level of bubbles in the X-ray tube. An X-ray tube may be checked and replaced in a timely manner, without the need for an on-site inspection, by remotely predicting trends or patterns for growth of levels of bubbles in the X-ray tube.

Abstract: A benzoxazine resin, including a compound of the following Formula 1-1: where R1, R2, and R3 are as defined herein.

Abstract: Semiconductor devices, integrated circuits and methods of forming the same are provided. In one embodiment, a semiconductor device includes a metal-insulator-metal structure which includes a bottom conductor plate layer including a first opening and a second opening, a first dielectric layer over the bottom conductor plate layer, a middle conductor plate layer over the first dielectric layer and including a third opening, a first dummy plate disposed within the third opening, and a fourth opening, a second dielectric layer over the middle conductor plate layer, and a top conductor plate layer over the second dielectric layer and including a fifth opening, a second dummy plate disposed within the fifth opening, a sixth opening, and a third dummy plate disposed within the sixth opening. The first opening, the first dummy plate, and the second dummy plate are vertically aligned.

Abstract: A resin, including a compound having the following Formula 1-1: wherein n ranges from 1 to 5, and R1, R2, R3 and R4 are as defined herein.

Abstract: A device structure according to the present disclosure includes a metal-insulator-metal (MIM) stack that includes a plurality of conductor plate layers interleaved by a plurality of insulator layers. The MIM stack includes a first region and a second region and the first region and the second region overlaps in a third region. The MIM stack further includes a first via passing through the first region and electrically coupled to a first subset of the plurality of conductor plate layers, a second via passing through the second region and electrically coupled to a second subset of the plurality of conductor plate layers, and a ground via passing through the third region and electrically coupled to a third subset of the plurality of conductor plate layers.

Abstract: A structured material is provided that includes a substrate and a porous structured polymer layer disposed thereon. The porous structured polymer layer includes a plurality of voids, and has a high hemispherical reflectance a high a hemispherical thermal emittance. The structured material is thus particularly advantageous for cool-roof coatings, enabling surfaces coated by the material to stay cool, even under strong sunlight. The material can be produced via structuring of polymers in a mixture including a solvent and a non-solvent. Sequential evaporation of the solvent and the non-solvent provide a polymer layer with the plurality of voids.

Abstract: The present invention relates to antibodies that are specific for SARS-CoV-2. The present invention also provides methods of treatment, uses, pharmaceutical compositions and kits comprising the antibodies.

Abstract: A virtual circuit in a network device reformats one or more incoming data streams at a non-predetermined data rate into an outgoing data stream at a predetermined data rate, thereby allowing multiple data streams with non-predetermined data rates that are less than the predetermined data rate to be combined and output from a single network port.

Abstract: A method for managing network connections includes steps of: in response to receipt of a request for establishing a new network connection, storing in a connection-tracking (Conntrack) table an entry of tracked connection data that is related to the new network connection to be established, and updating a current tracked-connection count by adding one thereto; determining a priority level of the new network connection according to a data packet transmitted through the new network connection; and determining whether to output data packets that are received through the new network connection based at least on the current tracked-connection count and the priority level of the new network connection.

Abstract: A method of manufacturing a semiconductor device includes forming a first conductive layer over a first insulating layer and forming a first dielectric layer over the first conductive layer. A second conductive layer is formed over a first portion of the first dielectric layer. A second dielectric layer is formed over the second conductive layer. A third conductive layer is formed over the second dielectric layer and the second portion of the first dielectric layer. A third dielectric layer is formed over the third conductive layer. A first conductive contact is formed contacting the first conductive layer. A second conductive contact is formed contacting the third conductive layer. The second conductive layer is an electrically floating layer.

Abstract: A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.